• 대한전기학회:학술대회논문집
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• 대한전기학회 1993년도 하계학술대회 논문집 B
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• pp.546-549
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• 1993

The correlation between electrical conduct ion and dielectric relaxation properties of copper ion conducting glasses is discussed. The glasses were prepared in the system $CuI-Cu_2S-Cu_2O-MoO_3$ using rapid quenching technique. These glasses have high ionic conductivities at room temperature in the range of $10^{circ}$[S/m], and the conductivities increase with increasing CuI content. The activation energies for conduction are 0.26-0.57 eV. The dielectric relaxation times are 1-10uS, and the activation energy for ion jumping are 0.18-0.41eV. It is shown that the tendency of conduction properties depending on composition of the glass is similar those of dilectric relaxation.

• 한국정밀공학회지
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• 제22권5호
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• pp.175-180
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• 2005

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. In this research, fabrication of micro plasma electrode was carried out using FIB. The one of problems of FIB-sputtering is the redeposition of material including Ga+ ion source during sputtering process. Therefore the effect of the redeposition was verified by EDX. And the micro plasma electrode of copper was fabricated by FIB.

• 한국재료학회지
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• 제15권4호
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• pp.263-270
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• 2005

In order to prepare the uniform copper particles from copper chloride solution, the reduction behavior of copper particles from copper chloride and the effects of reduction agent and dispersing agent was investigated. In the case that 2.56 M of $C_6H_8O_6$ was used as a reduction agent, the highly dispersed Cu particles with sharp size distribution were generated from 0.96M of copper chloride solution, and the size of Cu particles was $6\~10\;{\mu}m$. To form $Cu(NH_3)_4Cl_2$ complex solution, $NH_4OH$ was added in the copper chloride solution before the reductive reaction of Cu ion. The generated Cu particles have a two kind of shape, spherical and rod-like. In the case that $N_2H_4{\cdot}H_2O$ was used as a reduction agent, the very fine spherical Cu particles with the size of $0.2\~0.5\;{\mu}m$ was obtained. Arabic gum as a dispersing agent was more effective than $Na_4P_2O_7{\cdot}10H_2O$.

• 대한지하수환경학회지
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• 제5권1호
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• pp.30-36
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• 1998

저분자량 유기산을 이용한 in-situ flushing 토양세척기법의 실제 현장 적용성 검토를 위해 실험실에서 회분식 실험을 통하여 적당한 세척제를 선정하고 이에 따른 여러 가지 운전변수를 찾아보았다. 대상 중금속으로는 Cu를 택했고, 세척제로는 실제 토양환경에 영향이 비교적 적은 저분자량 유기산인 acetic, citric, oxalic, succinic acid를 이용했다. 유기산을 이용하여 처리한 결과 실험에 사용된 유기산들 모두 1 mM의 저농도에서는 효과를 나타내지 못했고 50 mM 이상의 고농도에서 보다 좋은 제거율을 보였는데, 50 mM과 100mM의 경우 제거율이 큰 차이를 보이지 못했다. citric arid와 oxalic acid의 경우 중성 및 약산성 상태에서 최대의 제거율이 나타났고 특히 citric arid의 경우 87.1%의 높은 제거율을 보였다. 유기산이 없을때는 강산성 상태에서 Cu의 최고제거율이 70% 정도였다. 그러나 각 경우에서의 speciation을 살펴보면 유기산이 없을 경우에는 추출된 Cu의 대부분이 유해한 free ion상태로 존재하게 되고 유기산이 있을 경우에는 추출된 Cu의 대부분이 유기산과 complex를 이룬다는 것을 알 수 있었다.

• Rapid Communication in Photoscience
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• 제4권4호
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• pp.88-90
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• 2015

The design and development of fluorescent chemosensors have recently been intensively explored for sensitive and specific detection of environmentally and biologically relevant metal ions in aqueous solution and living cells. Herein, we report the photophysical results of rhodamine B based fluorogenic and chromogenic receptor for selective copper detection in the complete organic or mixed aqueous-organic media at neutral pH under ambient condition. The ligand exhibited the remarkable increment in the fluorescence emission and UV-visible absorption signal intensities at 587 and 547 nm, respectively, on induction of copper ion while the ligand solution remain completely silent on addition of varieties of other metal ions.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.58.1-58.1
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• 2012

Direct write technologies provide flexible and economic means to manufacture low-cost large-area electronics. In this regard inkjet printing has frequently been used for the fabrication of electronic devices. Full advantage of this method, which is capable of reliable direct patterning with line and space dimensions in the 10 to 100 um regime, is only made with all-solution based processing. Among these printable electronic materials, silver and copper nanoparticles have been used as interconnecting materials. Specially, solutions of organic-encapsulated silver and copper nanoparticles may be printed and subsequently annealed to form low-resistance conductor patterns. In this talk, we describe novel processes for forming silver nanoplates and copper ion complex which have unique properties, and discuss the optimization of the printing/annealing processes to demonstrate plastic-compatible low-resistance conductors. By optimizing both the interconnecting materials and the surface treatments of substrate, it is possible to produce particles that anneal at low-temperatures (< $200^{\circ}C$) to form continuous films having low resistivity and appropriate work function for formation of rectifying contacts.

