• 대한수의학회지
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• 제62권1호
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• pp.5.1-5.5
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• 2022

Many countries have imposed regulations relating to concerns that hide contamination will affect the cleanliness of abattoirs. However, South Korea has not indicated any clear criteria. The purpose of this study is to use surrogate bacteria to measure the contamination in abattoirs caused by contaminated cattle hides. The swab contact method and plate count method are used. Surrogate bacteria are found in most internal environments after the final process. These surrogates remained on the carcass even after the final washing process. This paper is the first study in South Korea that use surrogate bacteria to analyze contamination levels in abattoirs.

• 한국지하수토양환경학회:학술대회논문집
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• 한국지하수토양환경학회 2003년도 International Symposium
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• pp.58-69
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• 2003

Soil contamination in the United States is managed using a risk-based decision making process. In other words, we don't ask, 'how much soil contamination can be cleaned up\ulcorner' Instead we ask, 'how much contamination can be safely left in place\ulcorner' The determination of 'safe' levels of contamination is based upon the potential for exposure and the toxicity of the contaminants of concern in soil. Potential for exposure is determined by evaluating potential exposure pathways from source to receptor given current or reasonably anticipated land use. Soil cleanup goals are then calculated for any complete exposure pathways based upon toxicity and the route of exposure. In some cases, institutional or engineering controls are also used to limit the potential for exposure. In order to prevent a continuous degradation of environmental quality, risk-based cleanup approaches must be combined with strong contamination prevention programs. In addition, alternative risk management approaches should be incorporated into an overall risk reduction strategy.erall risk reduction strategy.

• 마이크로전자및패키징학회지
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• 제7권4호
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• pp.23-29
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• 2000

사용되는 metal구분 없이 반도체 공정장비들을 사용함으로써 cross-contamination을 유발시킬 수 있다. 특히, copper(Cu)는 확산이 쉽게 되어 cross-contamination에 의해 수 ppm정도가 wafer에 오염되더라도 트랜지스터의 leakage current발생 요인으로 작용할 수 있기 때문에 Si-IC성능에 치명적인 영향을 미칠 수 있는데, Si-LSI 실험실에서 할 수 있는 공정과 Si-LSI 실험실을 나와 할 수 있는 공정으로 구분하여 최대한 Si-LSI 장비를 공유함으로써 최소한의 장비로 Cu cross-contamination문제를 해결할 수 있다. 즉, 전기도금을 할 때 전극으로 사용되어지는 TiW/Al sputtering, photoresist (PR) coating, solder bump형성을 위한 via형성까지는 Si-LSI 실험실에서 하고, 독립적인 다른 실험실에서 Cu-seed sputtering, solder 전기도금, 전극 etching, reflow공정을 하면 된다. 두꺼운 PR을 얻기 위하여 PR을 수회 도포(multiple coaling) 하고, 유기산 주석과 유기산 연의 비를 정확히 액 조성함으로서 Sn:Pb의 조성비가 6 : 4인 solder bump를 얻을 수 있었다. solder를 도금하기 전에 저속 도금으로 Cu를 도금하여, PR 표면의 Cu/Ti seed층을 via와 PR표면과의 저항 차를 이용하여 PR표면의 Cu-seed를 Cu도금 중에 etching 시킬 수 있다. 이러한 현상을 이용하여 선택적으로 via만 Cu를 도금하고 Ti층을 etching한 후, solder를 도금함으로써 저 비용으로 folder bump 높이가 60 $\mu\textrm{m}$ 이상 높고, 고 균일/고 밀도의 solder bump를 형성시킬 수 있었다.

• Tribology and Lubricants
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• 제31권6호
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• pp.239-244
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• 2015

Chemical mechanical polishing (CMP) is one of the most important processes for enabling sub-14 nm semiconductor manufacturing. Moreover, post-CMP defect control is a key process parameter for the purpose of yield enhancement and device reliability. Due to the complexity of device with sub-14 nm node structure, CMP-induced defects need to be fixed in the CMP in-situ cleaning module instead of during post ex-situ wet cleaning. Therefore, post-CMP in-situ cleaning optimization and cleaning efficiency improvement play a pivotal role in post-CMP defect control. CMP in-situ cleaning module normally consists of megasonic and brush scrubber processes. And there has been an increasing effort for the optimization of cleaning chemistry and brush scrubber cleaning in the CMP cleaning module. Although there have been many studies conducted on improving particle removal efficiency by brush cleaning, these studies do not consider the effects of brush contamination. Depending on the process condition and brush condition, brush cross contamination effects significantly influence post-CMP cleaning defects. This study investigates brush cross contamination effects in the CMP in-situ cleaning module by conducting experiments using 300mm tetraethyl orthosilicate (TEOS) blanket wafers. This study also explores brush pre-treatment in the CMP tool and proposes recipe effects, and critical process parameters for optimized CMP in-situ cleaning process through experimental results.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.204-205
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• 2011

