• Title/Summary/Keyword: critical force

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Measurement of EMC/PCB Interfacial Adhesion Energy of Chip Package Considering Warpage (휨을 고려한 칩 패키지의 EMC/PCB 계면 접합 에너지 측정)

  • Kim, Hyeong Jun;Ahn, Kwang Ho;Oh, Seung Jin;Kim, Do Han;Kim, Jae Sung;Kim, Eun Sook;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.101-105
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    • 2019
  • The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

Effects of DC Biases and Post-CMP Cleaning Solution Concentrations on the Cu Film Corrosion

  • Lee, Yong-K.;Lee, Kang-Soo
    • Corrosion Science and Technology
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    • v.9 no.6
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    • pp.276-280
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    • 2010
  • Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.

Biomechanical considerations for the screw of implant prosthesis: A literature review (임플란트 나사에 적용되는 생역학적 원리: 문헌고찰)

  • Im, So-Min;Kim, Dae-Gon;Park, Chan-Jin;Cha, Min-Sang;Cho, Lee-Ra
    • The Journal of Korean Academy of Prosthodontics
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    • v.48 no.1
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    • pp.61-68
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    • 2010
  • Purpose: This article attempted to determine the factors affecting the preload and screw loosening. Methods: Available clinical studies from 1981 to 2008 from the PUBMED that presented screw loosening data and review articles regarding screw joint stability were evaluated. Eleven studies dealing the biomechanical principles of the screw mechanics were reviewed. Moreover, the results of our data were included. Results: The frequency of screw loosening was consequently reduced due to the advancement in torque tightening with torque wrench, screw material, coating technique for reducing the frictional force, and thread design, etc. If preload in the screw falls below a critical level, joint stability may be compromised, and the screw joint may fail clinically. The types of fatigue failure of screw were divided to adhesive wear, plastic deformation, and screw fracture. Conclusion: An optimum preload is essential to the success of the implant-abutment complex. To maintain optimum preload, using a torque wrench and re-tightening at recall time were needed.

A Study DH the Identification Of Critical Intelligent Information Technologies and Application Areas in the Defence Side (국방부문 핵심지능정보기술 식별 및 활용방안 연구)

