• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.151.1-151.1
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• 2017

This work studied the corrosion behavior of AZ31 Mg alloy galvanically coupled with Cu during immersion in 0.1 and 0.5 M NaCl solutions by in-situ observation and galvanic corrosion current measurement using a zero resistance ammeter. The corrosion behavior of AZ31 Mg alloy was also studied by salt spray test. The average galvanic corrosion density during 2 h immersion in 0.1 NaCl solution was found to decrease as an exponential function with increasing the surface area ratios between AZ31:Cu or with increasing the distance between AZ31 and Cu. The corrosion of electrodeposited Cu on AZ31 Mg alloy was concentrated at the area next to Cu (about 5 mm for immersion test and 2 mm for salt spray test) and pitting corrosion was accelerated at the area beyond the severely corroded area by the galvanic coupling effect.

• Journal of the Korean Electrochemical Society
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• v.27 no.1
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• pp.8-14
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• 2024

Austenitic stainless steel 316L has been used a lot of applications because of its high corrosion resistance and formability. In addition, copper brazing is employed to create complex shape of 316L stainless steel for various engineering parts. In such system, copper-based filler metals make galvanic cell at metal/filler metal interface, and it accelerates corrosion of stainless steel. Furthermore, Cu-rich region formed by diffused copper in austenitic stainless steel can promote a pitting corrosion. In this study, we used an ammonia (NH₃) gas to nitride the 316L stainless steel for improving the corrosion resistance. The thickness of the nitride (nitrogen high) layer increased with the treatment temperature, and the surface hardness also increased. The potentiodynamic polarization test showed the improvement of corrosion resistance of 316L stainless steel by enhancing the passivation on nitride layer. However, in case of high temperature nitriding, a chromium nitride was formed and its fraction increased, so that the corrosion resistance was decreased compared to the intact 316L stainless steel.

• Journal of the Korean Chemical Society
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• v.51 no.4
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• pp.305-311
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• 2007

Based on the cyclic voltammograms, potentiodynamic polarizations, transient and steady state Tafel plots and electrochemical impedence spectroscopy, we proposed the copper redox mechanism of the corrosion and passivation in artificial sea water. The copper redox mechanism showed the dependence of the concentration of oxygen in artificial sea water and electrode potentials.

• Journal of Korean Society of Water and Wastewater
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• v.13 no.1
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• pp.140-145
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• 1999

This study was carried out a investigate the effect of chemical cleaning of corrosion product in cooling system made of copper and copper alloy as basic material and used cooling water as pure water. We studied chemical cleaning condition that minimizes the influence on basic material by means of EDTA solution so as to eliminate the slurry in cooling system. As a result, we found that the main components of sludge in cooling system produced by corrosion of copper were $Cu_2O$, CuO, Cu, and Fe. The optimum condition of chemical cleaning was 400 ppm EDTA solution at $60^{\circ}C$.

• Journal of the Korean Society for Heat Treatment
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• v.33 no.4
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• pp.185-192
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• 2020

In this study, materials characterization of pure copper and copper based carbon nano-tube composite prepared by powder metallurgy method were investigated. Prior to evaluate materials characterization, spark plasma sintering processing variables such as sintering temperature, pressure, thickness and diameter of compacts was optimized to ensure the microstructure and materials property of pure Cu and Cu-CNT composite. In addition, corrosion behavior of Cu-based CNT composite produced by powder sintering method was investigated. It was confirmed from this study that the corroded surfaces of the composite shows less dissolution compared with pure copper in 3.5 wt% NaCl solution. The measured corrosion current density (I_corr) indicates improved corrosion property of Cu based composite containing small additions of CNTs in chloride containing media. Micro-galvanic activity between Cu and CNT was not observed in given sintering condition.

