• Science of Emotion and Sensibility
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• v.13 no.4
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• pp.687-692
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• 2010

This paper surveys emission characteristics of Far-infrared of the fabrics fabricated with germanium imbedded sheath-core conjugate composite filaments. For this purpose, master batch chip was prepared with PET semi-dull chip and nano sized germanium particles and sheath-core type conjugate composite filament was spun using this master batch chip and polyester semi dull. The emission power and emissivity of the germanium imbedded fabrics were measured and investigated using FT-IR spectrophotometer by KICM- FIR 1005 measurement method. In addition, the fabric mechanical properties were measured and discussed with the effects of the optimum texturing process conditions and fabric structural design conditions. The sheath/core type PET composite germanium imbedded filaments were manufactured by the optimum spinning condition, its tenacity and breaking strain showed the same level as the regular PET filament. The tenacity and breaking strain of the DTY showed good physical properties and no problem in the weaving process. Then, wet and dry shrinkages showed higher values than those of regular PET filament. The emission power of the germanium imbedded fabric was $3.53{\times}10^2W/m^2$ at the $5-20{\mu}m$ wave length range, and emissivity was 0.874. The fabric hand of germanium imbedded fabrics was inhanced by the optimum texturing process and fabric structural design with improved mechanical properties such as fabric bending and compressional properties.

• Journal of the Institute of Convergence Signal Processing
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• v.14 no.3
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• pp.191-204
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• 2013

In this paper, we investigated the correlation outputs of Daejeon correlator at the viewpoints of the buffer memory setting related to the fine delay tracking and the under/overflow issue in FFT modules, in order to eliminate DC-like component and phase concentration to 0 degree. As the ring buffer memory is being used for the fine delay tracking, the DC-like component in correlation outputs is generated by improper setting of data read/write address, and then that address setting method is modified to exclude a polluted FFT segment in correlation processing when crossing the port/stream boundary. The phase concentration to 0 degree at beginning of bandpass is caused by inadequate scaling factors, which may be the origins of under/overflow occurred at internal computation of FFT stage. With the revised method of the ring buffer memory setting and the scaling factors in FFT, we could obtain higher signal-to-noise ratio and flux density, compared to the previous method, through the correlation processing of true observational data.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.28 no.3
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• pp.317-328
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• 2010

This paper describes the results of complete Bouguer anomalies computed from the Free-air anomalies that derived from Sandwell and DNSC08 marine gravity models. Complete bouguer corrections consist of three parts: the bouguer correction (Bullard A), the curvature correction (Bullard B) and the terrain correction (Bullard C). These all corrections have been computed over the East Sea on a $1'{\times}1'$elevation data (topography and bathymetry) derived from ETOPO1 global relief model. In addition, a constant topographic (sea-water) density of $2,670kg/m^3$($1,030kg/m^3$) has been used for all correction terms. The distribution of complete bouguer anomalies computed from DNSC08 are -34.390 ~ 267.925 mGal, and those from Sandwell are -32.446 ~ 266.967 mGal in East Sea. The mean and RMSE value of the difference between DNSC08 and Sandwell is $0.036{\pm}2.373\;mGal$. The highest value of complete bouguer anomaly are found around the region of $42{\sim}43^{\circ}N$ and $137{\sim}139^{\circ}E$ (has the lowest bathymetry) in both models. These values show that the gravity distribution of both models, DNSC08 and Sandwell, are very similar. They indicate that satellite-based marine gravity model can be effectively used to analyze the geophysical, geological and geodetic characteristics in East Sea.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Journal of Radiation Protection and Research
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• v.31 no.1
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• pp.47-52
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• 2006

A self-absorption correction is important issue for the exact radioactivity determination of gamma emitting radionuclides in environmental samples which have the range of apparent density from $0.3g/cm^3$ up to $1.5g/cm^3$. In this paper, a practical and simple method without radioactive standard solutions having various densities is proposed for the self-absorption correction of environmental samples by a developed outside beaker surrounding Marinelli beaker. For the densities of 0.8, 1.0, $1.3g/cm^3$, the corrected efficiencies by the new method and the measured those by radioactive standard solutions of the three densities showed good agreement within 4 %.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.42 no.1
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• pp.279-285
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• 2017

The study on 'support for V2V(Vehicle to Vehicle) services based on LTE sidelink' has been carried out in 3GPP RAN working group. The conventional LTE sidelink technology is not adequate for high speed V2V communications because the conventional DM-RS(Demodulation Reference signal) structure is developed for pedestrian environment. While the typical speed of pedestrian environment is 3km/h, that of V2V communications is 120 km/h and the information on channel estimation is not sufficient with legacy DM-RS structure. In this paper, improved DM-RS structures for V2V communications that have rapid channel variation are introduced and the performance of channel estimation accuracy is analyzed. Simulation results show that the performance improvement of channel estimation can be achieved based on extended sub-carrier spacing structure resulted from reduced inter-carrier interference. However, the extended sub-carrier spacing requires the longer cyclic prefix and higher overhead. As a results of considerations on DM-RS modification, the sub-carrier spacing is maintained and the high density of DM-RS is applied for V2V communications.

