• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.7
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• pp.1261-1267
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• 2007

Although LEDs have been used in various applications with improving the brightness and luminous efficacy, the electrical and optical characteristics of high power LED varies at different temperature and starting time. In this paper, optimal heat sink and apparatus design were conducted using IR camera and ICEPAK on the LED bulb consisting with fourteen LED array. The temperatures of heat sink and LED device of the designed LED bulb without cooling pan were $74^{\circ}C\;and\;96.8^{\circ}C$, respectively, showing in good themal characteristics. For high efficiency driving circuit of LED array adopted optimal heat sink design, driving circuits of constant voltage and current circuits were suggested and fabricated. As a result the efficacy of all driving circuits showed more than 20 lm/W. Also, the constant current circuits are suitable for signal lamp, hallway lamp, and flash lamp having short operating time(about 30 min). On the other hand, a reading light and indoor lamp having long operating time can be controlled by constant voltage circuit.

• ETRI Journal
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• v.38 no.4
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• pp.645-653
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• 2016

This paper demonstrates the performance of a metal-substrate power module with multiple fabricated chips for a high current electrical application, and evaluates the proposed module using a 1.5-kW sinusoidal brushless direct current (BLDC) motor. Specifically, the power module has a hybrid structure employing a single-layer heat-sink extensible metal board (Al board). A fabricated motor driver IC and trench gate DMOSFET (TDMOSFET) are implemented on the Al board, and the proper heat-sink size was designed under the operating conditions. The fabricated motor driver IC mainly operates as a speed controller under various load conditions, and as a multi-phase gate driver using an N-ch silicon MOSFET high-side drive scheme. A fabricated power TDMOSFET is also included in the fabricated power module for three-phase inverter operation. Using this proposed module, a BLDC motor is operated and evaluated under various pulse load tests, and our module is compared with a commercial MOSFET module in terms of the system efficiency and input current.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.5
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• pp.3421-3425
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• 2015

In sensor networks, sensor nodes are usually distributed to manage the networks in continuous unique area, however as by the network property nodes can be located in several areas. The data gathering of distributed nodes to several areas can be different with current continuous area. Hence, the distributed networks can be differently managed to the current continuous networks. In this paper, we describe the data gathering of sensor nodes in distributed sensor areas. It is possible that sensor nodes cannot instantly connect the mobile sink, and the node operation should be considered. The real time data sending to the instant connection scheme of mobile sink can be implemented, but the property of mobile sink should be considered for the sink connection of distributed areas. In this paper, we analyze the proposed scheme by the simulation results. The simulation results show that the overall lifetime to the periodic data gathering method is longer than the threshold method.

• Journal of the Korean institute of surface engineering
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• v.51 no.6
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• pp.415-420
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• 2018

The possibility of an improvement in heat dissipation performance of aluminum alloy heat sink for shipboard LED luminaries through plasma electrolytic oxidation (PEO) was investigated. Four different PEO coatings were produced on aluminum alloy 5052 in silicate based alkaline solution by varying current density ($50{\sim}200mA/cm^2$). On voltage-time response curves, three stages were clearly distinguished at all current densities, namely an initial linear increase, slowdown of increase rate, and steady state(constant voltage). It was found that the increase in current density caused the breakdown voltage to increase. Two different surface morphologies - coralline porous structure and pancake structure - were confirmed by SEM examination. The coralline porous structure was predominant in the coatings produced at lower current densities (50 and $100mA/cm^2$) while under high current densities(150 and $200mA/cm^2$) the pancake structure became dominant. The coating thickness was measured and found to be in a range between about $13{\mu}m$ and $44{\mu}m$, showing increasing thickness with increasing current density. As a result, $100mA/cm^2$ was proposed as an effective process parameter to improve the heat dissipation performance of aluminum alloy heat sink, which could lower the LED operating temperature by about 30%.

