• 한국초지조사료학회지
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• 제35권3호
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• pp.264-268
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• 2015

The present research investigated copper and cadmium stress-induced differentially expressed genes (DEGs) using annealing control primers (ACP) with the differential display reverse transcription polymerase chain reaction technique in alfalfa (Medicago sativa L. cv. Vernal) leaves. Alfalfa leaves were subjected to $250{\mu}M$ of copper and cadmium treatment for a period of 6 h. A total of 120 ACPs was used. During copper and cadmium treatment, 6 DEGs were found to be up or down regulated. During copper stress treatment, 1 DEG was up-regulated, and 3 novel genes were discovered. Similarly, during cadmium stress treatment, 1 DEG was up-regulated and 5 novel genes were identified. Among all 6 DEGs, DEG-4 was identified as the gene for trans-2,3-enoyl-CoA reductase, DEG-5 was identified as the gene for senescence-associated protein DIN1 and DEG-6 was identified for caffeic acid O-methyltransferase. All the up-regulated genes may play a role in copper and cadmium stress tolerance in alfalfa.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.139-140
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• 2002

This paper discusses the effect of plating condition on the mechanical property of electroplated Cu film. Current density, the amount of the organic additives was found to affect the residual stress of electroplated copper film. The result show that, in the case of residual stress, the copper film deposited at higher additive result in lower residual stress and plating current by $15mA/cm^2$ induced a better result than any other ones.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집A
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• pp.495-500
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• 2001

The significant creep in copper takes place at relatively low temperature and applied stress. Thus the study on modeling of creep behavior using the copper should provide researchers with benefits such as time for the test. In this study, a test of creep crack growth regarding copper was performed at 400 and $500^{\circ}C$, and analyzed. As result, the crack growth rate at $500^{\circ}C$ turned out to be 10 times higher than that at $400^{\circ}C$ in terms of $C^*$, while the crack growth rate at $500^{\circ}C$ was several hundreds times higher than that at $400^{\circ}C$ in terms of K. Moreover, a linear relationship between the crack growth rate and $C^*$ at the same temperature was established.

• 대한기계학회논문집A
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• 제30권11호
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• pp.1494-1501
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• 2006

Mechanical and physical properties of a copper alloy for a liquid rocket engine(LRE) combustion chamber liner application were tested at various temperatures. All test specimens were heat treated with the condition they might experience during actual fabrication process of the LRE combustion chamber. Physical properties measured include thermal conductivity, specific heat and thermal expansion data. Uniaxial tension tests were preformed to get mechanical properties at several temperatures ranging from room temperature to 600$^{\circ}C$. The result demonstrated that yield stress and ultimate tensile stress of the copper alloy decreases considerably and strain hardening increases as the result of the heat treatment. Since the LRE combustion chamber operates at higher temperature over 400$^{\circ}C$, the copper alloy can exhibit time-dependent behavior. Strain rate, creep and stress relaxation tests were performed to check the time-dependent behavior of the copper alloy. Strain rate tests revealed that strain rate effect is negligible up to 400$^{\circ}C$ while stress-strain curve is changed at 500$^{\circ}C$ as the strain rate is changed. Creep tests were conducted at 250$^{\circ}C$ and 500$^{\circ}C$ and the secondary creep rate was found to be very small at both temperatures implying that creep effect is negligible for the combustion chamber liner because its operating time is quite short.

