• 연구논문집
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• s.33
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• pp.183-190
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• 2003

Today, We have used many electronic equipment such as computer, TV, cellular phone and so on. These equipment radiate a large amount of EMI(Electromagnetic interference) which is occurred trouble of airplane, medical equipment, communicate equipment, and especially, human health. So, Ni mesh fabrication for EMI shielding by continuous electroforming process was investigated. Continuous electroforming apparatus was made by means of rotating cathode drum. And We investigated the characteristics of two types of Ni electroforming solution. One was made by laboratory and the other was produced by M cooperation. The grain size increased with increasing current density and bath temperature, and decreasing rotating speed of cathode drum. EDX results indicate that the Ni mesh electroformed by the KIMM solution is composed of pure Ni. But the Ni mesh electroformed by the M cooperation solution has Ni and S element. The incorporation of S element in the Ni mesh has a profoundly effect on mechanical properties such as hardness, internal stress and so on.

• Journal of the Korean institute of surface engineering
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• v.38 no.6
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• pp.212-215
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• 2005

Novel continuous electroforming process equipped with a rotating patterned mandrel, soluble/insoluble anode and multiple stage of rolling wheels was proposed to produce precision nickel mesh, which is known as a very efficient electromagnetic interference (EMI) shielding material. Continuously electroformed nickel deposits showed a tendency to form small-sized particles as the plating solution temperature increased and mandrel rotation speeded up and the applied current density decreased. Along the honeycomb patterns of mandrel, nickel was accurately electrodeposited on the surface of rotating mandrel, but quite different visual/structural characteristics were measured on both sides.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.101-101
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• 2003

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.35-38
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• 2008

A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.10a
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• pp.36-36
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• 2006

• Journal of the Korean Ceramic Society
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• v.46 no.3
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• pp.336-343
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• 2009

Nickel oxide thin films exhibit the resistive switching as a function of applied voltages. The switching phenomena involve low and high resistance states after electroforming. The electrical features are believed to be associated with the formation and rupture of filaments. The set and reset behaviors are controlled by the oxidation and reduction of filaments. The indirect evidence of filaments is corroborated by the presence of nanocrystalline nickel oxides found in high-resolution transmission electron microscopy. The insertion of insulating layers seems to control the current-voltage characteristics by preventing the continuous formation of conductive filaments, potentially leading to artificial control of resistive behaviors in NiO-based systems.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.99.1-99.1
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• 2016

The materials for an electronic packaging provide diverse important functions including electrical contact to transfer signals from devices, isolation to protect from the environment and a path for heat conduction away from the devices. The packaging materials composed of metals, ceramics, polymers or combinations are crucial to the device operating properly and reliably. The demand of effective charge and heat transfer continuous to be challenge for the high-speed and high-power devices. Nanomaterials including graphene, carbon nanotube and boron nitride, have been designed for the purpose of exploiting the high thermal, electrical and mechanical properties by combining in the matrix of metal or polymer. In addition, considering the inherent electrical and surface properties of graphene, it is expected that graphene would be a good candidate for the surface layer of a template in the electroforming process. In this talk, I will present recent our on-going works in nanomaterials for microelectronic packaging: 1) porous graphene/Cu for heat dissipations, 2) carbon-metal composites for interconnects and 3) nanomaterials-epoxy composites as a thermal interface materials for electronic packaging.