• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2016년도 춘계학술대회
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• pp.281-283
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• 2016

최근 많은 산업용 기기들은 외부 모니터링과 제어 시스템에 프로토콜 호환성 문제에 직면하고 있다. 본 논문은 산업, 통신 프로토콜 변환 및 모니터링을 지원하기 위해 메인 제어 보드를 제작하였다. 산업용 통신 게이트웨이 모듈은 CAN 버스 및 이더넷 프로토콜을 지원하도록 설계되었다. 메인보드 프로세서는 ATMEGA2560 사용하고, 서브 보드 RS485 시리얼 슬롯 4개를 배치하였다. 이들 슬롯을 통하여 아날로그 및 디지털 I/O를 제공하여 제어 및 모니터링에 사용할 수 있다.

• 한국산학기술학회논문지
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• 제16권8호
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• pp.5513-5521
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• 2015

국내의 저밀도 지선 구간에 적용되고 있는 지상 설비들은 주요 노선과 유사하게 설치되고 운영됨에 따라 운영 효율성 측면에서 적합하지 않은 문제를 가지고 있다. 이에 따라 열차의 안전과 운영 효율성을 도모하기 위해 개발된 차상중심 열차제어시스템은 고가의 지상신호 제어장치 없이 안전한 운행이 가능하도록 한다. 이러한 차상중심 열차제어시스템은 차상제어시스템, 선로변제어시스템, 운행관리시스템으로 구성된다. 본 논문에서는 현장에 차상제어장치와 선로변제어장치를 설치하여 적합성 시험을 비롯하여 통신 및 인터페이스 시험 수행 내용을 기술한다. 설치 검사는 전원, 전압, 케이블 연결, LED 상태 확인 등을 포함한다. 이를 바탕으로 실제와 유사하게 선로전환기, 건널목차단기를 포함한 가상노선에서 다양한 시나리오에 따른 동적 운영 시험을 통해 개발된 시스템의 현장 적용성을 검증한다. 총 7가지 시나리오에 대하여 동적 운영 시험이 수행되었고, 각 시나리오별로 여러 번 시험을 반복하였다. 메인 프로세스 로그를 분석하여 동작별 경과 시간을 계산하였으며, 대부분 수 초 이내에 동작이 이루어짐을 확인하였다. 또한 공인기관 입회하의 현장시험을 통하여 개발된 시스템을 검증하였고 시험성적서를 발급받았다.

• Journal of the Korean Wood Science and Technology
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• 제15권3호
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• pp.44-55
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• 1987

In order to study the effect of sawdustboard combined with plastic chips, 0.5mm($T_1$), 1mm($T_2$), 1.4mm($T_3$) thick nylon fiber. polypropylene rope fiber(RP), and 0.23mm thick moth-proof polypropylene net fiber(NP) were cut into 0.5, 1, 2cm long plastic chips. Thereafter, sawdustboard combined with plastic chips prepared as the above and plastic non-combined sawdustboard(control) were manufactured into 3 types of one-, two-, and three layer with 5 or 10% combination level. By the discussions and results at this study, the significant conclusions of mechanical and physical properties were summarized as follows: 1. The MORs were shown in the order of 3 layer> 2 layer> 1 layer among plastic non-combined boards, and $T_3$ < $T_2$ < $T_1$ < RP (NP(5%) < NP(l0%) among plastic combined boards. In 2cm long plastic chip in 1 layer board, the highest strength through all the composition was recognized. 1 layer board showing the lower strength with 0.5cm plastic chip rendered to the bending strength improvement by 2 or 3 layer board composition. On the other hand, 2 or 3 layer combined with 1, 2cm long polypropylene net fiber chips incurred MOR's conspicuous decrease requiring optimum plastic chip combined level and consideration to combined type. 2. MOE in plastic non-combined 3 layer board exhibited sandwich construction effect by higher resin content application to surface layer in the order of 3layer>1layer>2layer with the highest stiffness of the board combined with polypropylene chip, while nylon chip-combined board had little difference from plastic non-combined board. In relevant to length and layer effect, 3 layer board combined with the 0.5cm long polypropylene net fiber chip in 5% and 10% combined level presented 34-43% and 44-76% stiffness increase against plastic non-combined board(control), respectively. Moreover, in 1 layer board, 30% stiffness increase with 10% against 5% combined level in the 1 and 2cm long polypropylene net fiber chip was obtained. 3. Stress at proportional limit(Spl) showing the fiber relationship (r: 0.81-0.97) between MOR presented in the order of 1 layer<2 layer<3 layer in plastic non-combined board. Correspondingly, combined effect by layer and plastic chip length was similar to MOR's. 4. Differently from previous properties(MOR, MOE, Spl). work to maximum load(Wml) of 2 layer board approached to that of 3 layer board. Conforming the above phenomenon. 2 layer combined with 0.5cm long polypropylene net fiber chip kept the greater work than 1 layer. The polypropylene combined board superior to nylon -and plastic non - combined board seemed to have greater anti - failing capacity. 5. Internal bond strength(IB), in contrast to MOR's tendency. showed in the order of T1

