• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.160-162
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• 2009

We have prepared and characterized particle based CIGS thin films using a thermal evaporator. As the copper rate, selenium rate changed, CIGS particles were obtained at $240^{\circ}C$ for 6 hours from the reaction of $CuCl_2$, $InCl_3$, $GaCl_3$ and Se powder in solvent. The CIGS thin films were deposited on a sodalime glass. The CIGS thin film were identified to have a typical chalcopyrite tetragonal structure by using UV/Vis-spectroscopy, X-ray diffraction(XRD), Auger Electron Spectroscopy(AES), Scanning Electron Microscopy(SEM).

• Applied Chemistry for Engineering
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• v.20 no.2
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• pp.201-207
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• 2009

The hydrogenation reaction of methyl dodecanoate for the synthesis of 1-dodecanol has been carried out in the presence of a copper chromite catalyst. The catalysts were synthesized by ceramic method, co-precipitation, and improved co-precipitation method and the particles were characterized by SEM and XRD. Also, the products of the reaction were assigned by GC, GC/MSD and NMR. The particles synthesized by each method showed (1) a spherical shape with the size of 3.2 to $7.0{\mu}m$, (2) an agglomerated spherical shape with the size of 50 to 500 nm and (3) a spherical shape with smaller particle size, respectively. Especially, in order to control the size of particles, the particles were synthesized in various dispersant solutions as Span 80, polyacrylate, and polyethyleneglycols (PEGs). The particles synthesized in PEG (Mw = 4000) solution showed the smallest particle size of 30 to 50 nm and the regularity of the particle size distribution. Our experimental results elucidated that the activity of catalyst for hydrogenation increases with decreasing the size of catalyst particle. The highest yield of dodecanol in the hydrogenation reaction was 95.5% when copper chromite synthesized in the PEG solution was used as a catalyst in the optimized reaction condition.

• Proceedings of the Korean Society of Marine Engineers Conference
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• 2000.11a
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• pp.61-67
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• 2000

Many research works for improving a boundary lubrication performance have been executed by using solid lubricants, and been tried to apply an engine lubrication. However those general lubricants like MoS$_2$ or PTFE have not been applied on engines due to the extreme conditions such as very high temperature and pressure by combustion process in a cylinder. A copper nickel alloy fine particle has been introduced and studied. In this Paper the lubricant using the alloy Particles is applied on a marine diesel engine and assessed by the engine performance test The results showed the increase of cylinder pressure related strongly to the engine efficiency as well as the improving the engine lubrication performance.

• Transactions on Electrical and Electronic Materials
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• v.5 no.6
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• pp.233-236
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• 2004

Copper metallization has been used in high-speed logic ULSI devices instead of the conventional aluminum alloy metallization. One of the key issues in copper CMP is the development of slurries that can provide high removal rates. In this study, the effects of slurry chemicals and pH for slurry dispersion stability on Cu CMP process characteristics have been performed. The experiments of copper slurries containing each different alumina and colloidal silica particles were evaluated for their selectivity of copper to TaN and $SiO_{2}$ films. Furthermore, the stability of copper slurries and pH are important parameters in many industries due to problems that can arise as a result of particle settling. So, it was also observed about several variables with various pH.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.439-440
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• 2008

• Korean Journal of Materials Research
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• v.28 no.3
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• pp.148-158
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• 2018

This study investigated the effect of the grinding media of a ball mill under various conditions on the raw material of copper powder during the milling process with a simulation of the discrete element method. Using the simulation of the three-dimensional motion of the grinding media in the stirred ball mill, we researched the grinding mechanism to calculate the force, kinetic energy, and medium velocity of the grinding media. The grinding behavior of the copper powder was investigated by scanning electron microscopy. We found that the particle size increased with an increasing rotation speed and milling time, and the particle morphology of the copper powder became more of a plate type. Nevertheless, the particle morphology slightly depended on the different grinding media of the ball mill. Moreover, the simulation results showed that rotation speed and ball size increased with the force and energy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.4
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• pp.235-240
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• 2017

