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Effects of Minor Alloying Elements on the Microstructure and Mechanical Properties of High Conductivity Cu-Mg-P Base Alloys  

Kim, Jeong-Min (Division of Advanced Materials Engineering, Hanbat National University)
Park, Joon-Sik (Division of Advanced Materials Engineering, Hanbat National University)
Kim, Ki-Tae (Advanced Materials Development Center, Korea Institute of Industrial Technology)
Kim, Hyun-Gil (Division of Fusion Technology Development, Korea Atomic Energy Research Institute)
Publication Information
Journal of Korea Foundry Society / v.28, no.2, 2008 , pp. 64-68 More about this Journal
Abstract
The microstructure of Cu-Mg-P base alloys were significantly affected by small amounts of Fe and Co additions, however the tensile properties and electrical conductivity of the Cu alloys were mainly determined by the fabrication process. Relatively high electrical conductivity (> 80% IACS) was obtained in the all Cu-Mg-P based alloys when they were finally aged at $480^{\circ}C$. Tensile properties could be significantly enhanced by final cold rolling, especially at extremely low temperatures. Softening of cold-rolled alloys took place at about $450^{\circ}C$ owing to recovery and recrystallization, but it was delayed up to $500^{\circ}C$ in the Fe-added alloy.
Keywords
Cu alloy; Precipitate; Conductivity; Mechanical properties;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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