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.131.1-131
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• 2001

At the present time, multimedia chip, internet application, and network equipment is designed by using ARM core. Because it has a good debugging, software compiler and needed low power. We must process a data coding to send a multimedia data by real time. So need to connect software and hardware algorithm. In this research, We design interface for ARM9/AMBA based board using VHDL for these function implementation. The board is used the ARM company´s ARM940T for software function implementation and Xilinx company´s Virtex E2000 for hardware function algorithm. The various hardware algorithm (ME,ME,DCT) block for performance can be implemented on this system.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.93-93
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• 2000

In this study, physical and data link layer protocols of FOUNDATION Fieldbus are implemented. INTEL386EX and 80196KC are used fer the CPU of PC interface board and sensor interface module, respectively The physical layer protocol of FOUNDATION Fieldbus is developed by using FB3050 chip, the fieldbus communication controller ASIC. The data Link layer protocol of FOUNDATION Fieldbus is implemented by software.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 G
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• pp.2324-2326
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• 1998

Plant controller using VME bus is developed. This controller is a PLC designed to control up to 768 I/O units of POSFA PLC which has been developed already by POSCON. In many programming aspects, it adopts IEC 1131, international standard of PLC programming to keep up with international trends. A system software and a controller architecture including CPU board, DSP board and bus extension board are developed to support the IEC 1131, and becomes a base of E.I. controller being developed now.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 추계종합학술대회 논문집
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• pp.449-452
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• 1998

In this study, the basic image-board and algorithm has been developed to extract a road lane by modeling the driving process. The high speed processing enables an image capture, processing and prompt decision making. In order to high speed processing ASIC like FPGA was designed and integrated in one board system. The algorithm enabling road driving must recognize a straight and bend edge separately. The high speed image processing board using FPGA can be used in real-time decision makeing system for road driving and in the machine vision under bad working environments like a coal mine. And it also can be used in the safety control system in subway and in image input system of CCTV and CATV by designing the board to meet various user's needs.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1491-1494
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• 2008

Typically internal mobile LCD display modules are connected to the mobile product baseband PCB with flexible printed circuit board equipped with board-to-board connector. This solution has a drawback of limiting the product concept work to certain solutions that are based on connector size, location, flexible PCB length, bending, etc. in the display module. Also flexible printed circuit board based solutions are not completely optimized from reliability point of view, causing flex circuit board breakings. For the external displays in the PC or Home entertainment market, the cable solution is too expensive and resource demanding. The wireless solution has obvious advantages over reliability, low cost and flexibility. This paper describes a wireless audio-visual interface solution.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 학술대회 논문집 전문대학교육위원
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• pp.80-83
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• 2004

Previously, in order to send information from the local controller to the display board, the hardware or software had to be handled and run through 3-phases, which include the PC-card or PC-add Board, I-F card and Sub board. This study will attempt to design a board that handles information by connecting the USB port of the PC directly to the Sub board. In addition, an MPU will be attached to the previously complex hardware circuit to design a software drive engine module, which allows for the development of new products by modifying only the software engine and not the hardware.

• 전기학회논문지P
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• 제53권1호
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• pp.7-13
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• 2004

Previously, in order to send information from the local controller to the display board, the hardware or software had to be handled and run through 3-phases, which include the PC-card or PC-add Board, I/F card and Sub board. This study will attempt to design a board that handles information by connecting the USB port of the PC directly to the Sub board. In addition, an MPU will be attached to the previously complex hardware circuit to design a software drive engine module, which allows for the development of new products by modifying only the software engine and not the hardware.