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Study on Synthesis of Fine Copper Powder by Electro-refining from Copper Containing Sludge

동(Cu) 함유 슬러지로부터 동 전해정련을 이용한 미세 동 분말 합성에 관한 연구

  • Received : 2018.11.09
  • Accepted : 2018.12.06
  • Published : 2018.12.28

Abstract

In this study, copper was recovered from copper containing sludge by selectively controlling electro-refining process conditions in copper sulfate electrolyte solution. Electro-refining process was performed by LSV (Linear Sweep Voltammetry) result according to copper sulfate electrolyte solution concentration, applied current density, additive type and concentration. SEM (Scanning Electron Microscope) and PSA (Particle Size Analyzer) were used to analyze the shape and size of copper powder. In the 0.1 ~ 0.4 M copper sulfate electrolyte solution without organic additives, the copper powder size decreased as the applied current density became closer to the limiting current density and the copper powder size tended to decrease in 0.2 ~ 0.3 M copper sulfate electrolyte solution. In addition, when the shape and size of the copper powder were analyzed by adding various types and concentrations of organic additives to the previous experimental, fine spherical copper powder having the smallest size (nm) was obtained under the condition of cellulose type additive 2,000 ppm.

본 연구에서는 동 함유 슬러지로부터 회수된 동 조금속을 황산구리 전해액에서 전해정련 공정 조건을 선택적으로 조절함에 따라 초미세 분말 형태의 동을 회수하고자 하였다. 황산구리 전해액 농도, 인가전류밀도, 첨가제 종류 및 농도에 따라 LSV(Linear Sweep Voltammetry)을 이용하여 초미세 분말 제조가 가능한 인가전류밀도 범위를 설정하여 전해정련 공정을 수행 하였다. 이 때 얻어진 분말에 대해 SEM(Scanning Electron Microscope) 및 PSA(Particle Size Analyzer)를 사용하여 동 분말 형상 및 크기를 분석하였다. 유기첨가제를 사용하지 않은 0.1 ~ 0.4 M 황산구리 전해액 조건에서 동 분말 크기는 인가전류밀도가 한계전류밀도에 가까울수록 감소하였고, 0.2 ~ 0.3 M 황산구리 전해액에서 동 분말 크기가 가장 감소하는 경향을 나타내었다. 또한, 위 실험을 통해 얻은 공정 조건을 바탕으로 유기 첨가제 종류 및 농도를 달리 첨가하여 동 분말 표면 형상 및 크기를 분석하였을 때, Cellulose계 첨가제 2,000 ppm 조건에서 가장 작은 크기(nm급)의 양호한 구형 형태 동 분말을 얻을 수 있었다.

Keywords

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Fig. 1. Plots of Cu powder sizes; (a) CuSO4 concentration (b)current density.

Table 1. Results of linear sweep voltammograms as a function of various CuSO4 concentrations

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Table 2. Cu powder shape and size analysis by SEM and PSA; 0.1 M CuSO4 solution

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Table 3. Cu powder shape and size analysis by SEM and PSA ; 0.2 M CuSO4 solution

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Table 4. Cu powder shape and size analysis by SEM and PSA; 0.3 M CuSO4 solution

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Table 5. Cu powder shape and size analysis by SEM and PSA; 0.4 M CuSO4 solution

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Table 6. Linear sweep voltammograms of organic additive of various types and concentrations in 0.2 M CuSO4 solution

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Table 7. Cu powder shape analysis of organic additive of various types and concentrations by SEM in 0.2 M CuSO4 solution

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References

  1. I. Masavetas et al., 2009 : Production of copper powder from printed circuit boards by electrodeposition, Global NEST Journal, 11, pp.241-247.
  2. Younghee Ko Kim and Hyun Baek Ko, 2001 : A study of the recovery of shape-controlled copper oxide from the waste etchant of PCB industry, J. of. Kor. Inst. Resources Recycling, 10(6), pp.15-21.
  3. Yuri F. Guimaraes, Iranildes D. Santos, Achilles J. B. Dutra, 2014 : Direct recovery of copper from printed circuit boards (PCBs) powder concentrate by a simultaneous electroleaching-electrodeposition process, Hydrometallugy, 149, pp.63-70. https://doi.org/10.1016/j.hydromet.2014.06.005
  4. Vijayaram, R., Nesakumar, D. and Chandramohan, K., 2013 : Copper extraction from the discarded printed circuit board by leaching, Res. J. Engineering Sci., 2(1), pp.11-14.
  5. Mecucci A. and Scott K., 2002 : Leaching and electrochemical recovery of copper, lead and tin from scrap printed circuit boards, J. Chem. Technol. Biotechnol., 77, pp.449-457. https://doi.org/10.1002/jctb.575
  6. Younghee Ko Kim and Hyun Baek Ko, 2001 : A study of the recovery of shape-controlled copper oxide from the waste etchant of PCB industry, J. of. Kor. Inst. Resources Recycling, 10(6), pp.15-21.
  7. Sang-hun Lee, Kyoungkeun Yoo, and Jae-chun Lee, 2018 : Preparation of $Cu_2O$ Powder in NaOH solution Using CuCl Obtained from Spent Printed Circuit Boards Etchant, J. Korean Soc. Miner. Energy Resour. Eng., 55(3), pp.194-199. https://doi.org/10.32390/ksmer.2018.55.3.194
  8. K. S. Doh, et al., 1997: A study on the recycling of cupric oxide by using copper-containing wastewater, J. Korea Solid Wastes Engineering Society, 14(7), pp.667-672.
  9. Byung-Su Kim, Lee, Jae-Chun Lee, and Kwang-Ho Lee, 2007 : A novel process for extracting valuable metals from waste electric and electronic scrap using waste copper slag by a high temperature melting method, Journal of the Korean Institute of Resources Recycling, 16(3), pp.27-33.