• International Journal of Precision Engineering and Manufacturing
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• 제9권4호
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• pp.57-62
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• 2008

The aim of this investigation was to extract the fatigue properties at the designated fatigue life of copper foil and observe the mean stress and stress amplitude effects on both the fatigue life and the corresponding surface morphology. Tensile tests were performed to determine the baseline monotonic material properties of the proportional limit and ultimate tensile strength. Constant amplitude fatigue tests were carried out using a feedback-controlled fatigue testing machine. The mean stress and the stress amplitude were changed to obtain the complete nominal stress-life curves. An atomic force microscope was utilized to observe the relationship between the fatigue damage and the corresponding changes in surface morphology. A Basquin's exponent of-0.071 was obtained through the fatigue tests. An endurance limit of 122 MPa was inferred from a Haigh diagram. The specimen surface became rougher as the number of fatigue cycles increased, and there was a close relationship between the fatigue damage and the surface roughness evolution.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.622-626
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• 2005

The Residual stress is stress at the inside of materials after plastic deformation. Certainly, this residual stress have an effect on fatigue life. Therefore, it is very important that understanding residual stress at the inside of materials. But in case of U-shaped Pipe that it is dealt with a mailer in this paper, distribution of residual stress is very complicated and exactly become unknown caused by difficulty of measurement. Then, in this paper, we are evaluated residual stress at in the inside of materials by finite clement method program and verified validity by test.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 추계학술대회(한국공작기계학회)
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• pp.166-171
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• 2001

Copper bus-bar is made by drawing process and used in many part of industry. When design drawing die for copper bus-bar, design factor is focused on the deformation of die-land by drawing force and shrink fit. In this paper, to determine shrink fit value is analyzed by automatic shrink fit analysis program, APDL/UIDL language in a commercial FEM package, ANSYS, has been developed that enables optimal design of the dies taking into account the elastic deflections generated in shrink fitting the die inserts and that caused by the stresses generated in the process and by using DEFORM software for drawing process analysis. This data can be processed as load input data for a finite element die-stress analysis. Process simulation and stress analysis are thus combined during the drawing die design. The stress analysis of the dies is used to determine optimized dimension of die-land.

• 한국결정성장학회지
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• 제14권2호
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• pp.58-62
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• 2004

The shape evolution of the interface void of copper metallization for intergrated circuits under electromigration stress is modeled. A 2-dimensional finite-difference numerical method is employed for computing time evolution of the void shape driven by surface diffusion, and the electrostatic problem is solved by boundary element method. When the diffusion coefficient is isotropic, the numerical results agree well with the known case of wedge-shape void evolution. The numerical results for the anisotropic diffusion coefficient show that the initially circular void evolves to become a fatal slitlike shape when the electron wind force is large, while the shape becomes non-fatal and circular as the electron wind force decreases. The results indicate that the open circuit failure caused by slit-like void shape is far less probable to be observed for copper metallization under a normal electromigration stress condition.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 A
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• pp.73-75
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• 1999

The time harmonics of an inverter output voltage cause high frequency currents in the rotor bars of a squirrel cage induction motor, so that the harmonic copper loss density increases in the upper lesion of the bars. Such an higher loss density makes an nonuniform thermal source and deforms the bars due to the thermal stress. Therefore, in this paper, the copper loss distribution in the rotor bar of an inverter-fed induction motor, which is the source of the thermal stress, is analyzed by the time-stepping finite element method. As a result, the harmonic copper losses of 11 subregions in a bar are calculated and compared with those of sinusoidally fed induction motor.

• 대한기계학회논문집A
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• 제33권10호
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• pp.1158-1162
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• 2009

Fatigue limit of the copper film coated by Sn was estimated using Goodman diagram and Gerber diagram. To obtain the high cycle fatigue life curve, S-N curve, of the film, the high cycle fatigue test was carried out by applying the constant amplitude load to the film specimen with three different stress ratio of 0.05, 0.3 and 0.5 and the frequency of 40 Hz at room temperature in air. The free-standing film specimen 15.26${\mu}m$ thick was fabricated by etching process. The fatigue limits and S-N curves at the respective stress ratios were determined from the experimental works. It was shown that the S-N curves were dependent on the stress ratio and the fatigue limit was increased with decreasing the stress ratio. The dependency of the fatigue behavior was presented in empirical relationship. Using these relationships, the fatigue limit was predicted.