In thin film silicon solar cells, p-i-n structure is adopted instead of p/n junction structure as in wafer-based Si solar cells. PECVD is a most widely used thin film deposition process for a-Si:H or ${\mu}c$-Si:H solar cells. For best performance of thin film silicon solar cell, the dopant profiles at p/i and i/n interfaces need to be as sharp as possible. The sharpness of dopant profiles can easily achieved when using multi-chamber PECVD equipment, in which each layer is deposited in separate chamber. However, in a single-chamber PECVD system, doped and intrinsic layers are deposited in one plasma chamber, which inevitably impedes sharp dopant profiles at the interfaces due to the contamination from previous deposition process. The cross-contamination between layers is a serious drawback of a single-chamber PECVD system in spite of the advantage of lower initial investment cost for the equipment. In order to resolve the cross-contamination problem in single-chamber PECVD systems, flushing method of the chamber with NH3 gas or water vapor after doped layer deposition process has been used. In this study, a new plasma process to solve the cross-contamination problem in a single-chamber PECVD system was suggested. A single-chamber VHF-PECVD system was used for superstrate type p-i-n a-Si:H solar cell manufacturing on Asahi-type U FTO glass. A 80 MHz and 20 watts of pulsed RF power was applied to the parallel plate RF cathode at the frequency of 10 kHz and 80% duty ratio. A mixture gas of Ar, H2 and SiH4 was used for i-layer deposition and the deposition pressure was 0.4 Torr. For p and n layer deposition, B2H6 and PH3 was used as doping gas, respectively. The deposition temperature was $250^{\circ}C$ and the total p-i-n layer thickness was about $3500{\AA}$. In order to remove the deposited B inside of the vacuum chamber during p-layer deposition, a high pulsed RF power of about 80 W was applied right after p-layer deposition without SiH4 gas, which is followed by i-layer and n-layer deposition. Finally, Ag was deposited as top electrode. The best initial solar cell efficiency of 9.5 % for test cell area of 0.2 $cm^2$ could be achieved by applying the in-situ plasma cleaning method. The dependence on RF power and treatment time was investigated along with the SIMS analysis of the p-i interface for boron profiles.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.665-668
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• 2006

Sodium is a serious contamination in LTPS TFT process. It causes the abnormal characteristics of TFT in operation. Contaminated areas can be seen in SEM images, but EDX measurements do not have adequate sensitivity to confirm the presence of superficial sodium residues. We employed SIMS as a fast analysis method to map the non-uniform distribution of sodium on the surface. SIMS can also indicate the thickness of the contamination.

• 한국수산과학회지
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• 제55권5호
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• pp.662-669
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• 2022

The purpose of this study is to test the effects of electrolyzed water treatment on dried-laver Pyropia sp. processing facilities to control microbial contamination. Following the progression of the process to the next step, as well as during the lapse between process operating hours, the contamination level of total viable cell counts (TVC) and total coliform (TC) of laver increased. The TVC increased during the aging step, and after the molding-drying steps were completed, it increased by approximately 2.0 log CFU (colony forming unit)/g. Freshwater used for processing in April had a TVC of 4.31 log CFU/mL, which was more polluted than 2.61 log CFU/mL of seawater. Electrolyzed water was used to treat the sponge used in the laver-molding process, which resulted in a 2 log CFU/mL decrease.The TVC of dried-laver decreased by 1 to 2 log CFU/g when electrolyzed water was applied to the process. In conclusion, application of electrolyzed water in dried-laver processing was shown to be effective in reducing the microbiological contamination of the final product.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2338-2343
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• 2007

The practical studies on the method of particle contamination control for yield enhancement in the cleanroom were carried out. The method of the contamination control was proposed, which are composed of data collection, data analysis, improvement action, verification, and implement control. The partition check method for data collection and data analysis was used in the cellular phone module production lines. And this method was evaluated by the variation of yield loss between before and after improvement action. In case that the partition check method was applied, the critical process step was selected and yield loss reduction through improvement actions was observed. From these results, it is concluded that the partition check method is effective solution for particle contamination control in the cleanroom production lines.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 A
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• pp.470-472
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• 2001

This paper explains the characteristic differences in the process of insulator contamination according to heights. To investigate the contamination characteristics, test insulators are suspended to tower at the heights of 8m, 15m, 33m and 50m. That points stand for distances from insulator to bottom of the 22.9 kV, 154 kV, 345 kV and 765 kV towers, respectively. Generally, the contamination level of transmission lines is determined on the basis of measured value at the height of around 10m due to limitation in measuring. As the contamination level could be affected by the heights and the location of the constructed tower, it is suggested that the measured values should be corrected to minimize errors.

• 한국식품위생안전성학회지
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• 제25권4호
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• pp.333-340
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• 2010

누룽지 제조시설에서 공중낙하균, 작업장 내 시설 및 환경, 제조 종사자, 제조기기 및 주변기구, 원재료, 제조공정별 미생물학적 위해도를 조사하였다. 오염도는 취급하는 재료의 종류와 처리공간의 용도에 따라 차이가 있었다. 원재료를 비롯한 설비와 기구들의 오염은 심각하지 않은 상태이지만 교차오염에 주의할 필요가 있다. 또한 사람의 간섭도가 높은 공정에서 상대적으로 높은 오염도를 나타나 개인위생관리가 중요하다. 누룽지의 제조 공정 중 굽기공정($120{\sim}170^{\circ}C$, 약 10여분)에 의해서 미생물을 억제시킬 수 있기 때문에 굽기공정을 표준화하고 이와 관련된 기구 및 시설에 대한 철저한 관리가 필요하다. 중소규모 식품제조시설에서 미생물학적 오염도 관리를 위해서는 위생시설의 확충도 중요하지만 종사자의 위생에 대한 인식수준을 향상시키는 것이 가장 중요할 것으로 생각된다.