• 제목/요약/키워드: deposit

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A Reliability Test for ph-free SnCu Plating Solution and It's Deposit (Sn-Cu 무연 도금용액 및 피막의 신뢰성평가)

  • Lee Hong-Kee;Hur Jin-Young
    • Journal of the Korean institute of surface engineering
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    • v.38 no.6
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    • pp.216-226
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    • 2005
  • Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. All products can divide at solder part and finishing part These can tested each and synthetically divide. This research is reliability evaluation for three kind of ph-free SnCu solder plating solution and it's deposit. First, executed analysis about Pure Sn, SnCu solutions and plating surface by way similar to other plating solution analysis. Next, executed reliability about test method and equipment for reliable analyzer system construction. Next, data comparison and estimation, main estimation test method and item's choice. In this paper the systematic surface analysis and reliability for plating solutions and it's deposit in metal surface finishing processes could be shown.

Cold spray technology as a potential additive manufacturing (3D 프린팅 공정 관점의 저온분사 기술)

  • Kim, Hyeong-Jun;Yun, Sang-Hun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.90-90
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    • 2017
  • Cold spray (Cold gas dynamic spray, kinetic spray) is the latest spray coating process that is known as solid state deposition process. In cold spray, inert gases (typically nitrogen and helium) accelerate powder particles prior to impact onto the substrate. Accelerating particles start to deposit onto the substrate after reaching certain critical velocities depending on the coating materials and substrate. Since process gas temperatures are kept below to melting temperature of the coating materials, it is possible to spray temperature sensitive materials such as copper and titanium, nanocrystal materials, and amorphous metals without affecting the phase change and oxide formation. It is also possible to deposit thick coatings because cold spray coatings present compressive residual stresses. This ability to deposit thick coatings is suitable to repair or rebuild parts as an additive manufacturing process. In this presentation, cold spray is introduced and compared to other additive manufacturing processes such as laser and electron beam based processes. It is also presented some applications especially in the view point of additive manufacturing process.

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Abnormal vibration of steam turbine due to carbon deposit at journal bearing in 500MW thermal power plant (탄소 고형물에 의한 터빈의 이상 진동)

  • 구재량;황재현;김연환;이우광
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2002.05a
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    • pp.234-238
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    • 2002
  • Lubricating oil supply system is an essential instrument for safe turbine operation. A lubricating condition may cause the abnormal vibration of turbine. In this paper we have discussed the abnormal vibration of turbine due to lubricating oil. Dusts of the air usually attach to end of the oil deflector and contact particles of the bearing oil. Dusts which were contacted particles of the bearing oil were changed into carbon deposit because of high temperature. therefore, carbon deposits occur abnormal vibration of the turbine when they contact a rotor. So, we have solved this problems through the various maintenance.

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Theoretical and Practical Aspects of Pb-Sn Alloy Plating (Pb-Sn 합금도금의 이론 및 실제적 경향)

  • Paik, Young-Nam
    • Journal of the Korean institute of surface engineering
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    • v.12 no.3
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    • pp.161-166
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    • 1979
  • Theoretical and practical aspects are investigated for electrochemical behavious, plating processes and the structures of electrodeposit of Pb-Sn binary alloy plating through numerous literatures in this report. The anodic and cathodic electrode reaction mechanisms of Pb and Sn could co-deposit and make Pb-Sn alloy deposit from the results of cathode current density-cathode potential curves of Pb, Sn and Pb-Sn alloys in fluoborate solutions. The compositions of the best alloy plating solutions are obtained for the purpose of bearing, anticorrosion and solder plating. In general, the casting anodes of Pb-Sn alloys are used, but separated anodes of Pb and Sn pure metal are used in order to obtain the fine compositions of Pb-Sn alloy deposits. The electrodeposits of Pb-Sn alloy are in nonequilibrium state and saturated solid solutions. Thus, ${\beta}$-phase (Sn-phase) is precipitated by heat treatment. The texture and structure of the electrodeposit are associated with the surface energies of deposit lattice planes and with the cathode polarization. The electrodeposit of Pb-Sn alloy is shown as lamellar structure.

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A Study on the Development of Legal Deposit System for National S&T Information Policy (과학기술정보 유통정책 효율화를 위한 납본제도 개선연구)

  • Yoon, Chong-Min
    • Journal of Information Management
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    • v.36 no.2
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    • pp.99-124
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    • 2005
  • In order to effectively establish the national S&T information system that consists of essential element in national competitiveness, it is necessary to make institutional devices for systematically and comprehensively collecting, managing and distributing S&T information resources at the national level. This paper aims to seek for alternatives to improve the legal deposit system, one of the institutional devices, on the basis of reviewing the existing laws and regulations.

