• Journal of Dental Rehabilitation and Applied Science
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• v.19 no.3
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• pp.195-206
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• 2003

Several factors can affect the formation of bone tissues surrounding implants. One of the factors is electrical stimulation. It is known to change the movement of cells, form and destroy cells, and alter concentration and chemical component of soft tissues and bones. The effect of electrical stimulation on bone formation can vary according to the intensity of electric currents, stimulating time, the method of sending electric currents, and tissues and cells currents are applied to. This study examines how various enviroments affect osteoblasts. (1) effect on osteoblast with varying intensity of currents Osteoblast-like cells were raised on four plates where implants can be placed. A constant current sink (MC3T3-E1) that can adjust the intensity and stimulating time of electric currents was used. The four plates were stimulated with $0{\mu}A$, $10{\mu}A$, $20{\mu}A$, and $40{\mu}A$, respectively. After 24 hours of stimulation, the number and distribution of cells surrounding implants were examined. (2) effect on osteoblast with varying conditions The 3 study was performed with same method. (1) The change of attached cell number 72-hour after application of various currents (2) The change of attached cell number 72-hour after application of various interval (3) The comparison of attached cell number by implant surface texture The following are the results: 1. The distribution and density of cells surrounding implant is highest under the intensity of electric currents of $20{\mu}A$. 2. The number of cells attached implants is highest under the intensity of electric currents of $20{\mu}A$. 3. The number of cells attached implants is highest under continous electric currents 4. The number of cells attached implants is not different by implant surface texture.

• Korean Institute of Interior Design Journal
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• v.19 no.1
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• pp.217-225
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• 2010

As life quality have grown today, People have been greatly interested in health. Moreover, new knowledge and concepts are being applied in the medical facility field and that makes the field expand constantly. Hereby, this research is a study on design elements of dental clinics and the research goals are to understand interior design of current dental clinics by investigation and analysis on furniture, closing materials, colors and so on, and to investigate esthetic and functional environments for dental clinics through analyzing upcoming trends of inner spaces of dental clinics. The investigation was conducted by visits to four clinics per each research area, where are in Busan area and opened after year 2000 and are located in Seoul and Busan. Though the spaces of dental clinics vary according to the characteristics of each clinic, it generally has a consultation room, a waiting room and an X-ray room. The closing materials that make patients feel at ease are used in the waiting room, and ones that make patients feel tidy and fresh are used in consultation spaces, spare spaces, and management spaces. In Seoul area, antique and harmonic colors are used, and modernistic colors are used in Busan area. Reception desks, chair units, sofas and sink storage shelfs are the common furniture in the clinic. We have learned what are mentioned above by research and investigation on the component characteristics of dental clinic spaces. Based on these, more systematical and in-depth research should be continued.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.7
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• pp.1379-1385
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• 2009

We propose a low-power and high-speed client receiver for a mobile display digital interface (MDDI) newly in this paper. The low-power receiver is designed such that bias currents, sink and source currents, are insensitive to variations of power supply, process, temperature, and common-mode input voltage (VCM) and is able to operate at a rate of 450Mbps or above under the conditions of a power supply range of 3.0 to 3.6Vand a temperature range of -40 to 85$^{\circ}$C. And it is confirmed by a simulation result that the current dissipation is less than 500${\mu}$A. A test chip is manufactured with the Magna chip 0.35${\mu}$m CMOS process. When a test was done, the data receiver and data recovery circuits are functioning normally.

• Journal of the Korean Society of Safety
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• v.36 no.4
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• pp.12-19
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• 2021

This paper presents a safety assessment method for FTA-based induction heating systems; the failures and causes of electrical fire are first analyzed for each part and module qualitatively, and methods to manage high probabilities of failure and electrical fire are considered, thereby improving the reliability of the induction heating system. The cumulative importance value (ACC) of the minimal cut set is drawn by setting failure as the top event, and STACK and SMPS are observed to account for about 70% of the induction heating system failures. Thus, intensively managing the basic events contained in the minimal cut set of failures for STACK and SMPS is expected to provide effective and stable operation of the induction heating system. When electrical fire is set as the top event, the STACK percentage is 90%. Accordingly, the current IGBT is changed to a FET to increase the applied voltage and prevent induction heating system failure, and a heat sink plane is installed to prevent FET heating caused by switching, thereby preventing an electrical fire. By classifying the parts and modules of the induction heating system in detail and by applying FTA based on actual failure rates and relevant data, more practical and reasonable results may be expected. Hence, continuous research must be conducted to ensure safety when using induction heating systems.