• Journal of Environmental Science International
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• v.9 no.6
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• pp.505-509
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• 2000

The purpose of this study was to evaluate the effects of $Ca(OH)_2$ and $CO_2$ additions on the corrosion of metal coupons(ductile iron, galvanized steel, copper and stainless steel). Corrosion rate and released metal ion concentration of ductile iron and galvanized steel decreased by adjusting alkalinity, calcium hardness and pH with $Ca(OH)_2$ & $CO_2$ additions on copper and stainless steel were less than those on ductile iron and galvanized steel. When ductile iron coupon was exposed to water treated with Ca(OH)$_2$&$CO_2$, additions, the main components of corrosion product formed on its surface were $CaCO_3$ and $Fe_2 O_3 or Fe_2 O_4$ which often reduce the corrosion rate by prohibiting oxygen transport to the metal surface.

• Corrosion Science and Technology
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• v.9 no.6
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• pp.276-280
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• 2010

Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.

• Corrosion Science and Technology
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• v.17 no.5
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• pp.211-217
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• 2018

Natural degradation of grounding-electrode in soil environment should be monitored for several decades to predict the lifetime of the grounding electrode for efficient application and management. However, long-term studies for such electrodes have many practical limitations. The conventional accelerated corrosion test is unsuitable for such studies because simulated soil corrosion process cannot represent the actual soil environment. A preliminary experiment of accelerated corrosion test was conducted using existing test standards. The accelerated corrosion test that reflects the actual soil environment has been developed to evaluate corrosion performances of grounding-electrodes in a short period. Several test conditions with different chamber temperatures and salt spray were used to imitate actual field conditions based on ASTM B162, ASTM B117, and ISO 14993 standards. Accelerated degradation specimens of copper-bonded electrodes were made by the facile method and their corrosion performances were investigated. Their corrosion rates were calculated to $0.042{\mu}m/day$, $0.316{\mu}m/day$, and $0.11{\mu}m/day$, respectively. These results indicate that accelerated deterioration of grounding materials can be determined in a short period by using cyclic test condition with salt spray temperature of $50^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.339-342
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• 2003

The corrosion characteristics of Copper by oxidizers in Cu CMP slurry has been investigated. Key experimental variables that has been investigate are the corrosion rate by different oxidizers containing slurry of Cu CMP. Oxidizers in Cu CMP slurry reacts with Cu surfaces to raise the oxidation state of the metal via a reduction-oxidation reaction, resulting in either dissolution of the Cu or the formation of Ta surface film on the metal.[1] When Cu films were corroded adding each oxidizer, corrosion rate increased as much as higher Icorrosion. The corrosion rate of Cu was the largest as added $(NH_4)_2S_2O_8$. The higher content of Urea Hydrogen peroxide was, the higher corrosion rate was measured. Putting in tartaric acid as complexing agent, the corrosion rates of the compounds(Urea hydrogen peroxide+$H_2O_2$) are uniformly. As a result of Cu corrosion by $Cu(NO_3)_2$, the high corrosion rate was determined by even small amounts of $Cu(NO_3)_2$. Consequently, this can be explained by assuming that corrosion by oxidizers has primary effects on the removal rate of Cu and the proper oxidizer needs to be chosen in accordance with relationship of each slurry agent.

• Corrosion Science and Technology
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• v.4 no.1
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• pp.19-22
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• 2005

Two Au-Ag-Cu-Pd dental casting alloys (Au:12% and 20%) used. The test solutions used 0.9 % NaCl solution (isotonic sodium chloride solution), 0.9 % NaCl solution containing 1 % lactic acid, and 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_2S$. The surface of two samples in three sample solutions was not natural discoloration during one year. The alloy containing 12 % gold was easily alloyed and the composition was uniform comparing with the alloy containing 20 % gold. The rest potentials have not a little effect after three months. The kinds of metals could not definitely from the oxidation and reduction waves of metal on the cyclic voltammograms. The dissolutions of gold and palladium were 12 % Au sample in the 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_{2}S$. The pH of solution had an affect on dissolution of copper, and sulfur ion had an affect on dissolution of silver. The copper dissolved amount from 20 % gold sample was about 26 times comparing with that of 12 % gold sample in the 0.9 % solution containing 1 % lactic acid. Corrosion products were silver chloride and copper chloride in NaCl solution, and silver sulfide and copper sulfide in NaCl solution containing $Na_{2}S$.