• Journal of the Korean Crystal Growth and Crystal Technology
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• v.28 no.4
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• pp.175-178
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• 2018

Copper is a well know material for use as heat sink or heat exchanger. However, copper has a considerable low tensile strength and temperature limit. A material that has a good thermal conductivity, low cost, but also excellent mechanical properties are desired. In order to identify the mechanism for the material properties of cast Cu-Fe alloys, $Cu_{50}-Fe_{50}$ (wt.%) alloy was produced by using a high-frequency induction furnace, a typical metal casting process. The Cu-Fe alloy consists of Cu, ${\alpha}$-Fe, ${\gamma}$-Fe with dendrite structures. The crystal structure and microstructure of the prepared $Cu_{50}-Fe_{50}$ alloy were systematically examined using XRD, FE-SEM, EDS and XRF for electrical devices.

• Journal of Electrochemical Science and Technology
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• v.9 no.3
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• pp.202-211
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• 2018

In this work, Fe-Pd alloy films have been electrodeposited on different substrates using an electrolyte containing $[Pd(NH_3)_4]^{2+}$ (0.02 M) and $[Fe-Citrate]^{2+}$ (0.2 M). The influences of substrate and overpotential on chemical composition, nucleation and growth kinetics as well as the electrodeposited films morphology have been investigated using energy dispersive X-ray spectroscopy (EDS), current-time transients, scanning electron microscopy (SEM), atomic force microscopy (AFM) and X-ray diffraction (XRD) patterns. In all substrates - brass, copper and sputtered fluorine doped tin oxide on glass (FTO/glass) - Fe content of the electrodeposited alloys increases by increasing the overpotential. Also the cathodic current efficiency is low due to high rate of $H_2$ co-reduction. Regarding the chronoamperometry current-time transients, it has been demonstrated that the nucleation mechanism is instantaneous with a typical three dimensional (3D) diffusion-controlled growth in the case of brass and copper substrates; while for FTO, the growth mode changes to 3D progressive. At a constant overpotential, the calculated number of active nucleation sites for metallic substrates is much higher than that of FTO/glass; however by increasing the overpotential, the number of active nucleation sites increases. The SEM micrographs as well as the XRD patterns reveal the formation of Fe-Pd alloy thin films with nanostructure arrangement and ultra-fine grains.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.214.2-214.2
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• 2013

Device performance for the 45 and 32 nm node CMOS technology requires the integration of ultralow-k materials. To lower the dielectric constant for PECVD and spin-on materials, partial replacement of the solid network with air (k=1.01) appears to be more intuitive and direct option. This can be achieved introducting of second "labile" phase during depositoin that is removed during a subsequent UV curing and annealing step. Besides, with shrinking line dimensions the resistivity of barrier films cannot meet the International Technology Roadmap for Semiconductors (ITRS) requirements. To solve this issue self-forming diffusion barriers have drawn attention for great potential technique in meeting all ITRS requirments. In this present work, we report a Cu-V alloy as a materials for the self-forming barrier process. And we investigated diffusion barrier properties of self-formed layer on low-k dielectrics with or without UV curing treatment. Cu alloy films were directly deposited onto low-k dielectrics by co-sputtering, followed by annealing at various temperatures. X-ray diffraction revealed Cu (111), Cu (200) and Cu (220) peaks for both of Cu alloys. The self-formed layers were investigated by transmission electron microscopy. In order to compare barrier properties between V-based interlayer on low-k dielectric with UV curing and interlayer on low-k dielectric without UV curing, thermal stability was measured with various heat treatment temperature. X-ray photoelectron spectroscopy analysis showed that chemical compositions of self-formed layer. The compositions of the V based self-formed barriers after annealing were strongly dominated by the O concentration in the dielectric layers.

• Journal of Conservation Science
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• v.35 no.3
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• pp.187-196
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• 2019

Bronzes excavated from a Gulsansa temple site in Gangneung were investigated in order to study the production of technology and provenance in this area. The bronze artifacts were discovered to consist of copper-tin or copper-tin-lead alloys using chemical analysis(EDS and EPMA). The excavated bronzes were manufactured using a casting or hammering process, and a bronze belt was gilded with gold foil. The provenance of 25 bronzes was studied using lead isotope analysis(TIMS and LA-MC-ICPMS). The results reveal the use of raw materials found near the excavated site. The object of this study was to investigate the manufacturing techniques and provenance in Gangneung without the need for a lot of data. Our results will contribute to the study of Gulsansa and bronze artifacts in Goryo(12-13th century).

• Journal of the Korean Magnetics Society
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• v.14 no.5
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• pp.196-200
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• 2004

In order to improve dendritic formation of Nd$_2$Fe$\_$14/B phase in the strip-cast Nd-Fe-B alloys that are frequently used for production of high energy sintered magnets, effect of small substitutional additives such as Cu (0.3～1.0 at. %) and Co (0.5～1.5 at.%) on the phase formation and microstructures of the strip-cast alloys based on Nd$\_$14/Fe$\_$80/B$\_$6/ were investigated. As the amount of Cu addition increased, formation of Nd$_2$Fe$\_$14/B dendrites along the direction normal to the strip surface was suppressed with the reduction of the strip thickness mainly due to the increase of fluidity of the melt. However, both the dendrites and their <001> preferred orientation along the direction normal to the strip surface were improved with the increase of the strip thickness as the amount of Co addition increased. The dendrites became finer after small amount of Cu or Co was added. While small copper additions tended to stabilize the formation of primary Fe, small cobalt additions suppressed it. When small amount of Zr was added, however, the dendrite structures were totally collapsed with excessive grain growth of Nd$_2$Fe$\_$14/B.