• Korean Journal of Agricultural and Forest Meteorology
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• v.25 no.4
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• pp.346-358
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• 2023

Due to the acceleration of climate change or global warming, it is important to predict rice productivity in the future and investigate physiological changes in rice plants. The research aimed to explore how rice adapts to climate change by examining the response of nitrogen absorption and nitrogen use efficiency in rice under elevated levels of carbon dioxide and temperature, utilizing the SPAR system for analysis. The temperature increased by +4.7 ℃ in comparison to the period from 2001 to 2010, while the carbon dioxide concentration was held steady at 800 ppm, aligning with South Korea's late 21st-century RCP8.5 scenario. Nitrogen was applied as fertilizer at rates of 0, 9, and 18 kg 10a^-1, respectively. Under conditions of climate change, there was an 81% increase in the number of panicles compared to the present situation. However, grain weight decreased by 38% as a result of reduction in the grain filling rate. BNUE, indicative of the nitrogen use efficiency in plant biomass, exhibited a high value under climate change conditions. However, both NUEg and ANUE, associated with grain production, experienced a notable and significant decrease. In comparison to the current conditions, nitrogen uptake in leaves and stems increased by 100% and 151%, respectively. However, there was a 25% decrease in nitrogen uptake in the panicle. Likewise, the nitrogen content and NDFF (Nitrogen Derived from Fertilizer) in the sink organs, namely leaves and roots, were elevated in comparison to current levels. Therefore, it is imperative to ensure resources by mitigating the decrease in ripening rates under climate change conditions. Moreover, there seems to be a requirement for follow-up research to enhance the flow of photosynthetic products under climate change conditions.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.11
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• pp.46-54
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• 1998

A planar Bi-Sb multijunction thermal converter, which is consisted of a linear or bifilar thin film NiCr-heater and a thin film Bi-Sb thermopile, has been fabricated, and its ac-dc transfer characteristics were examined in a frequency range from 10 Hz to 10 KHz. In order to increase the thermal sensitivity and to decrease the ac-dc transfer error of a thermal converter, the heater and the hot junctions of a thermopile were prepared on a Si$_3$N$_4$/SiO$_2$/Si$_3$N$_4$-diaphragm which acts as a thermal isolation layer, and the cold junctions on the Si$_3$N$_4$/SiO$_2$/Si$_3$N$_4$-thin film supported with the silicon rim which functions as a heat sink. The respective thermal sensitivities in air and in a vacuum of the converter with a built-in bifilar heater were about 14.0 ㎷/㎽ and 54.0 ㎷/㎽, and the ac-dc voltage and the current transfer difference ranges in air were about $\pm$0.60 ppm and $\pm$0.11 ppm, respectively, indicating that the ac-dc transfer accuracy of the converter are much higher than that of a commercial 3-dimensional multijunction thermal converter. However, the output thermoelectric voltage fluctuation of the converter was rather high.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.31 no.5A
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• pp.459-468
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• 2006

Current routing in sensor networks focuses on finding methods for energy-efficient route setup and reliable relaying of data from the sensors to the sink so that the lifetime of the network is maximized. The existing routing protocols do not have routing tables to determine a path when packets are transferred. A sensor network by a routing table increases a cost of maintaining and updating a path, because sensor nodes have characteristics to be mobile and constrained capacity and resources. This paper proposes a new routing algorithm by broadcasting a bitmap in order to reduce the number of messages transferred when routing paths are established. Each node has a routing table with a bitmap, which contains link information. A bitmap is formed two-dimensional array, which consists of each row and column represented with a bit. The node only updates its own bitmap if it receives a bitmap from another adjacent nodes after the broadcasting. There by, each node has a bitmap with partial links information not total links information on the network. The proposed routing algorithm reduces the number of messages for routing establishment at least 10% compared with the previous algorithms.

