• Journal of Korea Foundry Society
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• v.28 no.2
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• pp.64-68
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• 2008

The microstructure of Cu-Mg-P base alloys were significantly affected by small amounts of Fe and Co additions, however the tensile properties and electrical conductivity of the Cu alloys were mainly determined by the fabrication process. Relatively high electrical conductivity (> 80% IACS) was obtained in the all Cu-Mg-P based alloys when they were finally aged at $480^{\circ}C$. Tensile properties could be significantly enhanced by final cold rolling, especially at extremely low temperatures. Softening of cold-rolled alloys took place at about $450^{\circ}C$ owing to recovery and recrystallization, but it was delayed up to $500^{\circ}C$ in the Fe-added alloy.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1997.04a
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• pp.53-61
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• 1997

The effect of sintering condition on tribological behavior in the Cu-base sintered friction materials was studied through pin-on-disk type wear tester. Especially, the experiment was focused on making a comparative study between presstwed sintering and pressureless sintering. Pressureless sintering process showes more stable friction coefficient and lower wear rate than pressure sintering process. This result is related to pore size and density of pore in the sintered materials.

• Journal of the Korean Magnetics Society
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• v.7 no.2
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• pp.82-89
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• 1997

Dependence of magnetoresistance on the thickness of Cu, type and thickness of buffer layer, and the stacking number of multilayer in the form buffer /$[Co(17{\AA}/Cu(t{\AA})]_{20}$ were investigated. To evaluate effect of annealing on this samples, X-ray diffraction analysis, vibrating sample magnetometer analysis, and magnetoresistance measurement (4-probe method) were performed. The magnetoresistance ratio exhibits a maximum of 21% for the multilayer with Cu thickness of 24$\AA$ and Fe buffer layer thickness of 50$\AA$. Deposition of film under low base pressure induces in increase magnetoresistance ratio by preventing oxidation. The multilayer annealed below 30$0^{\circ}C$ temperature allowed larger textured grain without loss in the periodicity. Magnetoresistance ratios of the multilayer with Cu thickness of 24$\AA$ and 36$\AA$ were increased due to the increase in the antiferromagnetically coupled fraction after annealing.

• Journal of Welding and Joining
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• v.13 no.4
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• pp.55-64
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• 1995

A study was made to examine the effects of postweld heat treatment(PWHT) on the toughness and microstructures in the weld heat affected zone(HAZ) of Cu-bearing HSLA-100 steel. The Gleeble thermal/mechanical simulator was used to simulate the weld HAZ. The details between toughness and PWHT of HAZ were studied by impact test, optical microscopy(O.M.), scanning electron microscopy (SEM), transmission electron microscopy(TEM) and differential scanning calorimetry(DSC). The decrease of HAZ toughness in single thermal cycle comparing to base plate is ascribed to the coarsed-grain formed by heating to 1350.deg.C. The increase of HAZ toughness in double thermal cycle comparine to single thermal cycle is due to the fine ferrite(.alpha.) grain transformed from austenite(.gamma.)formed by heating to .alpha./.gamma. two phase region. Cu precipitated during aging for increasing the strength of base metal is dissolved during single thermal cycle to 1350.deg.C and is precipitated little on cooling and heating during subsequent weld thermal cycle. It precipitates by introducing PWHT. Thus, the decrease of toughness in triple thermal cycle of $T_{p1}$ = 1350.deg.C, $T_{p2}$ = 800.deg.C and $T_{p3}$ = 500.deg.C does not occur owing to the precipitation of Cu. The behaviors of Cu=precipitates in HAZ is similar to that in base plate. PWHT at 550.deg.C shows highest hardness and lowest toughness, whereas PWHT at 650.deg.C shows reasonable toughness, which improves the toughness of as-welded state.state.

• Journal of the Korean Chemical Society
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• v.59 no.1
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• pp.103-107
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• 2015

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.76-79
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• 2003

본 실험에서는 $S0.7wt\%Cu,\;Sn3.8wt\%Ag0.7wt\%Cu$ solder와 금속층으로서의 좋은 특성을 가지고 있지만 아직 연구 보고 된 적 없는 Pt층과의 리플로 반응에 의해 형성되는 계면금속간화합물의 상 분석을 시도 하였다 또한 솔더내 Cu함량에 따른 계면금속간화합물의 변화에 대하여 연구하기 위해 $Sn1.7wt\%Cu$솔더와 Pt층의 계면반응 현상에 대한 연구도 수행하였다. $Sn0.7(1.7)wt\%Cu$솔더는 순수한 Sn과 Cu를 이용하여 중량비로 제조하였고, $Sn3.8wt\%Ag0.7wt\%Cu$솔더는 솔더페이스트를 사용하였다. 분석은 SEM, EDS, XRD를 이용하였다. 분석 결과 세 가지 무연솔더 모두에서 $PtSn_4$가 계면 금속간화합물로 존재함을 발견하였으며 $1.7wt\%Cu$를 포함한 솔더와 Pt와의 반응에서는 고용도 이상으로 첨가된 Cu에 의해 솔더 내부에 조대한 형상의 $Cu_6Sn_5$가 존재함을 SEM 및 EDS분석을 통하여 발견 하였다.