• Journal of Powder Materials
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• v.24 no.4
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• pp.302-307
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• 2017

In this study, Fe-Cu-C alloy is sintered by spark plasma sintering (SPS). The sintering conditions are 60 MPa pressure with heating rates of 30, 60 and $9^{\circ}C/min$ to determine the influence of heating rate on the mechanical and microstructure properties of the sintered alloys. The microstructure and mechanical properties of the sintered Fe-Cu-C alloy is investigated by X-ray diffraction (XRD) and field-emission scanning electron microscopy (FE-SEM). The temperature of shrinkage displacement is changed at $450^{\circ}C$ with heating rates 30, 60, and $90^{\circ}C/min$. The temperature of the shrinkage displacement is finished at $650^{\circ}C$ when heating rate $30^{\circ}C/min$, at $700^{\circ}C$ when heating rate $60^{\circ}C/min$ and at $800^{\circ}C$ when heating rate $90^{\circ}C/min$. For the sintered alloy at heating rates of 30, 60, and $90^{\circ}C/min$, the apparent porosity is calculated to be 3.7%, 5.2%, and 7.7%, respectively. The hardness of the sintered alloys is investigated using Rockwell hardness measurements. The objective of this study is to investigate the densification behavior, porosity, and mechanical properties of the sintered Fe-Cu-C alloys depending on the heating rate.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.167-174
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• 2005

Smaller size and higher integration of electronic components make smaller gap between metal conducting layers in electronic package. Under harsh environmental conditions (high temperature/humidity), electronic component respond to applied voltages by electrochemically ionization of metal and metal filament formation, which lead to short failure and this phenomenon is termed electrochemical migration(ECM). In this work, printed circuit board(PCB) is used for determination of ECM characteristics. Copper leads of PCB are soldered by eutectic solder alloys. Insulation breakdown time is measured at $85^{\circ}C,\;85{\%}RH$. CAF is the main mechanism of ECM at PCB. Pb is more susceptible to CAF rather than Sn, which corresponds well to the corrosion resistance of solder materials in aqueous environment. Polarization tests in chloride or chloride-free solutions fur pure metal and eutectic solder alloys are performed to understand ECM characteristics. Lifetime results show well defined log-normal distribution which resulted in biased voltage factor(n=2) by voltage scaling. Details on migration mechanism and lifetime statistics will be presented and discussed.

• Journal of the Korean Society for Heat Treatment
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• v.26 no.5
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• pp.225-232
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• 2013

The influence of aging treatment, addition elements and rolling reduction ratio on the microstructure, mechanical, electrical and bendability properties of Cu-Ni-Si-P-x (x = Fe, Sn, Zn) alloys for connector material application was investigated. SEM/EDS analysis exhibited that Ni2-Si precipitates with a size of 20~100 nm were distributed in grains. Fe, Sn, Zn elemnets in Cu-Ni-Si-P alloy imporved the mechanical strength but it was not favor in increasing of electrical conductivity. As higher final rolling reduction ratio, the strength and electrical conductivity is increased after aging treatment, but it indicated excellent bendability. Especially, Cu-2Ni-0.4Si-0.5Sn-0.1Fe-0.03P alloy show the tensile strength value of 700MPa and the electrical conductivity was observed to reach a maximum of 40%IACS. It is optimal for lead frame and connector.

• Journal of Welding and Joining
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• v.35 no.1
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• pp.43-48
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• 2017

Pulse TIG (Tungsten Inert Gas) welding is often considered the most difficult of all the welding processes commonly used in industry. Because the welder must maintain a short arc length, great care and skill are required to prevent contact between the electrode and the workpiece. Pulse TIG welding is most commonly used to weld thin sections of stainless steel, non-ferrous metals such as aluminum, magnesium and copper alloys. It is significantly slower than most other welding techniques and comparatively more complex and difficult to master as it requires greater welder dexterity than MIG or stick welding. The problems associated with manual TIG welding includes undercutting, tungsten inclusions, porosity, Heat affected zone cracks and also the adverse effect on health of welding gun operator due to amount of tungsten fumes produced during the welding process. This brings the necessity of automation. Hence, In this paper an attempt has been made to build a customerized setup of Pulse TIG welding based on through review of Pulse TIG welding parameters. The cost associated for making automated TIG is found to be low as compared to SPM (Special Purpose machines) available in the market.

• Progress in Superconductivity
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• v.7 no.1
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• pp.64-68
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• 2005

We fabricated Ni-based alloy substrates for YBCO coated conductor using powder metallurgy. Tungsten and copper were selected as alloy elements due to their mutual solubility to the base element of nickel. The alloying elements were mixed with nickel using ball milling and dried in air. The powder mixtures were packed in a rubber mold, cold isostatic pressed 200 MPa and made into rods. The compacted rods were sintered at $1150^{\circ}C$ for 6 hours for densification. It was confirmed by neutron diffraction experiment that W and Cu atoms made complete solid solution with Ni. Lattice constant of nickel alloy increased by $0.004{\AA}$ for 1at. $\%$ W in Ni-W alloy, $0.0006{\AA}$ for 1 at. $\%$ Cu in Ni-W-Cu alloy.