• Journal of the Korean earth science society
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• v.37 no.1
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• pp.62-77
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• 2016

In the early model of plate tectonics, the plate was depicted as a passive raft floating on the convecting mantle and carried away by the mantle flow. At the same time, ridge push at spreading boundaries and drag force exerted by the mantle on the base of lithosphere were described as the dominant driving forces of plate movements. However, in recent studies of plate tectonics, it is generally accepted that the primary force driving plate motion is slab pull beneath subduction zones rather than other forces driven by mantle convection. The current view asserts that the density contrast between dense oceanic lithosphere and underlying asthenosphere is the substance of slab pull. The greater density of oceanic slab allows it to sink deeper into mantle at trenches by gravitational pull, which provides a dominant driving force for plate motion. Based on this plate tectonics development, this study investigated the contents of plate tectonics in high school Earth Science textbooks and how they have been depicted for the last few decades. Results showed that the early explanation of plate movement driven by mantle convection has been consistently highlighted in almost all high school textbooks since the 5th curriculum, whereas most introductory college textbooks rectified the early theory of plate movement and introduced a newly accepted theory in revised edition. Therefore, we suggest that the latest theory of plate tectonics be included in high school textbooks so that students get updated with recent understanding of it in a timely manner.

• Journal of the Korea Society of Computer and Information
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• v.16 no.9
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• pp.1-10
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• 2011

Unfortunately, in current microprocessors, increasing the frequency causes increased power consumption and reduced reliability whereas it improves the performance. To overcome the power and thermal problems in the singlecore processors, multicore processors has been widely used. For 2D multicore processors, interconnection is regarded as one of the major constraints in performance and power efficiency. To reduce the performance degradation and the power consumption in 2D multicore processors, 3D integrated design technique has been studied by many researchers. Compared to 2D multicore processors, 3D multicore processors get the benefits of performance improvement and reduced power consumption by reducing the wire length significantly. However, 3D multicore processors have serious thermal problems due to high power density, resulting in reliability degradation. Detailed thermal analysis for multicore processors can be useful in designing thermal-aware processors. In this paper, we analyze the impact of workload distribution, distance to the heat sink, and number of stacked dies on the processor temperature. We also analyze the effects of the temperature on overall system performance. Especially, this paper presents the guideline for thermal-aware multicore processor design by analyzing the thermal problems in 2D multicore processors and 3D multicore processors.

• Korean Journal of Materials Research
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• v.4 no.2
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• pp.143-151
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• 1994

On PT/Ti/Si substrates, PZT thln fllms are deposited at $300^{\circ}C$ by rf magnetron sputtering uslng a $(PbZr_{52}, Ti_{48})O_{3}$ composltc cerarnlc target. To abtaln, the stable phase, perovskltc structure, furnace annealmg techmque had been cmplo:~d In PbO amb~ent for the $550^{\circ}C$-$750^{\circ}C$ temperature ranges. On Pt(250$\AA$)/Ti(500$\AA$)/Si, Pt(1000)$\AA$/Ti(500$\AA$)/Si substrates, effects of Ti layer and Pt thickness are studled. Though thickness of the Pt layer 1s 1000$\AA$). oxygen diffusion is not prevented and accelerated by Ti layer actlng for oxygen sink sites durmg furnace annealing. The upper TI layer 1s transformed Into TIOX by oxyen dlffuslon and lower Ti layer Into silicide with in-diffused Pt. The formation of TiOx layer seems to affect the orlentatton of the PZT layer. Furnace annealed f~lm shows ferroelectr~c and electrical properties wth a remanent polarlzation of 3.3$\mu A /\textrm{cm}^2$, , coerclve fleld of 0.15MV/cm, a=571 (10kHz), leakage current 32.65$\mu A /\textrm{cm}^2$, , breakdown voltage of 0.4OMV/cm.