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http://dx.doi.org/10.3795/KSME-A.2009.33.10.1158

Fatigue Limit of Copper Film  

Huh, Yong-Hak (한국표준과학연구원 산업측정표준본부)
Kim, Dong-Jin (한국표준과학연구원)
Lee, Hae-Moo (한국표준과학연구원)
Hong, Sung-Gu (한국표준과학연구원)
Park, Jun-Hyub (동명대학교 메카트로닉스공학과)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.33, no.10, 2009 , pp. 1158-1162 More about this Journal
Abstract
Fatigue limit of the copper film coated by Sn was estimated using Goodman diagram and Gerber diagram. To obtain the high cycle fatigue life curve, S-N curve, of the film, the high cycle fatigue test was carried out by applying the constant amplitude load to the film specimen with three different stress ratio of 0.05, 0.3 and 0.5 and the frequency of 40 Hz at room temperature in air. The free-standing film specimen 15.26${\mu}m$ thick was fabricated by etching process. The fatigue limits and S-N curves at the respective stress ratios were determined from the experimental works. It was shown that the S-N curves were dependent on the stress ratio and the fatigue limit was increased with decreasing the stress ratio. The dependency of the fatigue behavior was presented in empirical relationship. Using these relationships, the fatigue limit was predicted.
Keywords
High Cycle Fatigue; Copper Film; Stress Ratio; S-N Curve; Fatigue Limit;
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Times Cited By KSCI : 1  (Citation Analysis)
Times Cited By SCOPUS : 0
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