• Journal of the Korean institute of surface engineering
• /
• v.27 no.2
• /
• pp.83-90
• /
• 1994

We have investigated the mechanism for the abnormal oxide growth occuring during oxidation of the crystalline tungsten silicide. TEM and XPS analysis reveal the abnormaly grown oxide layer consisting of crystalline $Wo_3$ and amorphous $SiO_2$. The presence of crystalline $Wo_3$ provides a rapid diffusion of oxygen through the oxide layer. The abnormal oxide growth is mainly due to the poor quality of initial oxide layer growth on tungsten silicide. Two species such as tungsten and silicon from decomposition fo tungsten silicide as well as silicon supplied from the underlying polysilicon are the main contributors sto abnormal oxide forma-tion. Consequently, the abnormal oxidation results in the disintegration of tungsten silicide and thinning of polysilicon as well.

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.11a
• /
• pp.48.1-48.1
• /
• 2010

Mono-crystalline silicon solar cell is fabricated by using alkali metals. These alkali metal, used in wet etching process, must be removed for the high efficiency solar cell. As wet etching process has been adapted due to its low cost. But lots of alkali metals like potassium remains on the silicon surface and acts as impurities. To remove these alkali metals many of cleaning process have to be applied when solar cell manufacturing process. In terms of alkali metal removal, modified etchant solution is required for concise cleaning process. In this paper ethylenediamine was used and proposed for the substituion of postassium hydroxide.

• 한국태양에너지학회:학술대회논문집
• /
• 2011.11a
• /
• pp.40-44
• /
• 2011

Recent studies in crystalline silicon solar cell fabrication have been focused on high efficiency and low cost. However, the rising of the cost results in additional processes to approach high efficiency. The fabrication process also becomes complicated with additional technologies. In this paper, we studied the selective emitter formation with phosphorous paste to improve the conversion efficiency. Selective emitter formations like two-step diffusion or etch-back method require at least one more step compared in the conventional line since heavily and lightly doped area was needed to form separately.However,one-step diffusion process is the method diffusing heavily and lightly doped area at the same time only with additional screen-printing step. This study lays the foundation for the simple way to form the selective emitter.

• Journal of the Semiconductor & Display Technology
• /
• v.17 no.3
• /
• pp.10-16
• /
• 2018

In silicon crystalline PV (Photo Voltaic) industry, PV module or panel electric power is directly related to the companies' profit. Thus, many PV companies have invested and focused on R&D activities to get the higher module power. The main BOM (Bills of Material) on the module consists of PV solar cell, ribbon, EVA (Ethylene-Vinyl Acetate copolymer), glass and back sheet. Based on consistent research efforts on enhancing module power using BOM, there have been increase of around 5 watt per module every year as results. However, there are lack of studies related to enhancing accuracy of measurement. In this study, the enhancing on the metrology is investigated and the improvement shows actually contribution to company's profit. Especially, the measurement issues related to heat and to quasi state of bandgap diagram by EL(Electro Luminescence) are described in this study.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2015.08a
• /
• pp.82-82
• /
• 2015

Industrial crystalline silicon (c-Si) solar cells with using a screen printing technology share the global market over 90% and they will continue to be the same for at least the next decade. It seems that the $2^{nd}$ generation and the $3^{rd}$ generation technologies have not yet demonstrated competitiveness in terms of performance and cost. In 2014, new world record efficiency 25.6% (Area-$143.7cm^2$, Voc-0.740V, $Jsc-41.8mA/cm^2$, FF-0.827) was announced from Panasonic and its cell structure is Back Contact $HIT^*$ c-Si solar cell. Here, amorphous silicon passivated contacts were newly applied to back contact solar cell. On the other hand, 24.9% $TOPCon^{**}$ cell was announced from Fraunhofer ISE and its key technology is an excellent passivation quality applying tunnel oxide (<2 nm) between metal and silicon or emitter and base. As a result, to realize high efficiency, high functional technologies are quite required to overcome a theoretical limitation of c-Si solar cell efficiency. In this presentation, Si solar cell technology summarized in the International Technology Roadmap for Photovoltaics ($^{***}ITRPV$ 2014) is introduced, and the present status of R&D associated with various c-Si solar cell technologies will be reviewed. In addition, national R&D projects of c-Si solar cells to be performed by Korea University are shown briefly.

