• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.156-161
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• 2004

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. In order to compare the removal rate and non-uniformity as a function of oxidizer contents, we used alumina-based tungsten slurry and copper blanket wafers deposited by DC sputtering method. According to the CMP removal rates and particle size distribution, and the microstructures of surface layer by SEM image as a function or oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_2$O$_3$abrasive particles in CMP slurry.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1729-1730
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• 2006

We investigated the effects of oxidizer additive on the performance of Cu-CMP process using commonly used tungsten slurry. According to the CMP removal rates and particle size distribution, and the micro-structures of surface layer as a function of oxidizer contents were greatly influenced by the slurry chemical composition of oxidizers. The difference in removal rate and roughness of copper surface are believed to cause by modification in the mechanical behavior of $Al_{2}O_{3}$ abrasive particles in CMP slurry.

• Journal of the Korea Institute of Military Science and Technology
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• v.9 no.2 s.25
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• pp.127-135
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• 2006

Experimental studies of the cylindrical sintered-copper wick heat pipes were carried out to investigate the capillary heat transfer characteristics. Six models of the sintered-copper wick heat pipes were manufactured and tested to evaluate the heat transport limitations and the thermal characteristics. Also the performance of the heat pipes was analyzed theoretically and compared with the test results. The heat pipe models are divided into two sintered-wick groups and the nominal particle sizes are $180{\mu}m$(wick #1) and $200{\mu}m$(wick #2) respectively The experimental results showed that, the porosity of wick #1 was higher than that of wick #2, and also the wick #1 was generally superior than the wick #2 for the heat transport capability. The maximum heat transport rates were increased as the wick thicknesses and the vapor temperatures were increased.

• Applied Science and Convergence Technology
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• v.27 no.4
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• pp.75-77
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• 2018

The electrostatic interaction between emerging quantum-confined nanostructures with plasmonic structures is crucial for future biological applications. Water-soluble green fluorescent copper nanoparticles (Cu-NPs) were fabricated. We demonstrate that L-ascorbic acid is considered as a key to precisely control small Cu-NPs and the capability of the surface ligands, while cetyltrimethylammonium bromide is used as a stabilizing agent controls the particle growth, and stabilizes the nanoparticles. Water-soluble green fluorescent Cu-NPs are tunable through modification of the reaction periods.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.808-809
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• 2006

The decrease of the distance between particle centers due to the growth of the sinter necks can be explained by the well known two-particle model. Unfortunately this model fails to provide a comprehensive description of the processes for 3D specimens. Furthermore, there is a significant discrepancy between the calculated and the measured shrinkage because particle rearrangements are not considered. Only the recently developed analysis of the particle movements inside of 3D specimens using micro focus computed tomography $({\mu}CT)$, combined with photogrammetric image analysis, can deliver the necessary experimental data to improve existing sintering theories. In this work, ${\mu}CT$ analysis was applied to spherical copper powders. Based on photogrammetric image analysis, it is possible to determine the positions of all particle centers for tracking the particles over the entire sintering process and to follow the formation and breaking of the particle bonds. In this paper, we present an in-depth analysis of the obtained data. In the future, high resolution synchrotron radiation tomography will be utilized to obtain in-situ data and images of higher resolution.

• Korean Journal of Materials Research
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• v.14 no.11
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• pp.790-794
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• 2004

Ultra-fine Copper particles for a conductive paste in electric-electronic field were prepared using wet-reduction process with hydrazine hydrate ($N_{2}H_4{\cdot}H_{2}O$) as a reductor. The effect of reaction conditions such as the amount of dispersion ($Na_{4}O_{7}P_2{\cdot}10H_{2}O$) and reductor ($N_{2}H_4{\cdot}H_{2}O$) on the particle size and shape for the prepared Cu powders was investigated. The quantity of dispersion and reductor varied from 0 to 0.0025 M and from 5 to 40 ml at a reaction temperature of $70^{\circ}C$, respectively. The particle size, shape, and structure for the obtained Cu particles were characterized by means of XRD, SEM, TEM, EDS and TGA. The aggregation of Cu particles was reduced with relatively increasing of the amount of dispersion at fixed other reaction conditions. The smaller Cu particle with size of approximately 300nm was obtained from 0.032 M $CuSO_4$ with adding of 0.0025 M $Na_{4}O7P_2{\cdot}10H_{2}O$ and 40ml $N_{2}H_4{\cdot}H_{2}O$ at a reaction temperature of $70^{\circ}C$.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2005.11a
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• pp.82-83
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• 2005