  • 김화수;이승구
    • Proceedings of the Korea Inteligent Information System Society Conference
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    • 2000.11a
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    • pp.407-416
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    • 2000
  • 국방 부문에 종사하는 관리자들은 국방정보시스템 사업관리에 있어서 최신정보기술에 대한 기본적인 사항은 알고있어야 효율적이고 효과적이며 성공적인 사업관리를 진행할 수 있을 것이다. 국방 부문에 종사하는 관리자들이 저비용 고효율의 국방정보시스템을 건설하고 운영 유지관리 하기 위하여 알아야 할 핵심 및 최신정보기술은 크게 인공지능기술, 멀티미디어 정보화 기술, 가상현실 기술, 시뮬레이션 기술, 텔레프레즌스 기술, 나노테크놀로지 기술, 데이터베이스 기술, 병렬처리 기술, 로봇공학 기술, 소프트웨어 공학에 관련된 기술 등이 있다. 그러나 국방부문에 종사하는 정보통신 전문 인력을 제외한 관리자들이 국방관련 사업관리를 수행하면서 정보기술에 대한 이해 수준이 비교적 낮기 때문에 효율적으로 국방사업을 준비, 계획, 추진하기 어려운 실정이다. 따라서 국방부문에 종사하는 관리자들이 정보기술을 알기 쉽게 이해할 수 있도록 국방부문 핵심지능형정보기술 발전 및 군 활용방안을 이해하기 쉽도록 작성하며 효율적인 사업관리가 이루어질 수 있는 방안을 연구하였다. 본 논문은 국방부문핵심 지능정보기술 식별 및 활용방안을 연구하여 핵심적으로 식별된 사항들을 우리 국방부문의 $C^4$I(지휘, 통제, 통신, 컴퓨터시스템)시스템, 내장형 무기시스템, 각종 교육훈련 정보시스템, 자원관리 정보시스템 등에 어떻게 적용할 것이며 적용시 기대효과는 무엇인가를 제시토록 하여 국방부문에 종사하는 관리자들이 각종 국방사업을 조정, 통제, 확인, 감독, 준비/계획하면서 참고하여 저비용 고효율의 국방관련 각층 사업을 관리할 수 있는 능력을 배양시키도록 연구를 수행하였다. 국방관련 각종 사업을 관리할 수 있는 능력을 배양시키도록 연구를 수행하였다. 국방부문 핵심지능정보기술 발전 및 활용 방안에 포함될 주요 내용을 요약하여 제시하였다.의 경향성을 나타내는 오차 주기(error cyc1e)를 이용함으로써 고객들의 수요의 경향성을 좀 더 세밀한 부분까지 파악할 수 있게 해 준다.ction, secondary electron microscopy, atomic force microscoy, $\alpha$-step, Raman scattering spectroscopu, Fourier transform infrared spectroscopy 및 micro hardness tester를 이용하여 기판 bias 전압이 DLC 박막의 특성에 미치는 영향을 조사하였다. 분석결과 본 연구에서 제작된 DLC 박막은 탄소와 수소만으로 구성되어 있으며, 비정질 상태임을 알 수 있었다. 기판 bias 전압의 증가에 따라 박막의 두께가 감소됨을 알 수 있었고, -150V에서는 박막이 거의 만들어지지 않았으며, -200V에서는 기판 표면이 식각되었다. 이것은 기판 bias 전압과 ECR 플라즈마에 의한 이온충돌 효과 때문으로 판단되며, 150V 이하에서는 증착되는 양보다 re-sputtering 되는 양이 더 많을 것으로 생각된다. 기판 bias 전압을 증가시킬수록 플라즈마에 의한 이온충돌 현상이 두드러져 탄소와 결합하고 있던 수소원자들이 떨어져 나가는 탈수소화 (dehydrogenation) 현상을 확인할 수 있었으며, 이것은 C-H 결합에너지가 C-C 결합이나 C=C 결합보다 약하여 수소 원자가 비교적 해리가 잘되므로 이러한 현상이 일어난다고 판단된다. 결합이 끊어진 탄소 원자들은 다른 탄소원자들과 결합하여 3차원적 cross-link를 형성시켜 나가면서 내부 압축응력을 증가시키는 것으로 알려져 있으며, hardness 시험 결과로 이것을 확인할 수 있었다. 그리고 표면거칠기는 기판 bias 전압을 증가시킬수록 더 smooth 해짐을 확인

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Superconducting Thick Film by Lateral Field Assisted EPD (측면보조전계 인가 전기영동전착 초전도후막)

  • 전용우;소대화;조용준
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.8 no.3
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    • pp.679-685
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    • 2004
  • Although the electrophoretic deposition method has the advantage of simple processing procedure, less fabrication facilities, and easier control for deposition thickness and wire length, providing economical and technical merits, it also has the disadvantages of cracking and porosity phenomena, requiring an improved processing method for higher particle density and constant particle orientation. we have developed an optimization method to increase the particle density and to unify its orientation, and have performed a study to overcome the cracking and porosity problems in the fabricated superconductor. In order to improve the surface uniformity and the conduction properties of the fabricated YBCO thick films, a system that applies alternate voltage vertically has been developed for the first time and applied to the electrophoretic deposition process. The applied alternate electric field caused a force to be exerted on each YBCO particle and resulted in a rotation of the particle in the direction of applied electric field, accomplishing a uniform particle orientation. We name this process as the shaky-aligned electrophoretic deposition method. For commercial utilization and efficiency, in this dissertation, alternating voltage of 60 Hz and 25 ∼ 120 V/cm was proposed to apply it as a subsidiary source for shaky-flow deposition so that the fabricated thin film showed uniform surface morphology with less voids and cracks and Tc,zero of 90 K and the critical current density of 3419 A/$cm^2$.