A study on adhesion strength of electroless plated deposits on Alumina substrate (Alumina substrate 상의 무전해 도금층의 밀착력에 관한 연구)

  • 조용균;안균영;박용수
    • Journal of the Korean institute of surface engineering
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    • v.24 no.4
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    • pp.187-195
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    • 1991
  • Adhesion strength of electroless-plated Ni, Ni-P and Cu deposites on alumina substrate has been studied. Grain boundary spaces produced on the substrate surface by etching treatment provided anchoring sites for enhancing the adhesion strength. Adhesion strengths of Ni-P and Ni deposit were higher than that of Cu deposit, because of higher initial nucleation rates than the latter. The electroless-plated Ni-P and Ni underlayer improved the adhesion strength of the Cu deposit. In could be attributed to the enhanced adhesion between the substrate and those underlayers as well as the satisfactory adhesion between Cu deposits and those underlayers. Heat treatment was also conducted in order to enhance the adhesion strength of Cu layer. The strength was enhanced by about 19% when the treatment was conducted at $150^{\circ}C$ for 2 hours. The enhancement was attributed to relief of internal stress and release of hydrogen.

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The Effect of Complexing Agent on the Deposit Charateristics in the Electroless Nickel Plating Solution (무전해 니켈 도금액에서 착화제가 도금피막에 미치는 영향)

  • Jeon Jun-Mi;Koo Suck-Bon;Lee Hong-Kee;Park Hae-Duck;Shim Su-Sap
    • Journal of the Korean institute of surface engineering
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    • v.37 no.6
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    • pp.326-334
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    • 2004
  • Deposit charateristics of Electroless nickel(EN) were investigated with various complexing agents. As expected, the deposition rate of nickel is increased with pH and that of Phosphorous is decreased with pH. The result of SEM investigation shows that the rough surface crystallization is appeared with pH. It is show that the surface resistance of EN deposit is decreased with pH at 85$^{\circ}C$.

A Study of the Electroless Ni-W-B Depsition on Alumina Ceramics (Alumina Ceramics상의 무전해 Ni-W-B 도금에 관한 연구)

  • 유능희;강성군
    • Journal of the Korean institute of surface engineering
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    • v.22 no.4
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    • pp.161-167
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    • 1989
  • Effects of bath composition on electroless deposition of Ni-W-B from sulphate solution were invesrigated in terms of deposition kinetics, electro resistivity and composition of deposit film. The microstruigated and crystataine structure of the films were also studied using a scanning electron microscope and X-ray diffractometer. The deposition rate increased linearly with increasing the concentration of nickel sulphate in bath solution, wheras the rate decreasing with sodium citrate. The rate was also affected by sodium tungstate, which was maaximum at the concentration of 0.06 M/1 in sodium tungstate, The content of W in the deposit increased with increased with increasing the sodium citrate had on opposite effect on the composition of W and B in the deposit. The crystal change film from armorphous to cryatallicne nature by heat treatments was proved by the reduction of specific resistance and X-ray diffration.

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A Study on Metalliding of Al on Steel from Molten Fluorides (불화물계 용융염중에서 Steel 기지 소재의 Al 전해피복에 관한 연구)

  • 이민구;서길원;백영현
    • Journal of the Korean institute of surface engineering
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    • v.26 no.4
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    • pp.183-191
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    • 1993
  • Diffusion coating(metalliding) of aluminium on steel from molten fluorides(29.2wt.% LiF-11.7wt.% NaF-59.1wt.% KF, FLINAK) was studied. The electrolytic cell consists of a steel cathode and a consumable aluminium anode. Effects of manganese on the aluminium deposition were also investigated. The quality of the deposit was analyzed by SEM, OM, EPMA, EDXA, and also examined by means of Micro-Vickers hardness and corrosion tests. Deposit layer was identified as an aluminium-rich iron alloy caused by diffusion process. The optimum condition for the metalliding was found to be the current density, 50 to $150mA/\textrm{cm}^2$, the bath tem-perature, $57.5^{\circ}C$, and the amount of AlF3, 10wt.%. Addition of manganese fluoride (up to 5wt.%) as a co-de-posit element improved significantly the quality of the deposit layer.

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A Study on he Electroless Deposits and Electrodeposits (무전해 은도금층과 전기도금층의 형성에 관한 연구)

  • ;;;;Gerard P. Martins
    • Journal of the Korean institute of surface engineering
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    • v.33 no.4
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    • pp.273-280
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    • 2000
  • Silver was deposited on glass by electroless plating and electroplating. Surface properties were investigated using the AFM. Crystal structure of deposit layers was confirmed by TEM and XRD. Electroplating is performed by DC plating and pulse plating, respectively. This study resulted in followings, first, deposit of electroless plating showed fine grain and was similar to the amorphous structure. Second, electrodeposit on the electroless layer was revealed following results ; (1) more uniform layer and finer grains were obtained with increasing frequency (2) more isotropic structure was obtained with increasing frequency (3) finer grains at 25% duty cycle was obtained (4) grain size and roughness of the silver deposit was decreased with increasing frequency.

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