• Advances in environmental research
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• v.4 no.2
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• pp.119-133
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• 2015

Water pollution means that the physical, chemical and biological properties of water are changing. In this study, adsorption was chosen as the treatment method because it is an eco-friendly and low cost approach. Magnetite is a magnetic material that can synthesize chemical precipitation. Magnetite was used for the removal of copper in artificial water samples. For this purpose, metal removal from water dependent on the pH, initial concentration of metal, amount of adsorbent and effect of sorption time were investigated. Magnetite was characterized using XRD, SEM and particle size distribution. The copper ions were determined by atomic absorption spectrometry. The adsorption of copper on the magnetite was studied in a batch process, with different aqueous solutions of Cu (II) at concentrations ranging from 10 to $50mg\;l^{-1}$. Optimum conditions for using magnetite were found to be concentration of $10mg\;L^{-1}$, pH: 4.5, contact time: 40 min. Optimum adsorbent was found to be 0.3 gr. Furthermore, adsorption isotherm data were analyzed using the Langmuir and Freundlich equations. The adsorption data fitted well with the Freundlich ($r^2=0.9701$) and Langmuir isotherm ($r^2=0.9711$) equations. Kinetic and equilibrium aspects of the adsorption process were studied. The time-dependent Cu (II) adsorption data were described well by a pseudo-second-order kinetic model.

• Journal of the Korea Institute of Building Construction
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• v.23 no.4
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• pp.393-404
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• 2023

This research evaluates the antibacterial and transparency properties of UV-curable paint augmented with 20wt% copper particles. The transparency assessment indicated that the paint maintained a total luminous transmittance of 90% or above, thereby matching or surpassing the performance of standard UV-curing paints. To further test its antibacterial capabilities, wooden flooring boards were coated with the UV-curable paint laced with 20wt% copper particles, which had been surface-modified with a silane coupling agent. Following the fatigue tests of these treated boards, an impressive bacterial reduction rate of 99.9% was noted after a span of 6 hours, demonstrating the paint's exceptional antibacterial performance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.546-546
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• 2008

Copper (Cu) Chemical mechanical polishing (CMP) has been an essential process for Cu wifing of DRAM and NAND flash memory beyond 45nm. Copper has been employed as ideal material for interconnect and metal line due to the low resistivity and high resistant to electro-migration. Damascene process is currently used in conjunction with CMP in the fabrication of multi-level copper interconnects for advanced logic and memory devices. Cu CMP involves removal of material by the combination of chemical and mechanical action. Chemicals in slurry aid in material removal by modifying the surface film while abrasion between the particles, pad, and the modified film facilitates mechanical removal. In our research, we emphasized on the role of chemical effect of slurry on Cu CMP, especially on the effect of amine functional group on removal rate selectivity between Cu and Tantalum-nitride (TaN) film. We investigated the two different kinds of complexing agent both with amine functional group. On the one hand, Polyacrylamide as a polymer affected the stability of abrasive, viscosity of slurry and the corrosion current of copper film especially at high concentration. At higher concentration, the aggregation of abrasive particles was suppressed by the steric effect of PAM, thus showed higher fraction of small particle distribution. It also showed a fluctuation behavior of the viscosity of slurry at high shear rate due to transformation of polymer chain. Also, because of forming thick passivation layer on the surface of Cu film, the diffusion of oxidant to the Cu surface was inhibited; therefore, the corrosion current with 0.7wt% PAM was smaller than that without PAM. the polishing rate of Cu film slightly increased up to 0.3wt%, then decreased with increasing of PAM concentration. On the contrary, the polishing rate of TaN film was strongly suppressed and saturated with increasing of PAM concentration at 0.3wt%. We also studied the electrostatic interaction between abrasive particle and Cu/TaN film with different PAM concentration. On the other hand, amino-methyl-propanol (AMP) as a single molecule does not affect the stability, rheological and corrosion behavior of the slurry as the polymer PAM. The polishing behavior of TaN film and selectivity with AMP appeared the similar trend to the slurry with PAM. The polishing behavior of Cu film with AMP, however, was quite different with that of PAM. We assume this difference was originated from different compactness of surface passivation layer on the Cu film under the same concentration due to the different molecular weight of PAM and AMP.