A Framework for Quality Improvement in Weapon System using Post-Logistics Support Data (후속군수지원 데이터 분석을 활용한 무기체계 품질향상 방법론)

  • Kim, Geun-Hyung;Kim, Young-Kuk;Park, Seung Hwan
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.17 no.5
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    • pp.680-687
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    • 2016
  • Although advanced weapon system weapons with high-performance and various functions have been developed, weapon defects can be fatal in the weapons industry. Therefore, the army requires quality improvement to reduce the number of defects which occur during both the development and operation of the weapon system. Recently, many manufacturers, including weapons manufacturers, have conducted analyses using defect related big-data in order to improve the quality. However, there have been few data analyses, because it is difficult to obtain the data required for the analysis of the development phase. Therefore, this study summarizes the pattern of the weapon system, military organization, and defect types using the actual data of the Post-Logistics Support (PLS) phase. The PLS data, which is referred to as the data collected after force integration, includes information on requests for maintenance. Through this information, this study selects key variables and analyzes the selected variables. The analysis results show the critical factors to be considered during the development phase. Finally, this study proposes a framework for advanced PLS systems using the PLS data. The proposed framework enables the development time of weapon systems to be further shortened and their quality to be improved.

Arguments and Some Issues to be Considered for Building the New Administration Capital City in Korea (신 행정수도 건설의 논거와 과제)

  • 안성호
    • Journal of the Korean Geographical Society
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    • v.38 no.2
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    • pp.298-311
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    • 2003
  • Building the new administration capital city, one of presidential candidate Moo-Hyun Rho's election pledges, is now listed as a priority national policy agenda of the Participation Government. However, so many people's negative attitudes ranging from cynical skepticism to firm objections against the national policy agenda may threaten its smooth policy actualization. At this juncture, this paper attempts to present persuasive arguments and discuss some critical issues to be considered for building the new administration capital city successfully. The paper begins with taking a look at the current state of hyper-concentration of Seoul agglomeration area and its harmful effects, paints a vision of 'an evenly developed country as a whole' via illustrating the vision from the Swiss case, and reviews the performance of the precedent governments' reform measures for rectifying the hyper-concentration of Seoul agglomeration area. And then, the paper argues for building the new administration capital city as a potent solution to the problem of excessive concentration of activities in Seoul agglomeration area, as well as a driving force to spur the government to realize the Participation Government' enthusiastic vision: 'a decentralized and evenly developed country as a whole' and 'the hub country in the Northeast Asia'. In addition, the paper discusses the location of the new administration capital city in connection with the forthcoming national unification. Lastly, the paper deals with the important issues such as the procedure of people's approval, the population size and legal status of the new administration capital city, the relationship between building the new administration capital city and decentralization reform, etc.

Reliable and High Spatial Resolution Method to Identify the Number of MoS2 Layers Using a Scanning Electron Microscopy

