• Membrane and Water Treatment
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• 제7권5호
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• pp.403-416
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• 2016

The possibility of using carica papaya leaf powder for removal of copper from wastewater as a low cost adsorbent was explored. Different parameters that affect the adsorption process like initial concentration of metal ion, time of contact, adsorbent quantity and pH were evaluated and the outcome of the study was tested using adsorption isotherm models. A maximum of 90%-94.1% copper removal was possible from wastewater having low concentration of the metal using papaya leaf powder under optimum conditions by conducting experimental studies. The biosorption of copper ion was influenced by pH and outcome of experimental results indicate the optimum pH as 7.0 for maximum copper removal. Copper distribution between the solid and liquid phases in batch studies was described by isotherms like Langmuir adsorption and Freundlich models. The adsorption process was better represented by the Freundlich isotherm model. The maximum adsorption capacity of copper was measured to be 24.51 mg/g through the Langmuir model. Pseudo-second order rate equation was better suited for the adsorption process. A dynamic mode study was also conducted to analyse the ability of papaya leaf powder to remove copper (II) ions from aqueous solution and the breakthrough curve was described by an S profile. Present study revealed that papaya leaf powder can be used for the removal of copper from the wastewater and low cost water treatment techniques can be developed using this adsorbent.

• BMB Reports
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• 제56권11호
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• pp.575-583
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• 2023

Mitochondria, fundamental cellular organelles that govern energy metabolism, hold a pivotal role in cellular vitality. While consuming dioxygen to produce adenosine triphosphate (ATP), the electron transfer process within mitochondria can engender the formation of reactive oxygen species that exert dual roles in endothelial homeostatic signaling and oxidative stress. In the context of the intricate electron transfer process, several metal ions that include copper, iron, zinc, and manganese serve as crucial cofactors in mitochondrial metalloenzymes to mediate the synthesis of ATP and antioxidant defense. In this mini review, we provide a comprehensive understanding of the coordination chemistry of mitochondrial cuproenzymes. In detail, cytochrome c oxidase (CcO) reduces dioxygen to water coupled with proton pumping to generate an electrochemical gradient, while superoxide dismutase 1 (SOD1) functions in detoxifying superoxide into hydrogen peroxide. With an emphasis on the catalytic reactions of the copper metalloenzymes and insights into their ligand environment, we also outline the metalation process of these enzymes throughout the copper trafficking system. The impairment of copper homeostasis can trigger mitochondrial dysfunction, and potentially lead to the development of copper-related disorders. We describe the current knowledge regarding copper-mediated toxicity mechanisms, thereby shedding light on prospective therapeutic strategies for pathologies intertwined with copper dyshomeostasis.

• 한국재료학회지
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• 제20권2호
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• pp.82-89
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• 2010

Benzotriazole (B.T.A) which has been mainly used for the stabilization processing method of excavated copper and bronze artifacts is vaporized within 2~3 years after the usage because it is unstable at the acid conditions and cannot protect the surface of artifacts. In this study, NaOH method which has been used for the steel artifacts was applied as a stabilization process for the method of copper and bronze artifacts to gush chlorine ion out. For the reproduction of excavated samples, copper and bronze plates were dipped in 0.1M HCl for 26 hrs to form CuCl, rusted at $70^{\circ}C$ with RH 75% for the formation of corrosion products, and desalted in 0.1 M NaOH solution. The concentration of chlorine ion was measured by using ionchromatography. During the desalting process, a large quantity of chlorine ions was gushed out in early period and corrosion products were not additionally generated through the re-corrosion experiment. This NaOH desalting process was found to be a method of stabilization process for copper and bronze artifacts from the formation of Tenorite (CuO) during desalting as a protection layer for corrosion.

• 한국기계가공학회지
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• 제14권4호
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• pp.1-7
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• 2015

In the present study, copper micromolds with a microhole array were precisely manufactured by a synchrotron LIGA process. Like in the traditional LIGA process, a deep X-ray lithography based on a synchrotron radiation was employed as the first manufacturing step. Due to the excellent optical performance of the synchrotron X-ray used, cylindrical micropillar arrays with high aspect ratio could be efficiently obtained. The fabricated microfeatures were then used as a master of the subsequent copper electroforming process, thereby resulting in copper micromolds with a microhole array. Thermoplastic hot embossing experiments with the copper micromolds were carried out for imprinting cylindrical microfeatures onto a polystyrene sheet. Through the hot embossing, the effect of embossing temperature and usefulness of the present manufacturing method could be verified.