• 한국분말재료학회지
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• 제3권3호
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• pp.153-158
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• 1996

The exhaust gas from vehicle engines and industrial boilers contains considerable amount of harmful nitrogen monoxide(NO) which causes air pollusion and acid rain. To remove NO catalytic reduction processes using Cu ion exchanged ZSM-5 zeolite have been widely studied. In this study, an attempt was made to fabricate Cu/zeolite catalyst by using high energy ball mill. The catalytic performance of ball milled Cu/ZSM-5 zeolites is analyzed and optimum copper contents was determined. The processing variables were reaction temperature and copper contents. Complete removal of NO gas was obtained at the temperature of 553 K on 10wt.% CU/ZSM-5 mechanically alloyed composite powders. Mechanically alloyed CU/ZSM-5 catalyst showed homogeneous distribution of Cu in ZSM-5.

• 한국진공학회지
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• 제16권2호
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• pp.79-90
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• 2007

저에너지 초고속 표면 처기 이온원, 4개의 마그네트론 스퍼터 캐소드가 부착된 300 mm 폭 다목적 연성 기판 제작을 위한 부피 800 L 용량의 진공 웹코터 원형 (prototype) 장비를 설계 제작하였고, 무접착제 2층 연성 동박 적층 필림을 제작하여 성능을 평가하였다. 2 개의 터보 펌프 및 폴리콜드를 장착한 비코팅 부분인 상실부와 각각 1개씩의 터보 펌프를 사용한 표면 처리 및 코팅 부분인 하실부의 진공 배기 특성을 측정하였다. 패러데이 컵을 사용하여 대면적 이온원의 이온 전류 밀도 및 균일도를 측정하고, 스퍼터 캐소드의 자기장 분포 및 타겟 사용 효율을 조사하였다. 진공 웹코터의 성능 및 각 구성 요소의 특성 조사를 위하여 연성 기판으로는 폴리이미드 (Kapton-E) $38{\mu}m$을 사용하여 여러 가지 가스 이온에 대한표면 처리 조건에 따른 증류수의 접촉각 변화와 화학 성분의 변화를 x-선 분광학을 사용하여 조사하였다. 고밀도 2층 연성 동박 적층 필림 기판을 스퍼터-전기 도금법으로 제작하기 위하여 스퍼터 타겟으로는 Ni-Cr 및 Cu 금속을 사용하여, 각각의 증착율을 직류 전력의 변화 및 롤의 속도에 따라 조사하였고, 전기 도금으로 $9{mu}m$ 까지 동박 적층 필림을 제작한 후 접착력 및 내열성, 내화학성을 측정하여 소형 진공 웹 코터의 특성을 조사하였다.

• Korean Chemical Engineering Research
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• 제51권2호
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• pp.181-188
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• 2013

구리, 코발트, 니켈, 철의 전이금속 이온을 교환한 LTA 골격구조의 UZM-9 제올라이트에서 메탄올이 저급올레핀으로 전환(Methanol-to-Olefin: MTO)되는 반응을 조사하여 전이금속 이온 교환이 촉매의 활성저하에 미치는 영향을 고찰하였다. 전이금속 이온 교환에 따른 UZM-9의 결정구조, 결정 모양, 세공구조, 산성도 변화는 크지 않았다. UZM-9은 둥지 입구가 작아 MTO 반응에서 저급올레핀에 대한 선택도가 높지만, 둥지가 커서 활성중간체인 헥사메틸벤젠 등 폴리메틸벤젠이 쉽게 고리화축합되어 다고리 방향족화합물이 많이 생성되므로 활성저하가 빠르다. 그러나 구리와 코발트 이온을 교환하면 MTO 반응에서 UZM-9의 활성저하가 느려졌다. MTO 반응 중 생성되는 폴리메틸벤젠 양이온 라디칼과 전이금속 이온의 상호작용으로 활성중간체가 안정화되어 활성저하가 느려졌다.

• Bulletin of the Korean Chemical Society
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• 제29권10호
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• pp.1905-1910
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• 2008

The reaction of 3,14-dimethyl-2,6,13,17-tetraazatetracyclo[16.4.0$0^{1.18}.0^{7.12}$]docosane ($L^1$) with formaldehyde in warm methanol yielded 3,14-dimethyl-2,6,13,17-tetraazatetracyclo[16.4.$1^{2.6}.0^{1.18}.0^{7.12}$]tricosane ($L^7$) containing one 1,3-diazacyclohexane subunit. In methanol, $L^7$ readily reacts with $Cu^{2+}$ ion to form [$CuL^7(H_2O)$]$^{2+}$ which is extremely inert against methanolysis. In the solution containing $Ni^{2+}$ ion, however, $L^7$ reacts with methanol to yield [$NiL^3$]$^{2+}$ ($L^3$ = 2-(methoxymethyl)-5,16-dimethyl-2,6,13,17-tetraazatricyclo[16.4.$0^{1.18}.0^{7.12}$]- docosane), in which one N-$CH_2OCH_3$ pendant arm is appended. The copper(II) complex [$CuL^7(H_2O)$]- $(ClO_4)_2{\cdot}3H_2O\;(I{\cdot}3H_2O)$ has a severely distorted trigonal bipyramidal coordination geometry with a 4-5- 6-5 chelate ring sequence. The crystal structure of [$NiL^3$]$(PF_6)_2{\cdot}2H_2O$ (IIb) shows that the N-$CH_2OCH_3$ pendant arm is not coordinated to the metal ion in the solid state. In various solvents (S), however, the nickel(II) complex exists as a mixture of [$NiL^3$(S)]$^{2+}$, in which the N-$CH_2OCH_3$ group as well as S is coordinated to the metal ion, and [$NiL^3$]^{2+}.