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Determination of the complex refractive index of $Ge_2Sb_2Te_5$ using spectroscopic ellipsometry (분광타원해석법을 이용한 $Ge_2Sb_2Te_5$ 의 복소굴절율 결정)

  • Kim, S. J.;Kim, S. Y.;Seo, H.;Park, J. W.;Chung, T. H.
    • Korean Journal of Optics and Photonics
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    • v.8 no.6
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    • pp.445-449
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    • 1997
  • The complex refractive indices of $Ge_2Se_2Te_5$ which show reversible phase change between the crystalline phase and an amorphous one depending upon the annealing process have been determined in the spectral range of 0.7-4.5 eV. The $Ge_2Se_2Te_5$ films were DC sputter deposited on the crystalline silicon substrate. The spectro-ellipsometry data of a thick film were analyzed following the modelling procedure where the quantum mechanical dispersion relation were used for the complex refractive indices of both the cryastalline phase $Ge_2Se_2Te_5$ and and amorphous phase $Ge_2Se_2Te_5$, respectively. On the other hand, with the surface micro-roughness layer whose effective thickness was determined from AFM analysis, the spectro-ellipsometry data were numerically inverted to yield the complex refractive index of $Ge_2Se_2Te_5$ at each wavelength. With these set of complex refractive indices, the reflectance spectra were calculated and those spectra obtained from the numerical inversion showed better agreement with the experimental reflection spectra for both the cryastalline phase and an amorphous phase. Finally, the thin $Ge_2Se_2Te_5$ film which has the optimum thickness of 26 nm as the medium for optical recording was also analyzed and the quantitative result of the film thickness and the surface microroughness has been reported.

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플라즈마 표면 처리를 이용한 ZnO 습식성장 패터닝 기술 연구

  • Lee, Jeong-Hwan;Park, Jae-Seong;Park, Seong-Eun;Lee, Dong-Ik;Hwang, Do-Yeon;Kim, Seong-Jin;Sin, Han-Jae;Seo, Chang-Taek
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.330-332
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    • 2013
  • 소 분위기에서 플라즈마 표면 처리의 경우 기판 표면에 존재하는 수소와 탄소 유기물들이 산소와 반응하여 $H_2O$$CO_2$ 등으로 제거되며 표면에 오존 결합을 유도하여 표면 에너지를 증가시키는 것으로 알려져 있다. ZnO 나노구조물을 성장시키는 방법으로는 MOCVD (Metal-Organic Chemical Vapor Deposited), PLD (Pulsed Laser Deposition), VLS (Vapor-Liquid-Solid), Sputtering, 습식화학합성법(Wet Chemical Method) 방법 등이 있다. 그중에서도 습식화학합성법은 쉽게 구성요소를 제어할 수 있고, 저비용 공정과 낮은 온도에서 성장 가능하며 플렉서블 소자에도 적용이 가능하다. 그러므로 본 연구에서는 플라즈마 표면처리에 따라 표면에너지를 변화하여 습식화학합성법으로 성장시킨 ZnO nanorods의 밀도를 제어하고 photolithography 공정 없이 패터닝 가능성을 유 무를 판단하는 연구를 진행하였다. 기판은 Si wafer (100)를 사용하였으며 세척 후 표면에너지 증가를 위한 플라즈마 표면처리를 실시하였다. 분위기 가스는 Ar/$O_2$를 사용하였으며 입력전압 400 W에서 0, 5, 10, 15, 60초 동안 각각 실시하였다. ZnO nanorods의 seed layer를 도포하기 위하여 Zinc acetate dehydrate [Zn $(CH_3COO)_2{\cdot}2H_2O$, 0.03 M]를 ethanol 50 ml에 용해시킨 후 스핀코팅기를 이용하여 850 RPM, 15초로 5회 실시하였으며 $80^{\circ}C$에서 5분간 건조하였다. ZnO rods의 성장은 Zinc nitrate hexahydrate [$Zn(NO_3)_2{\cdot}6H_2O$, 0.025M], HMT [$C6H_{12}N_4$, 0.025M]를 deionized water 250 ml에 용해시켜 hotplate에 올리고 $300^{\circ}C$에서 녹인 후 $200^{\circ}C$에서 3시간 성장시켰다. ZnO nanorods의 성장 공정은(Fig. 1)과 같다. 먼저 플라즈마 처리한 시편의 표면에너지 측정을 위해 접촉각 측정 장치[KRUSS, DSA100]를 이용하였다. 그 결과 0, 5, 10, 15, 60 초로 플라즈마 표면 처리했던 시편이 각각 Fig. l, 2와 같이 $79^{\circ}$, $43^{\circ}$, $11^{\circ}$, $6^{\circ}$, $7.8^{\circ}$로 측정되었으며 이것을 각각 습식화학합성법으로 ZnO nanorods를 성장 시켰을 때 Fig. 3과 같이 밀도 차이를 확인할 수 있었다. 이러한 결과를 바탕으로 기판의 표면에너지를 제어하여 Fig. 4와 같이 나타나며 photolithography 공정없이 ZnO nanorods를 패터닝을 할 수 있었다. 본 연구에서는 플라즈마 표면 처리를 통하여 표면에너지의 변화를 제어함으로써 ZnO nanorods 성장의 밀도 차이를 나타냈었다. 이러한 저비용, 저온 공정으로 $O_2$, CO, $H_2$, $H_2O$와 같은 다양한 화학종에 반응하는 ZnO를 이용한 플렉시블 화학센서에 응용 및 사용될 수 있고, 플렉시블 디스플레이 및 3D 디스플레이 소자에 활용 가능하다.

