• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.22 no.9
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• pp.614-619
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• 2010

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of a slimness of the devices, so it is not easy to find the optimal thermal management solution for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint of the applications. In the present study, the silicon flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. The normal isothermal characteristics created by vapor-liquid phase change was confirmed through the experimental study. The cooling device with 70 mm of total length showed 6.8 W of the heat transfer rate within the range of $4{\sim}5^{\circ}C/W$ of thermal resistance. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of the silicon and glass cooling device.

• Journal of the Korean Society of Clothing and Textiles
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• v.36 no.1
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• pp.1-11
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• 2012

This paper reports on a prototype cooling garment applying a cooling module. The cooling module was composed of a Peltier device, a cold sink, a heat sink and two fans. A constant box was used to evaluate the cooling effect of the module. Two cooling modules were attached on each side of the garment. The wear trial was conducted using 10 male subjects in an environmental chamber maintained at $30{\pm}0.5^{\circ}C$, $50{\pm}5%$RH. Subjective sensations of thermal, humidity, and comfort were surveyed. Statistical package SPSS12.0 was used for the t-test and the Wilcoxon signed-rank test. The results showed that most effective cooling module decreased the temperature of the constant temperature box by $-4.9^{\circ}C$. The micro-temperature of the cooling garment with a Peltier device was lower than the control garment during the exercise. In particular, the chest skin temperature was $1.5^{\circ}C$ lower with the cooling garment than the control. The maximum temperature difference was $-2.57^{\circ}C$ on the sides of the $1^{st}$ layer. Subjective thermal sensation from wear trials of the Peltier device attached garment was lower than the control garment. Subjects felt more comfortable with the cooling garment in almost all the periods.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.1-6
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• 2013

3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.

• Progress in Superconductivity and Cryogenics
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• v.19 no.4
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• pp.18-21
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• 2017

We report a method for improving heat exchange between cryo-cooled large-power-dissipation devices and liquid cryogen. Micro-machined monolithic heat sinks were fabricated on a high integration density superconducting Josephson device, and studied for their effect on cooling the device. The monolithic heat sink showed a significant enhancement of cooling capability, which markedly improved the device operation under large dc- and microwave power dissipation. The detailed mechanism of the enhancement still needs further modeling and experiments in order to optimize the design of the heat sink.

• Elastomers and Composites
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• v.59 no.1
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• pp.22-33
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• 2024

Passive radiative cooling is a promising technology for cooling objects without energy input. Passive radiative cooling works by radiating heat from the surface, which then passes through the atmosphere and into space. Achieving efficient passive radiative cooling is mainly accomplished by using materials with high emissivity in the atmospheric window (8-13 ㎛). Research has shown that polymers tend to exhibit high emissivity in this spectral range. In addition to elastomers, other materials with potential for passive radiative cooling include metal oxides, carbon-based materials, and polymers. The structure of a passive radiative cooling device can affect its cooling performance. For example, a device with a large surface area will have a greater amount of surface area exposed to the sky, which increases the amount of thermal radiation emitted. Passive radiative cooling has a wide range of potential applications, including building cooling, electronics cooling, healthcare, and transportation. Current research has focused on improving the efficiency of passive radiative cooling materials and devices. With further development, passive radiative cooling can significantly affect a wide range of sectors.

• Journal of Power System Engineering
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• v.10 no.4
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• pp.11-16
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• 2006

This research is to verify the cooling effect of the acting surface on the rotary motor using heat pipe and conventional cooling fan. In order to show the cooling performance of the rotary motor and heat pipe with the fin-typed heat sink, the surface temperature of the motor and condenser was measured in real time. The experiments were also conducted as for not only cooling device installed with heat pipe only, but with heat pipe and conventional cooling fan simultaneously. The present experiment reveals that the cooling combination of the heat pipe and cooling fan is far superior to the conventional cooling device for the driving motor such as the fin-typed heat sink. When the driving voltage of 20V and 14V were supplied to the driving motor, the cooling performance of the rotary motor with heat pipe was 170% and 500%, respectively better than that without heat pipe on steady state condition.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.39 no.6
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• pp.559-566
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• 2011

This paper presents the flow passage design for a window cooling device, which have a conical poppet valve and an emissive orifice. Computational flow analysis and experiment are conducted according to the poppet strokes. The results show satisfactory flow characteristics that pressure is reduced enough to endure material strength and the flow does not choked inside window. The correction factor of discharge coefficients is found between 2-dimensional analysis and experiments, which is applied to control coolant flow rates of the window cooling device.

• Proceedings of the KAIS Fall Conference
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• 2008.05a
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• pp.163-166
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• 2008

This study developed matt used by thermoelectric device to use both cooling and heating. To develop this system, heating system used sheath heater and cooling system used thermoelectric device. A Flow of water controlled by a capillary tube system made by polymethyl. Results by this system very lowered spending of energy.

• Journal of the Korean Solar Energy Society
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• v.35 no.1
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• pp.1-8
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• 2015

In the present study, the effects of the heat spreader thickness and the heat sink size on the thermal performance of a cooling device for a concentrating photovoltaic (CPV) module were numerically investigated. Numerical simulation was conducted by using the simulation tool ICEPAK, commercial software based on the finite volume method. Numerical results were validated by comparing the existing experimental data. The thermal performance of a cooling device, which consisted of a heat spreader and a natural convective heat sink, was evaluated with varying the heat spreader thickness and the heat sink size. The geometric configuration of the natural convective heat sink, such as the fin height, the fin spacing, and the fin thickness, was optimized by using the existing correlation. The numerical results showed that the thermal performance of the cooling device increased as the heat spreader thickness or the heat sink size increased. Also, it was found that the spreading thermal resistance plays an important role in the thermal performance of the cooling device which has the localized heat source.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.29 no.12
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• pp.645-653
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• 2017

Thermal and flow modeling and fin structure optimization were performed to reduce the weight of an electrical device with a staggered fin. First, a numerical model for thermal and flow characteristics was suggested, and then, the model was verified experimentally. Using the verified model, improvement in cooling performance of the cooling system through the staggered fins was predicted. As a result, 87.5% of total heat generated was dissipated through the cooling fins, and a thermal island was observed in the rotor because of low velocity of the internal air flow through the air gap. In addition, it was confirmed that the staggered fin improves the cooling performance but it also increases the total pressure drop within the cooling system, by maximizing the leading edge effect. Based on this analysis result, the effect of each design parameter on the thermal and flow characteristics was analyzed to select the main optimal design parameters, and multi-objective optimization was performed by considering the cooling performance and the fin weight. In conclusion, the optimized fin structure improved the cooling performance by 7% and reduced the fin weight by 28% without any compromise of the pressure drop.