• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.11
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• pp.231-237
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• 2014

In this paper, we have proceeded research for failures of semiconductor device stressed by Pressure Cooker Test(PCT). After PCT stress, we found various failures such as delamination between aluminium line and device layers and chemical composition transition of aluminium. We have executed the analysis using the physical and chemical observation equipments. There were the main failures that aluminium loss of aluminium pad is occurred and $Al_xO_y$($Al_2O_3$ or $Al(OH)_3$)) layer is formed abnormally. The primary cause of the failures is reaction of supplied fluorine or chlorine gases and infiltrated moisture during etching process.

• Journal of IKEEE
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• v.21 no.3
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• pp.252-255
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• 2017

$Mo_xW_{1-x}Si_2$ heaters were fabricated by self-propagating high-temperature synthesis (SHS) process and post sintering process. To validate the reliability of the $Mo_xW_{1-x}Si_2$ heaters, the accelerated life test (ALT) was conducted, and then lifetime to $Mo_xW_{1-x}Si_2$ heaters was estimated by using Minitab programs. Also, the failure analysis of $Mo_xW_{1-x}Si_2$ heaters after ALT was performed through electrical and structural properties. As the results, it was confirmed that the dominant failure mode of $Mo_xW_{1-x}Si_2$ heaters is the crack formation in heaters and the delamination of protective $SiO_2$ layers.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2017.05a
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• pp.939-941
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• 2017

The use of composites is increasing for lightweight aerospace structures. Among these structures, the ring frame and the parts of the projectile body are mainly made of a fiber reinforced composite material which is less susceptible such as delamination to structural damage. As the use of fiber reinforced composites increases, interest in modeling efficient methods of stiffness and strength is increasing. This paper predict the mechanical strength according to the repeating unit cell(RUC) of the 2-D triaxial braided composites of fiber reinforced composites. Yarn slice definition, incremental approach and stiffness reduction model were used as strength prediction. Finally, the results of strength prediction are verified by comparing with experimental data of 2-D triaxial braided composites specimens.

• KCI Concrete Journal
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• v.12 no.1
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• pp.57-68
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• 2000

The effect of structure size on the nominal strength of unidirectional fiber-polymer composites, failing by propagation of a kink band with fiber microbuckling, is analyzed experimentally and theoretically. Tests of novel geometrically similar carbon-PEEK specimens, with notches slanted so as to lead to a pure kink band (without shear or splitting cracks), are conducted. The specimens are rectangular strips of widths 15.875, 31.75. and 63.5 mm (0.625, 1.25 and 2.5 in and gage lengths 39.7, 79.375 and 158.75 mm (1.563, 3.125 and 6.25 in.). They reveal the existence of a strong (deterministic. non-statistical) size effect. The doubly logarithmic plot of the nominal strength (load divided by size and thickness) versus the characteristic size agrees with the approximate size effect law proposed for quasibrittle failures in 1983 by Bazant This law represents a gradual transition from a horizontal asymptote, representing the case of no size effect (characteristic of plasticity or strength criteria), to an asymptote of slope -1/2 (characteristic of linear elastic fracture mechanics. LEFM) . The size effect law for notched specimens permits easy identification of the fracture energy of the kink bandand the length of the fracture process zone at the front of the band solely from the measurements of maximum loads. Optimum fits of the test results by the size effect law are obtained, and the size effect law parameters are then used to identify the material fracture characteristics, Particularly the fracture energy and the effective length of the fracture process zone. The results suggest that composite size effect must be considered in strengthening existing concrete structural members such as bridge columns and beams using a composite retrofitting technique.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2003.05a
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• pp.284-288
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• 2003

This study was investigated the nondestructive characteristics of the damage caused by low-velocity impact on symmetric cross-ply laminates. These laminates were $[0^{\circ}/90^{\circ}]{_{16s,}}\;{_{24s,}}\;{_{32s,}}\;{_{48s}}$, that is, the thickness was 2, 3, 4 and 6 mm. The impact machine, model 8250 Dynatup Instron, was used a drop-weight type with gravity. The impact velocities used in experiment were 0.75, 0.90, 1.05, 1.20 and 1.35 m/sec. The load and deformation were increased as impact velocity increase. Even if the load increased with laminates thickness in same impact velocity, the deformation decreased. The extensional velocity was a quick as laminate thickness increase in same impact velocity and as impact velocity increase in same laminate thickness. In ultrasonic scans, damaged area was represented an dimmed zone. This is due to the fact that the wave, after having been partially reflected by the defects, has not enough energy to tough the oposite side or to come back from it. The damaged laminate areas were different according to the laminate thickness and the impact velocity. The extensional velocities became lower in if direction and higher in $0^{\circ}$ direction when the size of the defects increases. But, it was difficult to draw any conclusion for the extensional velocities in $45^{\circ}$ direction.