• Journal of the Korean Solar Energy Society
• /
• v.32 no.5
• /
• pp.102-107
• /
• 2012

Halogen lamp was applied to fabricate the selective emitter crystalline silicon solar cell. In selective emitter structure, the recombination of minority carriers is reduced with heavily doped emitter under metal grid, consequently improving the conversion efficiency. Laser selective emitter process which is recently used the most generally induces the damage on the silicon surface. However the lamp has enough heat to form heavily doped emitter layer by diffusing phosphorus from PSG without surface damage. In this work, we have studied to find the design and the suitable condition for halogen lamp such as power, time, temperature and figured out the possibility to fabricate the selective emitter silicon solar cell by lamp heating. The sheet resistance with $100{\Omega}/{\Box}$ was lower to $50{\Omega}/{\Box}$ after halogen lamp treatment. Heat transfer to lightly doped emitter region was blocked by using the shadow mask.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.7 no.4
• /
• pp.287-298
• /
• 2007

A two-dimensional treatment of the potential distribution under the depletion approximation is presented for poly-crystalline silicon thin film transistors. Green's function approach is adopted to solve the two-dimensional Poisson's equation. The solution for the potential distribution is derived using Neumann's boundary condition at the silicon-silicon di-oxide interface. The developed model gives insight into device behavior due to the effects of traps and grain-boundaries. Also short-channel effects and drain induced barrier lowering effects are incorporated in the model. The potential distribution and electric field variation with various device parameters is shown. An analysis of threshold voltage is also presented. The results obtained show good agreement with simulated results and numerical modeling based on the finite difference method, thus demonstrating the validity of our model.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.25 no.12
• /
• pp.1015-1020
• /
• 2012

Resistance of the front electrode is the highest proportion of the ingredients of the series resistance in crystalline silicon solar cell. While resistance of the front electrode is decreased with larger area, it induces the optical loss, causing the conversion efficiency drop. Therefore the front electrode with high aspect ratio increasing its height and decreasing is necessary for high-efficiency solar cell in considering shadowing loss and resistance of front electrode. In this paper, we used the screen printing method to form high aspect ratio electrode by multiple printing. Screen printing is the straightforward technology to establish the electrodes in silicon solar cell fabrication. The several printed front electrodes with Ag paste on silicon wafer showed the significantly increased height and slightly widen finger. As a result, the resistance of the front electrode was decreased with multiple printing even if it slightly increased the shadowing loss. We showed the improved electrical characteristics for c-Si solar cell with repeatedly printed front electrode by 0.5%. It lays a foundation for high efficiency solar cell with high aspect ratio electrode using screen printing.

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.11a
• /
• pp.47.2-47.2
• /
• 2010

For reducing outer reflection in mono-crystalline silicon solar cell, wet texturing process has been adapted for long period of time. Nowadays mixed solution with potassium hydroxide and isopropyl alcohol is used in silicon surface texturing by most manufacturers. In the process of silicon texturing, etch rate is very critical for effective texturing. Several parameters influence the result of texturing. Most of all, temperature, process time and concentration of potassium hydroxide can be classified as important factors. In this paper, temperature, process time and concentration of potassium hydroxide were set as major parameters and 3-level test matrix was created by using robust design for the optimized condition. The process optimization in terms of lowest reflection and stable etch rate can be traced by using robust design method.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2016.02a
• /
• pp.335.2-335.2
• /
• 2016

The fixed negative charge of the Al2O3 passivation layer gives excellent passivation performance for both n-type and p-type silicon wafers. For the best passivation quality, annealing is known to be a prerequisite step and a lot of studies concerning annealing effect on the passivation characteristics have been performed. Meanwhile, for manufacturing a crystalline silicon solar cell, firing process is applied to the Al2O3 passivation layer. Therefore, study on not only annealing effect but also on firing effect is necessary. In this work, Al2O3 passivation performance (minority carrier lifetime) for p-type silicon wafer was evaluated with Quasi-Steady-State Photoconductance(QSSPC) measurement after annealing at different temperatures. For the samples which showed different aspects, C-V measurement was performed for the cause - whether it is due to the chemical effect or field-effect. The change in Al2O3 passivation property after firing processes was investigated and the mechanism for the change could be estimated.