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Geological Comparison Between Musan Iron Deposit in North Korea and Iron Deposits in Anshan-Benxi Area in China (북한 무산 철광상과 중국 안산-번시 철광화대 지질학적 비교)

  • Kim, Namhoon;Koh, Sang-Mo;Lee, Bum Han
    • Journal of the Mineralogical Society of Korea
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    • v.31 no.3
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    • pp.215-225
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    • 2018
  • Musan iron deposit in North Korea and iron deposits in Anshan-Benxi area in China are Archean banded iron formations and included in Longgang block in Eastern block of North China Craton. Host formations of Musan iron deposit and Anshan-Benxi iron mineralized belt are Musan group and Anshan group, respectively. These groups consist of magnetite-bearing quartzite, amphibolite, schist, and migmatite. Host rock of banded iron formation in Musan deposit and Anshan-Benzi mineralized belt is magnetite-bearing quartzite. Shape of ore bodies in Musan deposit is horse's hoof due to the fold while shape of orebodies in Anshan-Benxi mineralized belt is layer. The previous studies revealed the both of banded iron formations are contemporaneously deposited during the late Archean (Musan deposit and iron deposits in Anshan-Benxi area: 2.66-2.52 Ga and 2.55-2.53 Ga, respectively). Musan deposit and iron deposits in Anshan-Benxi mineralized belt belolng to Algoma type BIFs. In conclusion, the characteristics of geology, formation ages, and deposit types of Musan deposit and Anshan-Benxi minerlized belt are very similar.

Fabrication and Analysis of Thin Film Supercapacitor using a Cobalt Oxide Thin Film Electrode (코발트 산화물 박막을 이용한 박막형 슈퍼 캐패시터의 제작 및 특성평가)

  • Kim, Han-Gi;Im, Jae-Hong;Jeon, Eun-Jeong;Seong, Tae-Yeon;Jo, Won-Il;Yun, Yeong-Su
    • Korean Journal of Materials Research
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    • v.11 no.5
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    • pp.339-344
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    • 2001
  • An all solid-state thin film supercapacitor (TFSC) with Co$_3$O$_4$/LiPON/Co$_3$O$_4$ structure was fabricated on Pt/Ti/Si substrate using Co$_3$O$_4$ thin film electrode. Each Co$_3$O$_4$ film was grown by reactive dc reactive magnetron sputtering with increasing $O_2$/[Ar+O$_2$] ratio. Amorphous LiPON electrolyte film was deposited on Co$_3$O$_4$/Pt/Ti/Si in pure nitrogen ambient by using reactive rf magnetron sputtering. The electrochemical behavior of the Co$_3$O$_4$/LiPON/Co$_3$O$_4$ multi-layer structures exhibits a behavior of a bulk-type supercapacitor, even though much lower capacity (from 5 to 25 mF/$\textrm{cm}^2$-$\mu\textrm{m}$) than that of the bulk one. It was found that the TFSC showed a fairly constant discharge capacity with a constant current of 50 $\mu\textrm{A}/\textrm{cm}^2$ at the cut-off voltage 0-2V during 400 cycles. It is shown that the electrochemical behavior of the Co$_3$O$_4$/LiPON/Co$_3$O$_4$ TFSC is dependent upon the sputtering gas ratio. The capacity dependency of electrode films on different gas ratios was explained by different structural, electrical, and surfacical properties.