• Journal of Ocean Engineering and Technology
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• v.19 no.1 s.62
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• pp.39-43
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• 2005

The study investigated the nondestructive characteristics of damage, caused by law-velocity impact, on symmetric cross-ply laminates, composed of [0o/90o]16s, 24s, 32s, 48s. The thickness of the laminates was 2, 3, 4 and 6 mm, respectively. The impact machine used, Model 8250 Dynatup Instron, was a drop-weight type that employed gravity. The impact velocities used in this experiment were 0.75, 0.90, 1.05, 1.20 and 1.35 m/sec, respectively. Both the load and the deformation increased when the impact velocity was increased. Further, when the load increased with the laminate thickness in the same impact velocity, the deformation still decreased. The extensional velocity was quick, as the laminate thickness increased in the same impact velocity and the impact velocity increased in the same laminate thickness. In the ultrasonic scans, the damaged area represented a dimmed zone. This is due to the fact that the wave, after the partial reflection by the deflects, does not have enough energy to touch the opposite side or to come back from it. The damaged laminate areas differed, according to the laminate thickness and the impact velocity. The extensional velocities are lower in the 0o direction and higher in the 90o direction, when the size of the defect increases. However, it was difficult to draw any conclusion for the extensional velocities in the 45o direction.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.35-39
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• 2012

We studied interfacial reaction and bonding characteristics of a flip chip bonding with the viewpoint of formation behavior of intermetallic compounds. For this purpose, Sn-0.7Cu and Sn-3Cu solders were reflowed on the Al/Cu and Al/Ni UBMs. When Sn-0.7Cu was reflowed on the Al/Cu UBM, no intermetallic compounds were formed at the solder/UBM interface. The $Cu_6Sn_5$ intermetallic compounds formed by reflowing Sn-3Cu solder on the Al/Cu UBM were spalled from the interface, resulting in delamination of the solder/UBM interface. On the other hand, the $(Cu,Ni)_6Sn_5$ intermetallic compounds were formed by reflowing of Sn-0.7Cu and Sn-3Cu on the Al/Ni UBM and the interfacial bonding between the Sn-Cu solders and the Al/Ni UBM was kept stable.

• Journal of the Korean Society of Safety
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• v.31 no.3
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• pp.16-21
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• 2016

Carbon Fiber Reinforced Plastic(CFRP) composite with a higher specific strength and rigidity is more excellent than conventional metallic materials or other organic polymer of FRP. It has been widely used in vehicles, aerospaces and high technology industries which are associated with nuclear power fields. However, CFRP laminated composite has several disadvantages as like a delamination, matrix brittleness and anisotropic fibers that are the weak points of the crack initiation. In this present work, the reinforced silicon carbide(SiC) particles were added to the interlayer of CFRP laminates in order to mitigate the physical vulnerability affecting the cracking and breaking of the matrix in the CFRP laminated composite because of excellent specific strength and thermal shock resistance characteristics of SiC. The 1wt% of SiC particles were spread into the CFRP prepreg by using a spray coating method. After that, CFRP prepregs were laminated for the specimen. Also, the twill woven type CFRP prepreg was used because it has excellent workability. Thus the mechanical and fracture behaviors of the twill woven CFRP laminated composite reinforced with SiC particles were investigated with the acoustic emission(AE) method under a fracture test. The results show that the SiC particles enhance the mechanical and fracture characteristics of the twill CFRP laminate composite.

• Applied Microscopy
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• v.39 no.3
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• pp.277-281
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• 2009

Practical difficulties for preparing a good crosssectional specimen of GaN-based materials for transmission electron microscopy have arisen due to large difference of mechanical properties between hard ceramic substrate and soft GaN-layered materials. Uneven polishing, sudden cracking, delamination, and selective sputtering during the conventional wedge polishing technique are often encountered as experimental hindrances. The preparation technique based on Strecker's method can be applied to overcome these difficulties, which eventually leads to mechanically stable TEM samples independent of the mechanical properties of materials. The basic idea is to use hard ceramic dummy filler for embedding the sample of interest into the dummy frame. In this study, we applied this technique into preparing cross-sectional TEM specimen of the GaN-based materials with mechanical instability and demonstrated usefulness of this hard dummy filler method in which the possible modifications of the sample of interest during the preparation must be avoidable. In addition, practical precautions during the preparation were discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.523-524
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• 2007

This paper discusses the planarization process of thick copper film structure used for power supply device. Chemical mechanical polishing(CMP) has been used to remove a metal film and obtain a surface planarization which is essential for the semiconductor devices. For the thick metal removal, however, the long process time and other problems such as dishing, delamination and metal layer peeling are being issued, Compared to the traditional CMP process, Electro-chemical mechanical planarization(ECMP) is suggested to solve these problems. The two-step process composed of the ECMP and the conventional CMP is used for this experiment. The first step is the removal of several tens ${\mu}m$ of bulk copper on patterned wafer with ECMP process. The second step is the removal of residual copper layer aimed at a surface planarization. For more objective comparison, the traditional CMP was also performed. As an experimental result, total process time and process defects are extremely reduced by the two-step process.