• 한국표면공학회지
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• 제42권3호
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• pp.103-108
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• 2009

The effect of Arsenic in copper-sulfate solutions during electrorefining of copper was investigated using scanning electron microscopy, X-ray diffraction and cyclic voltammetry analysis. Electrodeposition was carried out using Arsenic, Antimony and bismuth addition to sulfate electrolytes: 45 g/l $Cu^{2+}$ and 170 g/l $H_2SO_4$. Arsenic in sulfate electrolytes changed the morphology and structure of the copper deposits as compared with those obtained from impurity free solutions. When arsenic was present in the sulfate electrolytes, $Cu-3$As intermetallic phase was formed locally on the deposits.

• 마이크로전자및패키징학회지
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• 제9권3호
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• pp.1-6
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• 2002

A low temperature process technology of copper thin films has been developed by a chemical vapor deposition technology for multi-level metallzations in ULSI fabrication. The copper films were deposited on TiN/Si substrates in helium atmosphere with the substrate temperature between $130^{\circ}C$ and $250^{\circ}C$. In order to get more reliable metallizations, effects on the post-annealing treatment to the electrical properties of the copper films have been investigated. The Cu films were annealed at the $5 \times10^{-6}$ Torr vacuum condition and the electrical resistivity and the nano-structures were measured for the Cu films. The electrical resistivity of Cu films shown to be reduced by the post-annealing. The electrical resistivity of 2.0 $\mu \Omega \cdot \textrm{cm}$ was obtained for the sample deposited at the substrate temperature of $180^{\circ}C$ after vacuum annealed at $300^{\circ}C$. The resistivity variations of the films was not exactly matched with the size of the nano-structures of the copper grains, but more depended on the contamination of the copper films.

• Transactions on Electrical and Electronic Materials
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• 제5권6호
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• pp.233-236
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• 2004

Copper metallization has been used in high-speed logic ULSI devices instead of the conventional aluminum alloy metallization. One of the key issues in copper CMP is the development of slurries that can provide high removal rates. In this study, the effects of slurry chemicals and pH for slurry dispersion stability on Cu CMP process characteristics have been performed. The experiments of copper slurries containing each different alumina and colloidal silica particles were evaluated for their selectivity of copper to TaN and $SiO_{2}$ films. Furthermore, the stability of copper slurries and pH are important parameters in many industries due to problems that can arise as a result of particle settling. So, it was also observed about several variables with various pH.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.385-385
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• 2010

Copper oxide thin films were deposited on the p-type Si(100) by r.f. magnetron sputtering as a function of different oxygen concentration. The deposited copper oxide thin films were investigated by atomic force microscopy (AFM), scanning electron microscopy (SEM), spectroscopic ellipsometry (SE), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The SEM and SE data show that the thickness of the copper oxide films was in the range of 100-400 nm. AFM images show that the surface morphology was depended on the oxygen ratio. The crystal structure of copper oxide films was changed from metallic copper to copper oxide with increasing oxygen concentration. The oxidation states of Cu 2p and O 1s resulted from XPS were consistent with XRD results.

• 한국재료학회지
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• 제17권10호
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• pp.521-525
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• 2007

The microstructure and mechanical properties of an oxygen free copper processed by accumulative roll bonding(ARB) at low strain rate were studied. The copper sheets were highly strained up to an equivalent strain of ${\sim}6.4$ by ARB process at ambient temperature. The strain rate of the copper during the ARB was $2.6sec^{-1}$. The microstructure and mechanical properties of the ARB-processed copper were compared to those of the specimens processed by ARB at relatively high strain rate ($37sec^{-1}$). The microstructure and mechanical properties of the copper with ARB process was very similar to each other despite of some differences in recovery.

• International Journal of Korean Welding Society
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• 제3권2호
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• pp.46-52
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• 2003

The refinement of microstructure and phase transformation near the interface of pure copper/carbon steel dissimilar metals joints with various friction welding parameters have been studied in this paper. The microstructure of copper and carbon steel joints were changed to be a finer grain compared to those of the base metals due to the frictional heat and plastic deformation. The microstructure of copper side experienced wide range of deformed region from the weld interface and divided into very fine equaxied grains and elongated grains. Especially, the microstructures near the interface on carbon steel were transformed from ferrite and pearlite dual structure to fine ferrite, grain boundary pearlite and martensite due to the welding thermal cycle and rapid cooling rate after welding. These microstructures were varied with each friction welding parameters. The recrystallization on copper side is reason for softening in copper side and martensite transformation could explain the remarkable hardening region in carbon steel side.

