• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.83-87
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• 2002

Plasma enhanced chemical vapor deposited (PECVD) silicon nitride ($SiN_X$) is widely used as a gate dielectric material for the hydrogenated amorphous silicon(a-Si:H) thin film transistors (TFT's). We investigated $SiN_X$ films were deposited PECVD at low temperature ($300^{\circ}C$). The reaction gases were used pure nitrogen and a helium diluted of silane gas(20% $SiH_4$, 80% He). Experimental investigations were carried out with the variation of $N_2/SiH_4$ flow ratios from 3 to 50 and the rf power of 200 W. This article presents the $SiN_X$ gate dielectric studies in terms of deposition rate, hydrogen content, etch rate and C-V, leakage current density characteristics for the gate dielectric layer of thin film transistor applications. Electrical properties were analyzed through high frequency (1MHz) C-V and current-voltage (I-V) measurements. The thickness and the refractive index on the films were measured by ellipsometry and chemical bonds were determined by using an FT-IR equipment.

• Clean Technology
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• v.4 no.1
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• pp.6-23
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• 1998

Recently, semiconductor industry has grown rapidly because of the large demand for electronic devices and equipment. The semiconductor industries have also played an important role on the economic growth in Korea. As the environmental regulations become strict, the proper environmental management and the well-developed waste minimization technologies in semiconductor industries are two of urgent problems to be solved. The semiconductor manufacturing process consists of a series of continuous chemical processes, such as cleaning, oxidation, diffusion, photolithography, etching and film deposition. During the processes, various environmentally hazardous wastes are produced. The wastes may be classified as wastewater, gaseous pollutants, and solid wastes. For waste minimization, the substitution of raw materials and process optimization techniques are used, while the selective destruction technologies of toxic chemicals contained in the wastes have been reported. Also, new technologies have been developed for source reduction and waste reduction, such as reduction of toxic chemical use and substitution of hazardous liquids with gaseous reactants or solvent.

• Journal of Technologic Dentistry
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• v.42 no.3
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• pp.208-212
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• 2020

Purpose: This study aimed to analyze the shrinkage and expansion strain of ultraviolet (UV)-cured resin according to the wavelength of the light source and compare the shrinkage and expansion. Methods: We prepared the mold with according to the ISO 4049 specimen. The size of the circle in the mold was prepared with a height of 6.02 mm and a diameter of 4 mm. UV-curable resin for three-dimensional (3D) printing was injected into the circular mold. The control group was irradiated with a wavelength of 400~405 nm using UV-curing equipment (400 group), and the experimental group was irradiated with a wavelength of 460~465 nm (460 group). Both groups were produced ten specimens. The produced specimen was first measured with a digital micrometer. After the first measurement, the specimen was immersed in a constant temperature water bath for 15 days, after which the second measurement was performed, and the third measurement was taken after 30 days. The measured values were analyzed using the independent sample t-test (α=0.05). Results: In the non-immersion water tank, the contraction was 0.9% in the 400 group and 1.3% in the 460 group. In the constant temperature bath, the expansion was high at -0.4% in the 400 group for 15 days, and the smallest expansion was -0.03% for the 400 group for 30 days. There were significant differences between the two groups (p<0.05). Conclusion: The 400 group had a lower UV resin specimen strain than the 460 group. Therefore, it is recommended to use the wavelength required by the UV-curing resin.

• Journal of Drive and Control
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• v.16 no.3
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• pp.51-58
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• 2019

The objective of this study was to investigate a simulation technology for the AM field based on ANSYS Inc.. The introduction of metal 3D printing AM process, and the examining of the present status of AM process simulation software, and the AM process simulation processor were done in the previous study (part 1). This present study (part 2) examined the use of the AM process simulation processor, presented in Part 1, through direct execution of Topology Optimization, Ansys Workbench, Additive Print and Additive Science. Topology Optimization can optimize additive geometry to reduce mass while maintaining strength for AM products. This can reduce the amount of material required for additive and significantly reduce additive build time. Ansys Workbench and Additive Print simulate the build process in the AM process and optimize various process variables (printing parameters and supporter composition), which will enable the AM to predict the problems that may occur during the build process, and can also be used to predict and correct deformations in geometry. Additive Science can simulate the material to find the material characteristic before the AM process simulation or build-up. This can be done by combining specimen preparation, measurement, and simulation for material measurements to find the exact material characteristics. This study will enable the understanding of the general process of AM simulation more easily. Furthermore, it will be of great help to a reader who wants to experience and appreciate AM simulation for the first time.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.3
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• pp.123-131
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• 2019

In this study, the development of transparent UV blocking material using $TiO_{2-x}$ oxide thin film process was developed. A process technology is related to a process technology for making a sample with ultraviolet-shielding property of visible light transmittance of 78 % or more (total light transmittance at 550 nm) and of a UV cut-off characteristic of more than 95 % at 315 nm in ultraviolet wavelength band. In this study, it is possible to establish a flexible device process condition of high performance ultraviolet (UV) shielding thin film, to design mixed type of transparent flexible device with heterogeneous characteristics and to formulate composite deposition technology, according to various market demands. Establishment of actual roll-to-roll continuous process and equipment and process technology will affect related industries greatly.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.7
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• pp.83-89
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• 2019

In the conventional casting and forging method, there is a disadvantage that a mold is an essential addition, and a production cost is increased when a small quantity is produced. In order to overcome this disadvantage, a metal 3D printing production method capable of directly forming a shape without a mold frame is mainly used. In particular, overseas research has been conducted on various materials, one of which is a metal printer. Similarly, domestic companies are also concentrating on the metal printer market. However, In this case of the conventional metal 3D printing method, it is difficult to meet the needs of the industry because of the high cost of materials, equipment and maintenance for product strength and production. To compensate for these weaknesses, printers have been developed that can be manufactured using sand mold, but they are not accessible to the printer company and are expensive to machine. Therefore, it is necessary to supply three-dimensional casting printers capable of metal molding by producing molds instead of conventional metal 3D printing methods. In this study, we intend to reduce the unit price by replacing the printing method used in the sand casting printer with the FDM method. In addition, Ag paste is used to design the output conditions and enable ceramic printing.