• Journal of Information Processing Systems
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• v.15 no.3
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• pp.593-603
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• 2019

In wearable healthcare systems, sensor devices can be deployed in places around the human body such as the stomach, back, arms, and legs. The sensors use tiny batteries, which have limited resources, and old sensor batteries must be replaced with new batteries. It is difficult to deploy sensor devices directly into the human body. Therefore, instead of replacing sensor batteries, increasing the lifetime of sensor devices is more efficient. A transmission power control (TPC) algorithm is a representative technique to increase the lifetime of sensor devices. Sensor devices using a TPC algorithm control their transmission power level (TPL) to reduce battery energy consumption. The TPC algorithm operates on a closed-loop mechanism that consists of two parts, such as sensor and sink devices. Most previous research considered only the sink part of devices in the closed-loop. If we consider both the sensor and sink parts of a closed-loop mechanism, sensor devices reduce energy consumption more than previous systems that only consider the sensor part. In this paper, we propose a new approach to consider both the sensor and sink as part of a closed-loop mechanism for efficient energy management of sensor devices. Our proposed approach judges the current channel condition based on the values of various body sensors. If the current channel is not optimal, sensor devices maintain their current TPL without communication to save the sensor's batteries. Otherwise, they find an optimal TPL. To compare performance with other TPC algorithms, we implemented a TPC algorithm and embedded it into sensor devices. Our experimental results show that our new algorithm is better than other TPC algorithms, such as linear, binary, hybrid, and ATPC.

• 전자공학회논문지 IE
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• v.48 no.2
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• pp.12-18
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• 2011

In this paper, did numerical simulation to confirm LED module for lighting and protection against heat special quality of heat sink device. Analysis was gone dividing on case that emitting light side turns normalcy department considering that eat of device according to usage and case that turn down looking being street lamp of 200 W or security appointment lighting device analysis case, and also, volume of thermal element divides on big case and small case and analyzed. Confirmed that can do so that may discharge LED's thermal value to outside enough in analysis wave and current heat sink shape, and investigated that difference of protection against heat performance according to position of device and size of thermal element appears.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.10
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• pp.826-834
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• 2006

A heat sink system using nanofluidic thermosyphon for electronics systems was studied. The experimental results indicate that a cooling capacity of up to 150 W at an overall temperature difference of $50^{\circ}C$ can be attainable. The heat sink design program also showed that a computer simulation can predict the most of the parameters involved. In the experimental study, the volume concentration of nano particles affect the system performance. Nanofluidic thermosyphon with 0.5% volume concentration showed the best performance. Nanofluid can increase CHF of the system compared with water as a working fluid. The current simulation results were close to the experimental results in acceptable range. The simulation study showed that the design program can be a good tool to predict the effects of various parameters involved in the optimum design of the heat sink.

• Transactions on Electrical and Electronic Materials
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• v.18 no.2
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• pp.59-61
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• 2017

This research was analyzed thermal characteristics that was appointed disadvantage when smart LED driver ICs was packaged and we applied extracted thermal characteristics for optimal layout design. We confirmed reliability of smart LED driver ICs package without additional heat sink. If the package is not heat sink, we are possible to minimize package. For extracting thermal loss due to overshoot current, we increased driver current by two and three times. As a result of experiment, we obtained 22 mW and 49.5 mW thermal loss. And we obtained optimal data of 350 mA driver current. It is important to distance between power MOSFET and driver ICs. If the distance was increased, the temperature of package was decreased. And so we obtained optimal data of 3.7 mm distance between power MOSFET and driver ICs. Finally, we fabricated real package and we analyzed the electrical characteristics. We obtained constant 35 V output voltage and 80% efficiency.

• Journal of Korea Society of Digital Industry and Information Management
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• v.10 no.1
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• pp.39-45
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• 2014

This paper proposes an architecture of a sensor network for gathering data under a powerful beam cluster tree architecture. This architecture is used when there is a need to gather data from sensor node where there is no sink node connected to an existing network, or it is required to get a series of data specific to an event or time. The transmit distance of the beam signal is longer than that of the usual sensor node. The nodes of the network make a tree network when receiving a beam message transmitting from the powerful root node. All sensor nodes in a sink tree network synchronize to the superframe and know exactly the sequence value of the current superframe. When there is data to send to the sink node, the sensor node sends data at the corresponding allocated channel. Data sending schemes under the guaranteed time slot are tested and the delay and jitter performance is explained.

• Journal of Electrical Engineering and Technology
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• v.13 no.1
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• pp.379-386
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• 2018

A heat-sink has been widely used to cool down the heat generated from an electronic device, but it can bring unwanted electromagnetic radiation which may cause EMI problems. We propose a systematic method to reduce the electromagnetic radiation by using the multiple grounding technique based on the grounding criteria and the theory of characteristic mode analysis. Our proposed method provides the insight to find the specific grounding positions which can be effectively reduced the radiation from the heat-sink. Numerical experiments are accomplished to validate this approach.