• 한국광물학회지
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• 제17권3호
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• pp.209-220
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• 2004

구리 흡착 실험과 MINTEQA2 및 FITEQL3.2 컴퓨터 프로그램을 이용하여 고성군 판곡리에서 산출되는 황토 현탁액의 구리 흡착 특성을 연구하였다 구리 흡착 실험은 pH, 구리 용액의 양, 전해질의 이온 세기를 변화시키면서 실시하였고, 구리의 농도는 유도결합플라즈마분광분석기를 사용하여 분석하였다. 첨가하는 구리 이온의 양과 pH가 증가할수록 흡착되는 구리 이온의 양도 증가한다. 특히 pH가 5.5에서 6.5로 변할 경우 급격한 흡착률의 증가가 있으며, pH 7.5에서 거의 100% 흡착된다. 배경 전해질의 이온 세기에 영향을 받지 않는 것으로 보아 구리 이온은 황토 표면과 내부권 복합체(inner-sphere complex)로써 아주 강한 화학적 결합을 하고 있는 것으로 판단할 수 있다. MINTEQA2 프로그램을 이용하여 구리의 화학종 분포를 계산한 결과, pH가 증가함에 따라 $Cu^{2+}$ 의 농도는 점점 감소하고 $Cu(OH)_2$ 농도는 점점 증가한다. FITEQL3.2 프로그램을 이용하여 황토의 표면을 규산염 광물 자리와 산화염 광물 자리로 나눈 two sites-three pKas 모델을 적용하여 흡착 양상을 모델링한 결과, 구리 용액의 부피가 2～6 mL인 경우 구리 흡착 평형 상수 값을 도출할 수 있었다. 철산화염 광물 반응 자리에 흡착되는 구리의 앙은 pH 4.5～6.5 범위에서 급격한 흡착 양상을 보이다가 그 이상 pH에서는 흡착되는 양이 조금씩 밖에 증가하지 않는다. 규산염 광물 반응 자리에 흡착되는 구리의 양은 구리 용액의 양이 적을 때는 미약하다가 구리 용액의 양이 커질 경우 그 양이 많아진다. 침전에 의하여 제거되는 구리의 양은 광물 표면 자리에 흡착되는 양과 비교하면 아주 적다. 구리 이온에 대한 흡착 친화도는 규산염 광물보다는 철산화염 광물이 더 큰 것으로 판단된다.

• 반도체디스플레이기술학회지
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• 제6권4호
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• pp.1-4
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• 2007

Carbon nanotube oscillators encapsulating copper nanowire were investigated by molecular dynamics simulations. The excess forces due to the carbon-carbon van der Waals interactions are higher than the excess force due to carbon-copper interactions. And the masses of copper atoms are higher than those of carbon atoms. So, the carbon atoms are easier accelerated than the copper atoms. When the encapsulated copper nanowire deforms the encapsulating nanotube, the frequency can not be estimated by the mass-frequency dependence in classical oscillation theory.

• 한국환경과학회지
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• 제9권5호
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• pp.365-368
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• 2000

The antibacterial effect amino acid-copper(II) surfactant on fish pathogens was studied. Fish pathogens of Edwardsiella tarda Vibrio anguillarum Aeromonas hydrophila and Streptococcus sp. were selected cultured in nutrient agar and adjusted at $2{\times}10^5~10^6 CFU/$m\ell$$ in phosphate buffer saline before the addtion of amino acid-copper(II) surfactant with different concentrations. All tested pathogens died within 1 hour with 1 ppm of amino acid-copper(II) surfactant. In comparison with formalin and ET. amino acid-copper (II) surfactnat was more effective in antibacterial capacity.

• 한국환경보건학회지
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• 제19권2호
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• pp.40-45
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• 1993

A solvent extraction system of copper-thiocyanate complex into various types of alkylamines such as secondary, tertiary and quaternary ammonium salt for the determination of trace copper by atomic absorption spectrometry is presented. The maximum extraction of copper shows at 0.1 M-thiocyanate and single extraction with 10 ml of 1% amine-MIBK from 50 ml of aqueous solution is enough to be quantitative for micro amounts of copper. The effect of amine diluents and of diverse ions are also examined.