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Finestructure and Function of Vas deferens in a freshwater Prawn Macrobrachium nipponense (징거미새우, Macrobrachium nipponense 수정관의 미세구조와 기능)

  • Kim Dae Hyun;Lee Jae Young;Jung Jee Hyun;Kang Jung Ha;Lee Bok Kyu;Han Chang Hee
    • Korean Journal of Fisheries and Aquatic Sciences
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    • v.35 no.4
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    • pp.424-430
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    • 2002
  • Vas deferens is a long tube and could be divided into four regions as its morphological characters: a short and slender proximal region, a convoluted region, a straight and more thick distal region, and an ejaculatory duct, It is connected with the posterior outer horns of the testis and runs to the gonopores opened on the coxa of the fifth walking legs, The proximal region consists almost entirely of simple cuboidal epithelial cells, $12\~28{\mu}$m in height, surrounded by a thin basal membrane. A small aggregation of high cuboidal epithelium is obsened from one side of the proximal region. The convoluted and distal region is composed of two kinds of epithelial cells; high cuboidal epithelial cells, $40\~120{\mu}m$ in height located in dorsal portion and simple cuboidal epithelial cells of $12\~28{\mu}$m in height located in ventral and lateral portion. The ejaculatory duct is surrounded with two kinds of muscle layers, inner longitudinal and outer circular muscle fibers, The lumen is lined with high and simple cuboidal epithelium in almost equal proportions. The proximal region contains mature sperm and basophilic substances. The eosinophilic substances appeared newly going toward the convoluted region and are laid along simple cuboidal epithelial cell layer. Tube-like content (spermatophore) of the vas deferens is ejaculated from a pair of genital pores at mating. Two masses of the content fuse together side by side and are usually deposited on the female thorax between the second and fourth or fifth pereiopods, The spermatophore formed measures $2.7\~4.0$ mm in length and $1.5\~2.7$ mm in width.

Characteristics of BDD electrodes deposited on Ti substrate with TiN interlayer (TiN 중간층을 삽입하여 Ti기판 위에 증착한 BDD전극의 특성 평가)