• 자원리싸이클링
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• 제28권1호
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• pp.62-72
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• 2019

일반적으로, 황산동을 제조하기 위한 원료는 $H_2SO_4$ 및 Cu 금속이 사용된다. 본 연구는 폐산, 폐염화동 폐기물부터 전해 채취법을 이용하여 황산동을 제조하는 방법에 관한 것이다. 황산구리의 용도는 공업용, 도금용, 사료용, 농업용, 전자급 PCB 동도금에 사용된다. 종래의 황산동 제조법은 다량의 폐수 및 에너지 비용이 높은 문제점이 있다. 구리(Cu) 화합물 중에서 가장 사용이 많이 되는 황산동($CuSO_4$)의 제조 방법에 관한 연구로서, 공정 운전비가 적고, 폐수 발생이 적으며, 제조 공정이 간단하다. 양이온 맴브레인을 이용하여 Na, Ca, Mg, Al을 불순물로서 제거하기 쉽다. 또한 동시에 전해 채취 방법으로 고 순도 구리 분말을 회수 할 수 있었다. 회수 된 구리 분말을 사용하여 고 순도 황산동을 제조 할 수 있었다.

• 한국결정성장학회지
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• 제3권1호
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• pp.75-84
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• 1993

황산동 수용액으로부터 치환법을 이용하여 흑연입자에 동을 코팅시켰다. 흑연입자표면에 연속적이고 균질하게 동이 코팅된 최적조건을 확립하기 위하여 동이온 농도, 교반속도, 반응시간 및 반응온도 등의 영향을 조사하였다. 이때 동 코팅반응의 활성화에너지는 3.59kcal/mole이었다.

• 사물인터넷융복합논문지
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• 제9권3호
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• pp.61-67
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• 2023

구리의 전기주조 공정을 최적화하기 위하여 이중 비밀 다층구조의 역전파 뉴럴 네트워크가 구성된다. 샘플 학습을 통하여, 구리 전기주조 공정 조건과 목표 특성 간의 함수관계가 정확히 성취되고, 구리 전기주조 공정 내에서 다층구조의 미세강도와 장력에 대한 예측이 이루어진다. 예측된 결과는 펄스 전원공급기를 장착한 구리 피로인산염 솔루션 시스템 내에서 구리의 전해석출 시험에 의하여 증명된다. 그 결과는 다음과 같이 나타난다. "3-4-3-2" 구조의 이중비밀 다층구조 뉴럴 네트워크에 의하여 예측된 구리 다층구조의 미세강도와 장력은 실험값에 매우 근접하며 그 상대적 오차는 2.32%보다 작다. 주어진 파라미터의 범위 내에서, 구리의 미세강도는 100.3~205.6MPa이며, 장력은 112~485MPa 정도로 측정된다. 미세강도와 장력이 최적인 조건에서 그에 대응하는 공정 조건은 다음과 같다: 전류밀도는 2A·dm-2, 펄스 주파수는 2KHz, 펄스의 듀티싸이클은 10%이다.

• 청정기술
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• 제2권1호
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• pp.47-52
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• 1996

인쇄회로기판(Printed Circuit Board) 생산 공정에서 발생하는 동폐액을 재활용, 재이용하기 위하여 유기 용매 추출법을 이용하였으며 유기용매로 Lix 64 N을 사용하였다. 산성인 동폐액과 염기성인 동폐액을 혼합하여 pH=2에서 부피 비율로 30%인 Lix 64 N은 17.1gr/l의 동을 추출하였다. 벤치 규모의 연속공정에서 추출단 4단, 세척단 4단, 역추출단 2단이 사용되었다. 회수된 동은 유산동으로 재활용되고 추잔액은 동부식액으로 재이용되었으며 동의 회수율과 유산동의 순도는 모두 99.9% 이상이었다.

• 한국재료학회지
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• 제15권6호
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• pp.426-430
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• 2005

Chemical mechanical polishing (CMP) is an essential process in the production of integrated circuits containing copper interconnects. The effect of alanine in reactive slurries representative of those that might be used in copper CMP was studied with the aim of improving selectivity between copper(Cu) film and tantalum-nitride(TaN) film. We investigated the pH effect of nano-colloidal silica slurry containing alanine through the chemical mechanical polishing test for the 8(inch) blanket wafers as deposited Cu and TaN film, respectively. The copper and tantalum-nitride removal rate decreased with the increase of pH and reaches the neutral at pH 7, then, with the further increase of pH to alkaline, the removal rate rise to increase soddenly. It was found that alkaline slurry has a higher removal rate than acidic and neutral slurries for copper film, but the removal rate of tantalum-nitride does not change much. These tests indicated that alanine may improve the CMP process by controlling the selectivity between Cu and TaN film.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.414-417
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• 2003

A copper-clad aluminium composite bar is lighter and less expressive than a commercial copper alloy bar. Copper-clad aluminium composite bar can be fabricated by hot hydrostatic extrusion process. In this work, the effect of die angle on the compressive properties of copper-clad aluminium composites fabricated using hydrostatic extrusion process was investigated experimentally. The results showed that optimum half die angle was in the range of 40$^{\circ}$ to 50$^{\circ}$ for an extrusion ratio of 19. The results also showed that the half die angle had little influence on the compressive strength of copper-clad aluminium composites. A diffusion layer increased with increasing die angle.