• Journal of Sensor Science and Technology
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• v.30 no.6
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• pp.388-394
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• 2021

The conventional microelectromechanical system (MEMS) process has been used to fabricate sensors with high costs and high-volume productions. Emerging 3D printing can utilize various materials and quickly fabricate a product using low-cost equipment rather than traditional manufacturing processes. 3D printing also can produce the sensor using various materials and design its sensing structure with freely optimized shapes. Hence, 3D printing is expected to be a new technology that can produce sensors on-site and respond to on-demand demand by combining it with open platform technology. Therefore, this paper reviews three standard 3D printing technologies, such as Fused Deposition Modeling (FDM), Direct Ink Writing (DIW), and Digital Light Processing (DLP), which can apply to the sensor fabrication process. The review focuses on strain/load sensors having both sensing material features and structural features as well. NCPC (Nano Carbon Piezoresistive Composite) is also introduced as a promising 3D material due to its favorable sensing characteristics.

• Journal of the Korean Vacuum Society
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• v.16 no.2
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• pp.79-90
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• 2007

Prototype of $800{\ell}$ vacuum web coater (Vic Mama) consisting of ion source with low energy less than 250 eV for high speed surface modification and 4 magnetron sputter cathodes was designed and constructed. Its performance was evaluated through fabricating the adhesiveless flexible copper clad laminate (FCCL). Pumping speed was monitored in both upper noncoating zone pumped down by 2 turbo pumps with 2000 l/sec pumping speed and lower surface modification and sputter zone vacuumed by turbo pumps with 450 1/sec and 1300 1/sec pumping speed respectively. Ion current density, plasma density, and uniformity of ion beam current were measured using Faraday cup and the distribution of magnetic field and erosion efficiency of sputter target were also investigated. With the irradiation of ion beams on polyimide (Kapton-E, $38{\mu}m$) at different fluences, the change of wetting angle of the deionized water to polyimide surface and those of surface chemical bonding were analyzed by wetting anglometer and x-ray photoelectron spectroscopy. After investigating the deposition rate of Ni-Cr tie layer and Cu layer was investigated with the variations of roll speed and input power to sputter cathode. FCCL fabricated by sputter and electrodeposition method and characterized in terms of the peel strength, thermal and chemical stability.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.21 no.4
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• pp.158-163
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• 2011

$CuInS_2$ thin films were prepared using a sol-gel spin-coating method. That makes large scale substrate coating, simple equipment, easy composition control available. The structural and optical properties of $CuInS_2$ thin films that include less toxic materials (S) instead of Se, tetragonal chalcopyrite structure. Copper acetate monohydrate ($Cu(CH_3COO)_2{\cdot}H2O$) and indium acetate ($In(CH_3COO)_3$) were dissolved into 2-propanol and l-propanol, respectively. The two solutions were mixed into a starting solution. The solution was dropped onto glass substrate, rotated at 3000 rpm, and dried at $300^{\circ}C$ for Cu-In as-grown films. The as-grown films were sulfurized inside a graphite container box and chalcopyrite phase of $CuInS_2$ was observed. To determine the optical properties measured optical transmittance of visible light region (380~770 nm) were less than 30 % in the overall. The XRD pattern shows that main peak was observed at Cu/In ratio 1.0 and its orientation was (112). As annealing temperature increases, the intensity of (112) plane increases. The unit cell constant are a = 5.5032 and c = 11.1064 $\AA$, and this was well matched with JCPDS card. The optical transmittance of visible region was below than 30 %.

• Journal of the Korean institute of surface engineering
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• v.47 no.1
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• pp.39-47
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• 2014

The peculiar feature of cathodic protection in seawater has the capability to form mineral calcareous deposits such as magnesium and calcium on metal surfaces. It is assumed that $OH^-$ ions are generated close to the metal surface as a result of cathodic protection and generated $OH^-$ ions increases the pH of the metal/seawater interface outlined as the following formulae. (1) $O_2+2H_2O+4e{\rightarrow}4OH^-$, or (2) $2H_2O+2e{\rightarrow}H_2+2OH^-$. And high pH causes precipitation of $Mg(OH)_2$ and $CaCO_3$ in accordance with the following formulae. (1) $Mg^{2+}+2OH^-{\rightarrow}Mg(OH)_2$, (2) $Ca^{2+}+CO{_3}^{2-}{\rightarrow}CaCO_3$. The focus of this study was to increase the amount of $CO{_3}^{2-}$ with the injection of $CO_2$ gas to the solution for accelerating process of the following formulae. (1) $H_2O+CO_2{\rightarrow}H_2CO_3$, (2) $HCO^{3-}{\rightarrow}{H^+}+CO{_3}^{2-}$. Electrodeposit films were formed by an electro-deposition technique on steel substrates in solutions of both natural seawater and natural seawater dissolved $CO_2$ gas with different current densities, over different time periods. The contents of films were investigated by scanning electron microscopy(SEM) and X-ray diffraction(XRD). The adhesion and corrosion resistance of the coating films were evaluated by anodic polarization. From an experimental result, only $CaCO_3$ were found in solution where injected $CO_2$ gas regardless of current density. In case of injecting the $CO_2$ gas, weight gain of electrodeposits films hugely increased and it had appropriate physical properties.