• Title/Summary/Keyword: critical current and resistance fluctuations

Search Result 4, Processing Time 0.021 seconds

Transport Properties of Ramp-Edge Junction with Columnar Defects (원통형 결함을 포함한 Ramp-Edge Junction의 수송특성)

  • Lee, C. W.;Kim, D. H.;Lee, T. W.;Sung, Gun-Yong;Kim, Sang-Hyeob
    • Progress in Superconductivity
    • /
    • v.3 no.1
    • /
    • pp.65-69
    • /
    • 2001
  • We measured the transport properties of$ YBa_2$$Cu_3$$O_{x}$ ramp-edge junction fabricated with interface-engineered barrier. The current-voltage characteristics show a typical resistively-shunted junction like behavior Voltage noise measurement revealed that the main source of the 1/f noise is the critical current and resistance fluctuations. The analysis of the noise data showed that the critical current fluctuations increase with temperature, whereas the resistance fluctuations are almost constant, and both fluctuations are almost correlated. The smaller magnitude of the critical current and resistance fluctuations seems to result from the columnar-deflects.s.

  • PDF

A Study on the Fire Risk for Self-regulating Heating Cable (정온전선의 화재 위험성에 관한 연구)

  • Jung Hyun Lee;Si Hyun Kim;Ye Jin Park;Sin Dong Kang;Jae-Ho Kim
    • Journal of the Korean Society of Safety
    • /
    • v.39 no.3
    • /
    • pp.7-13
    • /
    • 2024
  • This study examines the physical characteristics of self-regulating heating cables caused by increased temperature and fire risk due to local degradation. A thermo hygrostat system, a convection dryer, a digital multimeter (Agilent 34465 A), NI DAQ, and the LabVIEW program were used to assess the physical properties in response to temperature fluctuations. As the temperature increases, the resistance of the self-regulating heating cable increases; however, when the critical point is exceeded, the resistance sharply decreases. A problem arises when the resistance value cannot return to its original state even though the temperature is lowered to the initial state. Moreover, when the ambient temperature rises while power is applied, the resistance value initially increases, and the flowing current decreases, maintaining a constant state. However, when the critical temperature is exceeded, the flowing current increases because of a rapid decrease in the resistance value, progressing to ignition. When the resistance value decreases because of the deterioration of one local area, the total resistance value becomes less than the initial resistance value. Therefore, the flowing current increases and an ignition problem occurs at one location where deterioration occurs. Despite the sustained flames and arcs resulting from the changes in the overall physical properties of the self-regulating heating cable and resistance variations due to local decline, the fire continued as the flowing current was lower than the operating current of the circuit breaker, failing to cut the power. In the case of self-regulating heating cables and heating wires, which are the leading causes of fires in winter, efforts are needed to ensure the need for periodic maintenance and the use of KS-certified products.

Analysis on electrical and thermal characteristics of MI-SS racetrack coil under conduction cooling and external magnetic field

  • Chae, Yoon Seok;Kim, Ji Hyung;Quach, Huu Luong;Lee, Sung Hoon;Kim, Ho Min
    • Progress in Superconductivity and Cryogenics
    • /
    • v.23 no.4
    • /
    • pp.61-69
    • /
    • 2021
  • This paper presents the analysis and experiment results on the electrical and thermal characteristics of metal insulation (MI) REBCO racetrack coil, which was wound with stainless steel (SS) tape between turn-to-turn layers, under rotating magnetic field and conduction cooling system. Although the field windings of superconducting rotating machine are designed to operate on a direct current, they may be subjected to external magnetic field due to the unsynchronized armature windings during electrical or mechanical load fluctuations. The field windings show the voltage and magnetic field fluctuations and the critical current reduction when they are exposed to an external magnetic field. Moreover, the cryogenic cooling conditions are also identified as the factors that affect the electrical and thermal characteristics of the HTS coil because the characteristic resistance changes according to the cryogenic cooling conditions. Therefore, it is necessary to investigate the effect of external magnetic field on the electrical and thermal characteristics of MI-SS racetrack coil for further development reliable HTS field windings of superconducting rotating machine. First, the major components of the experiment test (i.e., HTS racetrack coil construction, armature winding of 75 kW class induction motor, and conduction cooling system) were fabricated and assembled. Then, the MI racetrack coil was performed under liquid nitrogen bath and conduction cooling conditions to estimate the key parameters (i.e., critical current, time constant, and characteristic resistance) for the test coil in the steady state operation. Further, the test coil was charged to the target value under conduction cooling of 35 K then exposed to the rotating magnetic field, which was generated by three phrase armature windings of 75 kW class induction motor, to investigate the electrical and thermal characteristics during the transient state.

Effects of DC Biases and Post-CMP Cleaning Solution Concentrations on the Cu Film Corrosion

  • Lee, Yong-K.;Lee, Kang-Soo
    • Corrosion Science and Technology
    • /
    • v.9 no.6
    • /
    • pp.276-280
    • /
    • 2010
  • Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.