The effect of particle sizes on the aerosol deposition (AD) of Cu films is investigated in order to understand the deposition behaviors of metal powder during the AD process. The Cu coatings fabricated by using $2{\mu}m$ Cu powders had a dense microstructure, a high deposition rate ($1.6{\pm}0.2{\mu}m/min$), and low resistance ($9.42{\pm}0.4{\mu}{\Omega}{\cdot}cm$) compared to that from using Cu powder with a particle size greater than $5{\mu}m$. Also, from estimating the internal micro-strain of Cu films, the Cu coatings fabricated by using $2{\mu}m$ Cu particles exhibited a high micro-strain value of $3.307{\times}10^{-3}$. On the other hand, the strain of Cu coatings fabricated with $5{\mu}m$ particles was decreased to $2.76{\times}10^{-3}$. These results seem to show that the impacted Cu particles are compressed and flattened by shock waves, and that their bonding is associated with the high internal micro-strain caused by plastic deformation.

• Resources Recycling
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• v.27 no.6
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• pp.44-52
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• 2018

In this study, copper was recovered from copper containing sludge by selectively controlling electro-refining process conditions in copper sulfate electrolyte solution. Electro-refining process was performed by LSV (Linear Sweep Voltammetry) result according to copper sulfate electrolyte solution concentration, applied current density, additive type and concentration. SEM (Scanning Electron Microscope) and PSA (Particle Size Analyzer) were used to analyze the shape and size of copper powder. In the 0.1 ~ 0.4 M copper sulfate electrolyte solution without organic additives, the copper powder size decreased as the applied current density became closer to the limiting current density and the copper powder size tended to decrease in 0.2 ~ 0.3 M copper sulfate electrolyte solution. In addition, when the shape and size of the copper powder were analyzed by adding various types and concentrations of organic additives to the previous experimental, fine spherical copper powder having the smallest size (nm) was obtained under the condition of cellulose type additive 2,000 ppm.

• Applied Chemistry for Engineering
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• v.18 no.1
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• pp.41-47
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• 2007

Crude copper phthalocyanine (Cupc) was synthesized by Wyler process, then grounded using various methods such as acid pasting, kneader, attritor and SC-mill. Particle size, shape and crystalline structure were compared and evaluated after particle size reductions. Cupcs prepared by acid pasting and kneader methods that are excellent manufacturing processes in industry were used as our standards. Particle properties of Cupcs prepared either by attritor or by SC-mill were compared with particle size analyzer, scanning electron microscopy (SEM) and X-ray diffraction (XRD). Particle size analyzer and SEM were used to analyze the variation of particle sizes of Cupc with milling time. Particle size was initially decreased up to the 90 min of milling time, thereafter it reversely began to increase in case of SC-mill. Cupc obtained from dry milling with attritor displayed strong cohesion so that particle size was not possible to determine with particle size analyzer. However, the optimum milling time was indirectly approximated from the analysis of XRD peak intensity.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.1 no.2
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• pp.79-93
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• 1991

With the advent of ULSI, many problems in previous metallization techniques and interconnection materials have become more serious. In this work, selective deposition of copper to fill the submicron contact has been tried. After forming electro-deposited copper films on p-type (100) silicon wafer using 0.75M $CuSO_4{\cdot}$5H_2O$ as an electrolyte, the effect of deposition time, current density and concentration of an additive on film properties were investigated. Film thickness, particle size and resistivity were analyzed by Alpha Step, SEM and 4 - point probe measurement respectively. The deposition rate was about $0.5-0.6\mu\textrm{m}$/min at $2A/dm^2$ and the particle size increased with increasing current density. The resistivities of electro-deposited copper films were about $3-6{\mu}{\Omega}{\cdot}$cm for the particle size above $4000{\AA}$. By the addition of 0.2 g/l gelatin, the particle size was reduced to less than $0.1{\mu}m $ and selective plugging of copper on submicron contacts could be successfully achieved.