• Journal of Powder Materials
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• v.12 no.6 s.53
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• pp.406-412
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• 2005

This work is to present a new synthesis of metallic glass (MG)/metallic glass (MG) composites using gas atomization and spark plasma sintering (SPS) processes. The MG powders of $Cu_{54}Ni_6Zr_{22}Ti_{18}$ (CuA) and $Ni_{59}Zr_{15}Ti_{13}Nb_7Si_3Sn_2Al_1$(NiA) as atomized consist of fully amorphous phases and present a different thermal behavior; $T_g$ (glass transition temperature) and $T_x$ (crystallization temperature) are 716K and 765K for the Cu base powder, but 836K and 890K for the Ni base ones, respectively. SPS process was used to consolidate the mixture of each amorphous powder, being $CuA/10\%NiA\;and\;NiA/10\%CuA$ in weight. The resultant phases were Cu crystalline dispersed NiA matrix composites as well as NiA phase dispersed CuA matrix composites, depending on the SPS temperatures. Effect of the second phases embedded in the MG matrix was discussed on the micro-structure and mechanical properties.

• Journal of Korea Foundry Society
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• v.22 no.6
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• pp.304-308
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• 2002

The new Cu-Zr-Ti-Ni-Pd amorphous alloy system has been introduced and manufactured using melt-spinning and Cu-mold die casting methods. Amorphous formability, the supercooled liquid region before crystallization and mechanical properties of the alloys were examined. The reduced glass transition temperature(Trg = Tg/Tm) and the supercooled liquid region(${\Delta}$Tx = Tx-Tg) of $Cu_{49}Zr_{30}Ti_{10}Ni_5Pb_6$ alloy were 0.620 and 57 K respectively. $Cu_{49}Zr_{30}Ti_{10}Ni_5Pb_6$ amorphous alloy was produced in the rod shape with 2mm diameter using the Cu-mold die casting. The hardness value of the amorphous bulk alloy was 432 DPN.

• Bulletin of the Korean Chemical Society
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• v.30 no.12
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• pp.2921-2926
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• 2009

Cu-BTC[$Cu_3(BTC)_2(H_2O)_3$, BTC = 1,3,5-benzenetricarboxylate], one of the most well-known metal-organic framework materials (MOF), has been synthesized under atmospheric pressure and room temperature by using ultrasound. The Cu-BTC can be obtained in 1 min in the presence of DMF (N,N-dimethylformamide), suggesting the possibility of continuous production of Cu-BTC. Moreover, the surface area and pore volume show that the concentration of DMF is important for the synthesis of Cu-BTC having high porosity. The morphology and phase also depend on the concentration of DMF : Cu-BTC cannot be obtained at room temperature in the absence of DMF and aggregated Cu-BTC (with low surface area) is produced in the presence of high concentration of DMF. It seems that the deprotonation of benzenetricarboxylic acid by base (such as DMF) is inevitable for the room temperature syntheses.

• The Journal of Korean Academy of Prosthodontics
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• v.23 no.1
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• pp.39-59
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• 1985

The purpose of this study was to investigate how gap distances of 0.13mm, 0.15mm, 0.20mm, and 0.30mm affects solder joint strength from gold alloys and nickel-chromium base alloys and to examine the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys. The tensile test specimens were prepared in the split stainless steel mold with a half dumbbell shape 2.5mm in diameter and l2mm in length. 6 pairs of specimens of each gap distance group of gold alloys and nickel-chromium base alloys were made and 48 pairs of all specimens were soldered with solder gold of 666 fineness. All soldered specimens were machined to a uniform diameter and then a tensile load was applied at a cross-head speed of 0.10mm/min using Instron Universal Testing Machine, Model 1115. The fractured specimens at solder gold of solder joint fracture with each gap distance of 0.13mm, 0.15mm, 0.20mm, and 0.30mm were examined under the Scanning Electron Microscope, JSM-35c and the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys was analyzed by Electron Probe Micro Analyzer. The results of this study were obtained as follows: 1. In case of soldering of gold alloys, the tensile strength between gold alloys showed $37.33{\pm}2.52kg/mm^2$ at 0.13, $39.14{\pm}3.35kg/mm^2$ at 0.15mm, $43.76{\pm}2.97kg/mm^2$ at 0.20mm, and $49.18{\pm}4.60kg/mm^2$ at 0.30mm. There was statistically significant difference at each gap distance, and so the greater increase of gap distance showed the greater tensile strength. 2. In case of soldering of nickel-chromium base alloys, the tensile strength between nickel-chromium base alloys showed $34.84{\pm}4.26kg/mm^2$ at 0.13mm, $37.25{\pm}2.49kg/mm^2$ at 0.15mm, $42.91{\pm}4.32kg/mm^2$ at 0.20mm, and $46.93{\pm}4.21kg/mm^2$ at 0.30mm. There was not statistically significant difference only between 0.13mm and 0.15mm and bet ween 0.20 mm and 0.30mm, but generally the greater increase of gap distance showed the greater tensile strength. 3. The greater increase of gap distance shoed less porosities in solder gold at solder joint fracture. 4. In solder gold Au, Cu, Ag, Zn, and Sn were composed and Au and Cu were mostly distributed uniformly. 5. In solder joints of solder gold and gold alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Au, Cu, Ag, Pt, and Pd were composed in gold alloys. Au and Cu of solder gold and gold alloys were mostly distributed uniformly and the diffusion of other elements except Pt and Pd around the solder joint was not almost found. In solder joints of solder gold and nickel-chromium base alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Ni, Cr, and Al were composed in nickel-chromium base alloys. Au and Cu of solder gold and Ni and Cr of nickel-chromium base alloys were mostly distributed uniformly and the diffusion of other elements except Cr around the solder joint was not almost found.