Thermal behavior of Flow Pattern Defect and Large Pit in Czochralski Silicon Crystals and Their Effects on Device Yield.

Czochralski 법으로 제조된 실리콘 단결정 내의 Flow Pattern Defect와 Large Pit의 열적 거동 및 소자 수율에의 영향

Thermal behavior of Flow Pattern Defect (FPD) and Large Pit (LP) in Czochralski Silicon crystals was investigated by applying high temperature ($\geq$1100$^{\circ}C$) annealing and non-agitation Secco etching. For evaluation of the effect of LP upon device performance / yield, DRAM and ASIC devices were fabricated. The results indicate that high temperature annealing generates LPs whereas it decreases FPD density drastically, and LP does not have detrimental effects on the performance /