• Polymer(Korea)
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• v.37 no.1
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• pp.5-14
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• 2013

In this paper the effect of UV (ultraviolet) exposure on HDPE (high density polyethylene)-smooth and f-PP (flexible polypropylene) geomembranes is evaluated under UVB-313 (ultraviolet wavelength 290-315 nm) exposure. Tensile property, melt flow index (MFI), oxidation induction time (OIT), both standard-OIT and high pressure-OIT and Fourier transform infrared spectroscopy/attenuated total reflectance (FTIR/ATR) results are discussed. Although tensile properties of the exposed geomembrane samples remained unchanged, the depletion of antioxidants was found higher for f-PP than for HDPE geomembrane. Arrhenius model by extrapolation was used on the data to predict the antioxidant lifetime to a typical site temperature of $20^{\circ}C$. There was no significant difference between the MFI value of the virgin and UV exposed HDPE geomembrane samples but a decrease in MFI was found in f-PP geomembrane that signifies that crosslinking has occurred. From FTIR spectra, the small peak (near $1750\;cm^{-1}$) observed in the spectrum of UV exposed sample corresponds to a carbonyl (C=O) linkage, which suggests that oxidation has occurred in the polymer structure, and another new band for f-PP between 3100 and $3500\;cm^{-1}$ is attributed to a hydroxyl bond and/or hydroperoxide bond.

• Journal of the Korea Computer Graphics Society
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• v.17 no.3
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• pp.1-7
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• 2011

Recently, various researches have been proposed to accelerate GPU-based volume ray-casting. However, those researches may cause several problems such as bottleneck of data transmission between CPU and GPU, requirement of additional video memory for hierarchical structure and increase of processing time whenever opacity transfer function changes. In this paper, we propose an efficient GPU-based empty space skipping technique to solve these problems. We store maximum density in a brick of volume dataset on a vertex element. Then we delete vertices regarded as transparent one by opacity transfer function in geometry shader. Remaining vertices are used to generate bounding boxes of non-transparent area that helps the ray to traverse efficiently. Although these vertices are independent on viewing condition they need to be reproduced when opacity transfer function changes. Our technique provides fast generation of opaque vertices for interactive processing since the generation stage of the opaque vertices is running in GPU pipeline. The rendering results of our algorithm are identical to the that of general GPU ray-casting, but the performance can be up to more than 10 times faster.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38A no.9
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• pp.817-825
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• 2013

The UHDTV system, which provides realistic service with ultra-high definite video and multi-channel audio, has been studied as a next generation broadcasting service. Since the conventional digital terrestrial transmission system is not capable to cover the increased transmission data rate of the UHDTV service, there are great necessity of researches about increase of data rate. Accordingly, the researches has been studied to increase the transmission data rate of the DVB-T2 system using dual-polarized MIMO technique and high order modulation. In order to optimize the MIMO DVB-T2 system where irregular LDPC codes are used, it is necessary to study the design of the bit mapper that matches the LDPC code and QAM symbols in MIMO channel. However, the research related to the design of the bit mapper has been limited to the SISO system. Therefore, this paper defines a new parameter that indicates the VND distribution of MIMO DVB-T2 system and performs the performance analysis according to the parameter which will be helpful for designing a MIMO bit mapper.

• The KIPS Transactions:PartC
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• v.14C no.5
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• pp.417-424
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• 2007

Mesh networks using WLAN technology have been paid attention as a key wireless access technology. However, many technical issues still exist for its successful deployment. One of those issues is the routing problem that addresses the path setup through a WLAN mesh network for the data exchanges between a station and a wired network. Since the characteristics of a WLAN mesh network can be very dynamic, the use of single routing protocol would not fit for all environments whether it is reactive or proactive. Therefore, it is required to develop an adaptive routing protocol that modifies itself according to the changes in the network parameters. As a logical first step for the development, an analytical model considering all the dynamic features of a WLAN mesh network is required to evaluate the performance of a reactive and a proactive routing scheme. In this paper, we propose an analytical model that makes us scrutinize the impact of the network and station parameters on the performance of each routing protocol. Our model includes the size of a mesh network, the density of stations, mobility of stations. and the duration of network topology change. We applied our model to the AODV that is a representative reactive routing protocol and DSDV that is a representative proactive routing protocol to analyze the tradeoff between AODV and DSDV in dynamic network environments. Our model is expected to help developing an adaptive routing protocol for a WLAN mesh network.