• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.05a
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• pp.281-283
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• 2016

Recently, many industrial instruments face the problem of protocol compatibility with the external monitoring and control system. This paper is prepared in the main control board to support the industrial communication protocol conversion, control, and monitoring. The industrial communication gateway module is also designed to ensure that the protocol conversion of CAN bus and Ethernet. The main board processor is used the Atmega2560, and placed 4ea RS485 serial slots for sub-board. One of them is used for communication CAN bus and Ethernet. It provides analog and digital I / O through each of the slots is used for control and monitoring.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.8
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• pp.5513-5521
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• 2015

There is an operational efficiency problem about wayside equipment applied to the domestic low-density branch as the equipment has been installed and operated similarly in the mainline. On-board oriented train control system, which has been developed for train safety and operation efficiency, ensures safe train operation without expensive ground control signal devices. Such system consists of on-board control system, wayside control system, and local control system. In this paper, the details of tests such as suitability test, communication test, and interface test are described by installing the on-board control system and wayside control system in field. Installation tests include checking power, voltage, cable connection, LED status, etc. Field applicability of the developed system is also verified through the dynamic operation tests with diverse scenarios, which are performed on the virtual line similar to the real environment including switch machine and level crossing gate. Dynamic operation tests were conducted for total 7 scenarios, and several tests were repeated for each scenario. The elapsed time for each operation was computed by analyzing main process log, and we could check that each operation was accomplished within several seconds. Furthermore, the developed system was verified through field test with an accredited institute, and testing certificates were issued.

• Journal of the Korean Wood Science and Technology
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• v.15 no.3
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• pp.44-55
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• 1987

In order to study the effect of sawdustboard combined with plastic chips, 0.5mm($T_1$), 1mm($T_2$), 1.4mm($T_3$) thick nylon fiber. polypropylene rope fiber(RP), and 0.23mm thick moth-proof polypropylene net fiber(NP) were cut into 0.5, 1, 2cm long plastic chips. Thereafter, sawdustboard combined with plastic chips prepared as the above and plastic non-combined sawdustboard(control) were manufactured into 3 types of one-, two-, and three layer with 5 or 10% combination level. By the discussions and results at this study, the significant conclusions of mechanical and physical properties were summarized as follows: 1. The MORs were shown in the order of 3 layer> 2 layer> 1 layer among plastic non-combined boards, and $T_3$ < $T_2$ < $T_1$ < RP (NP(5%) < NP(l0%) among plastic combined boards. In 2cm long plastic chip in 1 layer board, the highest strength through all the composition was recognized. 1 layer board showing the lower strength with 0.5cm plastic chip rendered to the bending strength improvement by 2 or 3 layer board composition. On the other hand, 2 or 3 layer combined with 1, 2cm long polypropylene net fiber chips incurred MOR's conspicuous decrease requiring optimum plastic chip combined level and consideration to combined type. 2. MOE in plastic non-combined 3 layer board exhibited sandwich construction effect by higher resin content application to surface layer in the order of 3layer>1layer>2layer with the highest stiffness of the board combined with polypropylene chip, while nylon chip-combined board had little difference from plastic non-combined board. In relevant to length and layer effect, 3 layer board combined with the 0.5cm long polypropylene net fiber chip in 5% and 10% combined level presented 34-43% and 44-76% stiffness increase against plastic non-combined board(control), respectively. Moreover, in 1 layer board, 30% stiffness increase with 10% against 5% combined level in the 1 and 2cm long polypropylene net fiber chip was obtained. 3. Stress at proportional limit(Spl) showing the fiber relationship (r: 0.81-0.97) between MOR presented in the order of 1 layer<2 layer<3 layer in plastic non-combined board. Correspondingly, combined effect by layer and plastic chip length was similar to MOR's. 4. Differently from previous properties(MOR, MOE, Spl). work to maximum load(Wml) of 2 layer board approached to that of 3 layer board. Conforming the above phenomenon. 2 layer combined with 0.5cm long polypropylene net fiber chip kept the greater work than 1 layer. The polypropylene combined board superior to nylon -and plastic non - combined board seemed to have greater anti - failing capacity. 5. Internal bond strength(IB), in contrast to MOR's tendency. showed in the order of T1

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.131.1-131
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• 2001

At the present time, multimedia chip, internet application, and network equipment is designed by using ARM core. Because it has a good debugging, software compiler and needed low power. We must process a data coding to send a multimedia data by real time. So need to connect software and hardware algorithm. In this research, We design interface for ARM9/AMBA based board using VHDL for these function implementation. The board is used the ARM company´s ARM940T for software function implementation and Xilinx company´s Virtex E2000 for hardware function algorithm. The various hardware algorithm (ME,ME,DCT) block for performance can be implemented on this system.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.93-93
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• 2000

In this study, physical and data link layer protocols of FOUNDATION Fieldbus are implemented. INTEL386EX and 80196KC are used fer the CPU of PC interface board and sensor interface module, respectively The physical layer protocol of FOUNDATION Fieldbus is developed by using FB3050 chip, the fieldbus communication controller ASIC. The data Link layer protocol of FOUNDATION Fieldbus is implemented by software.

• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2324-2326
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• 1998

Plant controller using VME bus is developed. This controller is a PLC designed to control up to 768 I/O units of POSFA PLC which has been developed already by POSCON. In many programming aspects, it adopts IEC 1131, international standard of PLC programming to keep up with international trends. A system software and a controller architecture including CPU board, DSP board and bus extension board are developed to support the IEC 1131, and becomes a base of E.I. controller being developed now.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.449-452
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• 1998

In this study, the basic image-board and algorithm has been developed to extract a road lane by modeling the driving process. The high speed processing enables an image capture, processing and prompt decision making. In order to high speed processing ASIC like FPGA was designed and integrated in one board system. The algorithm enabling road driving must recognize a straight and bend edge separately. The high speed image processing board using FPGA can be used in real-time decision makeing system for road driving and in the machine vision under bad working environments like a coal mine. And it also can be used in the safety control system in subway and in image input system of CCTV and CATV by designing the board to meet various user's needs.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1491-1494
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• 2008

Typically internal mobile LCD display modules are connected to the mobile product baseband PCB with flexible printed circuit board equipped with board-to-board connector. This solution has a drawback of limiting the product concept work to certain solutions that are based on connector size, location, flexible PCB length, bending, etc. in the display module. Also flexible printed circuit board based solutions are not completely optimized from reliability point of view, causing flex circuit board breakings. For the external displays in the PC or Home entertainment market, the cable solution is too expensive and resource demanding. The wireless solution has obvious advantages over reliability, low cost and flexibility. This paper describes a wireless audio-visual interface solution.

• Proceedings of the KIEE Conference
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• 2004.07e
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• pp.80-83
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• 2004

Previously, in order to send information from the local controller to the display board, the hardware or software had to be handled and run through 3-phases, which include the PC-card or PC-add Board, I-F card and Sub board. This study will attempt to design a board that handles information by connecting the USB port of the PC directly to the Sub board. In addition, an MPU will be attached to the previously complex hardware circuit to design a software drive engine module, which allows for the development of new products by modifying only the software engine and not the hardware.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.53 no.1
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• pp.7-13
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• 2004

Previously, in order to send information from the local controller to the display board, the hardware or software had to be handled and run through 3-phases, which include the PC-card or PC-add Board, I/F card and Sub board. This study will attempt to design a board that handles information by connecting the USB port of the PC directly to the Sub board. In addition, an MPU will be attached to the previously complex hardware circuit to design a software drive engine module, which allows for the development of new products by modifying only the software engine and not the hardware.