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http://dx.doi.org/10.3740/MRSK.2007.17.10.521

Microstructure and Mechanical Properties of Oxygen Free Copper Processed by ARB at Low Strain Rate  

Lee, Seong-Hee (Department of Advanced Materials Science and Engineering, Mokpo National University)
Han, Seung-Zeon (Department of Materials Technology, Korea Institute of Materials Science)
Lim, Cha-Yong (Department of Materials Technology, Korea Institute of Materials Science)
Publication Information
Korean Journal of Materials Research / v.17, no.10, 2007 , pp. 521-525 More about this Journal
Abstract
The microstructure and mechanical properties of an oxygen free copper processed by accumulative roll bonding(ARB) at low strain rate were studied. The copper sheets were highly strained up to an equivalent strain of ${\sim}6.4$ by ARB process at ambient temperature. The strain rate of the copper during the ARB was $2.6sec^{-1}$. The microstructure and mechanical properties of the ARB-processed copper were compared to those of the specimens processed by ARB at relatively high strain rate ($37sec^{-1}$). The microstructure and mechanical properties of the copper with ARB process was very similar to each other despite of some differences in recovery.
Keywords
Accumulative roll-bonding; Strain rate; Oxygen free copper; TEM microstructure; Mechanical property;
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Times Cited By KSCI : 3  (Citation Analysis)
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