  • Kim, Sin;Kim, Seo-Han;Kim, Wang-Ryeol;Park, Mi-Jeong;Song, Pung-Geun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.157-157
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    • 2016
  • 최근 많은 산업의 발전으로 인해 환경오염을 유발시키는 폐수가 다량으로 배출되고 있으며, 이러한 폐수 속에는 유기용매, 고분자 물질 및 각종 염 등의 난분해성 물질들이 다량으로 함유되어 있다. 이런 물질들을 분해시키기 위해 물리적, 생물학적 수처리 방법이 많이 이용되고 있지만 이 방법들은 각각 운전비용과 처리비용이 고가인 단점이 있다. 따라서 비용과 효율 측면에서 효과적인 폐수처리를 위해서 전기화학적 폐수처리 방법이 많이 사용되고 있다. 물리적, 생물학적 처리 방법에 비해 비용이 적게 들고, 처리 후 잔류물이 남지 않으며. 독성을 띄는 산화제의 첨가 없이도 높은 폐수처리 능력을 보이기 때문에 친환경적이므로, 전기화학적 폐수산화 처리에 사용되는 불용성 전극에 대한 연구가 많이 진행되어져 오고 있다. 그 중 BDD(Boron-doped diamond) 전극은 표면에서 강력한 산화제인 수산화 라디칼의 높은 발생량으로 인해 뛰어난 폐수처리 능력을 보이므로 불용성 전극 분야에서 활발한 연구가 진행 중이다. 그러나 기존에 BDD 전극의 기판 모재로 이용되던 Si, W, Pb등은 모두 기계적 강도. 폐수처리 능력 및 독성 문제로 인해 한계가 있었고, 특히 Nb기판 위에 형성시킨 BDD 전극은 뛰어난 폐수처리 능력에도 불구하고 비싼 모재 원가로 인해 상용화가 힘든 실정이다. 이런 문제점을 해결하기 위해 높은 기계적 강도와 전기화학적 안정성을 가진 Ti 기판을 사용한 BDD 전극에 대한 연구가 보고되고 있다. 그러나 BDD와 Ti 간의 lattice mismatch, BDD층 형성을 위한 고온 공정 시 탄소의 확산으로 인한 기판 표면에서의 TiC층 형성으로 인해 접착력이 감소하여 박리가 생기는 문제점이 있다. BDD와 Ti의 접착력을 향상시키기 위해 융점이 높고, 전기전도성이 우수한 TiN을 diffusion barrier layer로 삽입하면 탄소 확산에 의한 TiC층의 생성을 억제하여, 내부응력에 기인한 접착력 감소를 방지할 수 있다. 또 하나의 방법으로 Ti 기판의 전처리를 통해 BDD층의 접착력을 향상 시킬 수 있다. Sanding과 etching을 통해 기판 표면의 물리, 화학적인 표면조도를 부여하고, seeding을 통해 diamond 결정 성장에 도움을 주는 seed 입자를 분포시킴으로써, 중간층과 BDD층의 접착력을 향상시키고, BDD 결정핵 성장을 촉진시켜 고품질의 BDD박막 증착이 가능하다. 본 연구에서는 기존 Si, Nb 등의 기판 모재를 Ti로 대체함으로써 제조원가를 절감시키고, TiN 중간층을 삽입하여 접착력을 향상시킴으로써 기존의 BDD 전극과 동등한 수준의 물성 및 수처리 특성을 가진 BDD전극 제작을 목표로 하였다. $25{\times}25mm$의 Ti 기판위에 TiN 중간층을 DC magnetron sputtering을 이용하여 증착 후, BDD 전극 층을 HFCVD로 증착하였다. 전처리를 진행한 기판과 중간층 및 BDD층의 미세구조를 XRD로 분석하였고, 표면 형상을 SEM으로 확인하였다. BDD전극의 접착력 분석을 통해 TiN 중간층의 최적 조성을 도출하고, 최종적으로 BDD/TiN/Ti 전극의 CV특성과 가폐수의 COD분해능력 및 축산폐수, 선박평형수 등의 실제 폐수 처리 능력을 BDD/Si, BDD/Nb 전극과 비교 검토할 것이다.

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Characterizations of CuInGaSe(CIGS) mixed-source and the thin film (CuInGaSe(CIGS)혼합 소스의 제작과 특성)

  • Lee, Ah-Reum;Jeon, Hun-Soo;Lee, Gang-Suok;Ok, Jin-Eun;Cho, Dong-Wan;Kim, Kyung-Hwa;Yang, Min;Yi, Sam-Nyeong;Ahn, Hyung-Soo;Cho, Chae-Ryong;Son, Sang-Ho;Ha, Henry
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.20 no.1
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    • pp.1-6
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    • 2010
  • CuInGaSe(CIGS) mixed-source was prepared by hydride vapor phase epitaxy (HVPE). Each metal was mixed in regular ratio and soaked at $1090^{\circ}C$ for 90 minutes in nitrogen atmosphere. After making the mixed-source to powder state, the pellet was made by the powder. The diameter of pellet is 10 mm. The CIGS thin film was deposited on soda lime glass evaporated Mo layer bye-beam evaporator. To confirm the crystallization, we measured X-ray diffraction (XRD). High intensity X-ray peaks diffracted from (112), (204)/(220), (116)/(312) and (400) of CIGS thin film and from (110) of Mo were confirmed by XRD measurement.

