• 대한전기학회논문지:시스템및제어부문D
• /
• 제54권6호
• /
• pp.383-389
• /
• 2005

This paper proposes a pattern classification algorithm for the defect distribution of Hard Disk Drive (HDD). In the HDD production, the defect pattern of defective HDD set is important information to diagnosis of defective HDD set. In this paper, 5 characteristics are determined for the classification to six standard defect pattern classes. A fuzzy inference system is proposed, the inputs of which are 5 characteristic values and the outputs are the possibilities that the input pattern is classified to standard patterns. Therefore, classification result is the pattern with maximum possibility. The proposed algorithm is implemented with the PC system for defective HDD sets and shows its effectiveness.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2005년도 제36회 하계학술대회 논문집 D
• /
• pp.2846-2848
• /
• 2005

This paper proposes a pattern classification algorithm for the defect distribution of Hard Disk Drive (HDD). In the HDD productions, the defect pattern of defective HDD set is important information to diagnosis of defective HDD set. In this paper, 5 characteristics are determined for the classification to six standard defect pattern classes. A fuzzy inference system is proposed, the inputs of which are 5 characteristic values and the outputs are the possibilities that the input pattern is classified to the standard patterns. Classification result is the pattern with maximum possibility. The proposed algorithm is implemented with a PC system for defective HDD sets and shows its effectiveness.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1998년도 추계학술대회 논문집
• /
• pp.17-20
• /
• 1998

Thermal behavior of Flow Pattern Defect (FPD) and Large Pit (LP) in Czochralski Silicon crystals was investigated by applying high temperature ($\geq$1100$^{\circ}C$) annealing and non-agitation Secco etching. For evaluation of the effect of LP upon device performance / yield, DRAM and ASIC devices were fabricated. The results indicate that high temperature annealing generates LPs whereas it decreases FPD density drastically, and LP does not have detrimental effects on the performance /

• 제어로봇시스템학회논문지
• /
• 제14권5호
• /
• pp.444-452
• /
• 2008

This paper presents an overall image processing approach of defect inspection of patterned TFT-LCD panels for the real manufacturing process. A prototype of AOI(Automatic Optical Inspection) system which is composed of air floating stage and multi line scan cameras is developed. Adjacent pattern comparison algorithm is enhanced and used for pattern elimination to extract defects in the patterned image of TFT-LCD panels. New region merging algorithm which is based on border expansion is proposed to identify defects from the pattern eliminated defect image. Experimental results show that a developed AOI system has acceptable performance and the proposed algorithm reduces environmental effects and processing time effectively for applying to the real manufacturing process.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2007년도 추계학술대회 논문집
• /
• pp.364-367
• /
• 2007

In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.

• 한국조경학회지
• /
• 제25권3호
• /
• pp.1-11
• /
• 1997

This study aims to estimate the relative importance of quality management items through the defect analysis in the landscape construction process. The RIQMI are decided by the defect coefficient and it's cause weight. The defect items in the landscape construction process were classified by 56 items based on the classification form of '96 landscape architectural construction standard and the cause pattern were categorized 4 types as design, material, construction, and environment factors. To analyze the defect coefficient and the aucse weight by defect, the researcher surveyed the questionnaires on the 103 engineers and the 31 experts on the landscape architectural construction. The result of this study are as follows. The relative importance by facilities pattern turn out to be much higher construction, material fator than design. environment factor in wood facilities, paving facilities, and steel facilities, the RIQMI is very high in timber crack, timber vending, faulty of timber against decay, welding faulty of steel facilities in material factor, and timber crack, faulty of timber against decay, finish faulty of steel facilities, welding faulty of steel facilities in construction factor.

• 제어로봇시스템학회논문지
• /
• 제22권4호
• /
• pp.247-252
• /
• 2016

In this paper, we propose a new defect detection technology for micro-defect on the surface of steel products. Due to depth and size of microscopic defect, slop of surface and vibration of strip, the conventional optical method cannot guarantee the detection performance. To solve the above-mentioned problems and increase signal to noise ratio, a novel retro-schlieren method that consists of retro reflector and knife edge is proposed. Moreover dual switching lighting method is also applied to distinguish uneven micro defects and surface noise. In proposed method, defective regions are represented by a black and white pattern. This pattern is detected by a defect detection algorithm with Gabor filter. Experimental results by simulator for sample defects of cold rolled steel show that the proposed method is effective.

• Journal of information and communication convergence engineering
• /
• 제10권3호
• /
• pp.295-299
• /
• 2012

Defect generation during organic bottom anti-reflective coating (BARC) in the photo lithography process is closely related to humidity control in the BARC coating unit. Defects are related to the water component due to the humidity and act as a blocking material for the etching process, resulting in an extreme pattern bridging in the subsequent BARC etching process of the poly etch step. In this paper, the lower limit for the humidity that should be stringently controlled for to prevent defect generation during BARC coating is proposed. Various images of defects are inspected using various inspection tools utilizing optical and electron beams. The mechanism for defect generation only in the specific BARC coating step is analyzed and explained. The BARC defect-induced gate pattern bridging mechanism in the lithography process is also well explained in this paper.

• 한국컴퓨터그래픽스학회논문지
• /
• 제29권3호
• /
• pp.79-84
• /
• 2023

이미지 생성 모델은 다양한 분야에 적용되어 데이터 부족 문제와 시간 및 비용 문제를 극복하고 있다. 그러나 규칙적 패턴 이미지에서의 이미지 생성과 해당 데이터의 결함 검출에는 한계를 가진다. 본 논문에서는 이미지 생성 모델의 패턴 이미지 생성의 가능성을 확인하고 OLED 패널의 결함 검출을 위한 데이터 증강에 적용하였다. OLED 결함 검출 모델을 학습하기 위해 필요한 데이터는 OLED 패널의 높은 비용 문제로 실제 데이터 세트를 확보하기 어렵다. 그렇기 때문에 해당 데이터 세트를 확보한다 하더라도 여러가지 결함 유형을 정의하고 분류하는 작업이 필요하다. 이를 위한 가상의 기반 데이터 세트를 획득할 OLED 패널 결함 데이터 획득 시스템을 소개하고, 이미지 생성 모델로 해당 데이터를 증강한다. 또, 확산모델에서의 패턴 이미지 생성의 어려움을 확인하여 가능성을 제안하고, 이미지 생성 모델 이용한 데이터 증강 및 결함 검출 데이터 증강의 제한 사항을 개선하였다.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
• /
• pp.1597-1599
• /
• 2007

In TFT-LCD, mura is a defect which degrades the display quality. The resistance difference between gate lines is the main cause of H-Block mura. Two methods could eliminate this defect. A thinner gate layer or gate fan-out pattern decrease mura level. H-Block mura has been reduced after implementing the new schemes.