  • Sharbidre, Rakesh Sadanand;Park, Se Min;Lee, Chang Jun;Park, Byong Chon;Hong, Seong-Gu;Bramhe, Sachin;Yun, Gyeong Yeol;Ryu, Jae-Kyung;Kim, Taik Nam
    • Korean Journal of Materials Research
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    • v.27 no.12
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    • pp.705-709
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    • 2017
  • The electronic and optical characteristics of molybdenum disulphide ($MoS_2$) film significantly vary with its thickness, and thus a rapid and accurate estimation of the number of $MoS_2$ layers is critical in practical applications as well as in basic researches. Various existing methods are currently available for the thickness measurement, but each has drawbacks. Transmission electron microscopy allows actual counting of the $MoS_2$ layers, but is very complicated and requires destructive processing of the sample to the point where it will no longer be useable after characterization. Atomic force microscopy, particularly when operated in the tapping mode, is likewise time-consuming and suffers from certain anomalies caused by an improperly chosen set point, that is, free amplitude in air for the cantilever. Raman spectroscopy is a quick characterization method for identifying one to a few layers, but the laser irradiation causes structural degradation of the $MoS_2$. Optical microscopy works only when $MoS_2$ is on a silicon substrate covered with $SiO_2$ of 100~300 nm thickness. The last two optical methods are commonly limited in resolution to the micrometer range due to the diffraction limits of light. We report here a method of measuring the distribution of the number of $MoS_2$ layers using a low voltage field emission electron microscope with acceleration voltages no greater than 1 kV. We found a linear relationship between the FESEM contrast and the number of $MoS_2$ layers. This method can be used to characterize $MoS_2$ samples at nanometer-level spatial resolution, which is below the limits of other methods.

A Study on the Development of Effective Regional IT Cluster (효과적인 지역IT 클러스터의 구축방안에 관한 연구)

  • Kim, Hee-Dae;Yoo, Sang-Jin;Kim, Kap-Sik
    • Information Systems Review
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    • v.5 no.2
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    • pp.241-256
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    • 2003
  • This empirical study is to explain critical success factors for building effective regional IT cluster from the literature reviews which have some limitations, and is to suggest new key factors from the views of Regional Innovation System and Sectoral Systems of Innovation. For building successful cluster, the new key factors not only stress on regional networks, the spill-over of tacit knowledge through learning by interacting, institutions which contain regional custom, norms, established practices, culture, and characteristics from the Regional Innovation System, but also emphasize on heterogeneous agents who are interacting by each others from Sectoral Systems of Innovation. From these factors we suggest some strategies for building effective "Daegu IT Cluster" as following; making characterized IT brands which are selected and concentrated based on regional and IT sectoral characteristics, strengthening learning competence of tacit knowledge built in multiple heterogeneous agents network, establishing strong agent networks which are composed of universities, companies, institutes and government, and sharing the institution of mind-opening culture in order to correspond with environmental changes and link to other industrial clusters. By putting above strategies in force, the compatabilities of Daegu region are reinforced. Tacit knowledges spill over and the regional innovation competence are accumulated. Also IT cluster plays core role of employment in Daegu for long term. Especially, "Daegu IT Cluster" changes city's image from medium and small manufacturing city to new industrial city based on high technologies.

Is Civic Service the Real Antipode of Volunteer Work? - Focusing on AmeriCorps and Senior Corps in the United States (시민서비스는 자원봉사의 대척점에 있는가? - 미국의 AmeriCorps와 Senior Corps를 중심으로)

  • Ji, Eun-Jeong
    • Korean Journal of Social Welfare Studies
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    • v.45 no.2
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    • pp.31-63
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    • 2014
  • Recently interest in civic engagement and civic service is increasing. However, in Korea, few studies have focused on civic service. This might be on account of general awareness that civic service is fundamentally different from the basic spirit of voluntary work, while interest in paid volunteer work is on the rise. Thus, it is necessary to examine whether civic service is the real antipode of volunteer work. Under this kind of critical viewpoint, this study aims to analyze civic service based on the attributes of voluntary work and civic service. The major findings are as follows. Firstly, contrary to common belief, civic service has not been established to go beyond the principle of voluntary and unpaid characteristics of volunteer work. Rather, some voluntary work has broken out of principle of voluntary activities. Secondly, civic service and volunteer work might be characterized as different not due to spontaneity and unpaid service but the structural characteristics of the goal, continuity and formality. Furthermore, the reason for the soft landing of civic service in the United States is not because they have supported the reimbursement of expenses and the provision of stipends. Rather, it is because their long-term activities have promoted real community development for the purpose of finding solutions to social problems, and they have derived a sense of pride and satisfaction from social recognition and rewards for their contributions.