Study on the Effects of Corrosion Inhibitor According to the Functional Groups for Cu Chemical Mechanical Polishing in Neutral Environment (중성 영역 구리 화학적 기계적 평탄화 공정에서의 작용기에 따른 부식방지제의 영향성 연구)

  • Lee, Sang Won;Kim, Jae Jeong
    • Korean Chemical Engineering Research
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    • v.53 no.4
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    • pp.517-523
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    • 2015
  • As the aluminum (Al) metallization process was replaced with copper (Cu), the damascene process was introduced, which required the planarization step to eliminate over-deposited Cu with Chemical Mechanical Polishing (CMP) process. In this study, the verification of the corrosion inhibitors, one of the Cu CMP slurry components, was conducted to find out the tendency regarding the carboxyl and amino functional group in neutral environment. Through the results of etch rate, removal rate, and chemical ability of corrosion inhibitors based on 1H-1,2,4-triazole as the base-corrosion inhibitor, while the amine functional group presents high Cu etching ability, carboxyl functional group shows lower Cu etching ability than base-corrosion inhibitor which means that it increases passivation effect by making strong passivation layer. It implies that the corrosion inhibitor with amine functional group was proper to apply for 1st Cu CMP slurry owing to the high etch rate and with carboxyl functional group was favorable for the 2nd Cu CMP slurry due to the high Cu removal rate/dissolution rate ratio.

High Frequency Magnetic Characteristics of $Co_{90}Fe_{10}$ Thin Films and $Co_{90}Fe_{10}/SiO_2$ Multilayers ($Co_{90}Fe_{10}$ 박막 및 $Co_{90}Fe_{10}/SiO_2$ 다층박막의 고주파 자기특성)

  • 윤의중;진현준;박노경;문대철;김좌연
    • Journal of the Korean Magnetics Society
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    • v.8 no.5
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    • pp.300-307
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    • 1998
  • The $Co_{90}Fe_{10}$ single layer films were deposited on various substrates (glass, Si, polymide) using high vacuum RF magnetron sputtering system and nominall 1000 $\AA$ thick $Co_{90}Fe_{10}$ alloy films had a good high frequency characteristic. $M_S$ and $H_{an}$ values obtained from the B-H characteristic of the $10{\times}[100 nm \;Co_{90}Fe_{10}/100 nm\; SiO_2]$ multilayers agreed well with those obtained by calculation. Complex relative permeability $(={\{\mu}_r={\mu}_r',-j{\mu}$\mu$_r")$ at frequency f was measured from the transmission characteristics $(S_{11},\; S_{21}\;parameters)$ of the microstrip line which has a stacked structure consisting of sample magnetic films and a conductor and is connected to a network analyzer. The ${\mu}_r'-f$ characteristic was abtained from the megnetic absorption, which was analyzed from the S-parameter characteristics of the microstrip line. The ${\mu}_r'-f$ characteristic was also calculated from the ${\mu}_r"-f$-f characteristic using the Kramers-Kronig relation. The measurement results were confirmed to agree well with those obtained by calculations.culations.

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Fabrication of Piezoresistive Silicon Acceleration Sensor Using Selectively Porous Silicon Etching Method (선택적인 다공질 실리콘 에칭법을 이용한 압저항형 실리콘 가속도센서의 제조)

  • Sim, Jun-Hwan;Kim, Dong-Ki;Cho, Chan-Seob;Tae, Heung-Sik;Hahm, Sung-Ho;Lee, Jong-Hyun
    • Journal of Sensor Science and Technology
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    • v.5 no.5
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    • pp.21-29
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    • 1996
  • A piezoresistive silicon acceleration sensor with 8 beams, utilized by an unique silicon micromachining technique using porous silicon etching method which was fabricated on the selectively diffused (111)-oriented $n/n^{+}/n$ silicon subtrates. The width, length, and thickness of the beam was $100\;{\mu}m$, $500\;{\mu}m$, and $7\;{\mu}m$, respectively, and the diameter of the mass paddle (the region suspended by the eight beams) was 1.4 mm. The seismic mass on the mass paddle was formed about 2 mg so as to measure accelerations of the range of 50g for automotive applications. For the formation of the mass, the solder mass was loaded on the mass paddle by dispensing Pb/Sn/Ag solder paste. After the solder paste is deposited, Heat treatment was carried out on the 3-zone reflow equipment. The decay time of the output signal to impulse excitation of the fabricated sensor was observed for approximately 30 ms. The sensitivity measured through summing circuit was 2.9 mV/g and the nonlinearity of the sensor was less than 2% of the full scale output. The output deviation of each bridge was ${\pm}4%$. The cross-axis sensitivity was within 4% and the resonant frequency was found to be 2.15 KHz from the FEM simulation results.

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