• 한국전산구조공학회논문집
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• 제31권1호
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• pp.23-29
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• 2018

무릎 임플란트에서 접촉압력이 마모에 큰 영향을 미친다. 본 연구에서는 본 연구기관에서 개발한 무릎 임플란트 모델을 이용하여 유한요소해석을 하였다. 연구와 산업에서 실제로 사용하는 조합을 이용하여 총 10가지의 무릎 임플란트의 재료조합에 대한 접촉압력을 분석하였다. 무릎이 30도, 45도 60도 기울어져있을 때의 하중을 가하여 접촉압력을 구하였다. 접촉압력을 계산한 결과 티타늄합금-UHMWPE 조합에서 가장 작은 접촉압력이 나왔다. UHMWPE의 경우 대퇴골부에 어떠한 재료를 사용하여도 접촉압력이 크게 변하지 않았다. 접촉압력이 가장 큰 조합과 작은 조합을 비교하였을 때 0.77% 차이를 보였다. 반면에 Carbon/PEEK 복합재료의 경우 접촉압력이 가장 큰 경우와 작은 경우를 비교하였을 때 5.3% 차이를 보였다. 이를 통해 Carbon/PEEK 복합재료를 베어링부로 사용할 경우 대퇴골부의 재료가 마모에 영향을 미침을 알 수 있다. 본 연구는 무릎 임플란트 마모예측과 마모를 최소화 연구에 도움이 될 것이라 생각한다.

• The Journal of Advanced Prosthodontics
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• 제5권4호
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• pp.428-433
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• 2013

PURPOSE. The present study was aimed to evaluate the influence of implant contact ratio and stiffness of implant-surrounding materials on the resonance frequency analysis (RFA) values. MATERIALS AND METHODS. Seventy resin blocks that had the different amounts (100, 50, 30, 15%) of resin-implant contact (RIC) were fabricated. Ten silicone putty blocks with 100% silicone-implant contact were also made. The implants with ${\phi}5.0mm{\times}13.0mm$ were placed on eighty specimen blocks. The RFA value was measured on the transducer that was connected to each implant by Osstell Mentor. Kruskal-Wallis and Scheffe's tests (${\alpha}$=.05) were done for statistical analysis. RESULTS. The control resin group with 100% RIC had the highest RFA value of 83.9, which was significantly different only from the resin group with 15% RIC among the resin groups. The silicone putty group with 100% contact had the lowest RFA value of 36.6 and showed statistically significant differences from the resin groups. CONCLUSION. Within the limitations of this in vitro study, there was no significant difference in the RFA values among the resin groups with different RIC's except when the RIC difference was more than 85%. A significant increase in the RFA value was observed related to the increase in stiffness of material around implant.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.834-837
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• 2003

In this study, Ohmic contacts make on 3C-SiC using TiN. Ohmic contact resistivity of TiN/3C-SiC was evaluated. Specific contact resistance was calculated by Circular-TLM(transmission line model) method and physics properties were measured using XRD, SEM, respectively. TiN contact is stable at high temperatures and a good diffusion barrier material. The TiN/3C-SiC contacts are thermally stable to annealing temperatures up to $1000^{\circ}C$. The TiN thin-film depostied on 3C-SiC substraes have good electrical properties. Therefore, the TiN/3C-SiC contact can be usefully applied for high-temperature MEMS applications over $500^{\circ}C$.

• 정보저장시스템학회논문집
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• 제10권2호
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• pp.32-38
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• 2014

Heat emission from the laser diode used in the optical disc drive and the defects from the increased temperature at the system have attracted attentions from the field of the information storage device. Thermoelectric refrigerator is one of the fine solutions to solve these thermal problems. The refrigeration performance of thermoelectric device is dependent on the thermoelectric material's figure-of-merit. Meanwhile, high electrical contact resistivity between metal electrode and p- and n-type thermoelectric materials in the device would lead increased total electrical resistance resulting in the degeneracy in performance. This paper represents the manufacturing process of the PbTe-based material which has one of the highest figure-of-merit at medium-high-temperature, ~ 600K to 900 K, and the nickel contact layer for reduced electrical contact resistance at once, and the results showing the decent contact structure and figure-of-merit even after the long-term operation environment.

• Tribology and Lubricants
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• 제28권4호
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• pp.173-177
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• 2012

We used contact resonance force microscopy (CRFM) technique to determine the quantitative elastic properties of multiple materials integrated on the sub micrometer scale. The CRFM approach measures the frequencies of an AFM cantilever's first two flexural resonances while in contact with a material. The plain strain modulus of an unknown or test material can be obtained by comparing the resonant spectrum of the test material to that of a reference material. In this study we examined the following bumping materials for flip chip by using copper electrode as a reference material: NiP, Solder (Sn-Au-Cu alloy) and under filled epoxy. Data were analyzed by conventional beam dynamics and contact dynamics. The results showed a good agreement (~15% difference) with corresponding values determined by nanoindentaion. These results provide insight into the use of CRFM methods to attain reliable and accurate measurements of elastic properties of materials on the nanoscale.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.434-435
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• 2009

The crystalline silicon solar cell where the solar cell market grows rapidly is occupying of about 85% or more. high-efficiency and low cost endeavors many crystalline silicon solar cells. the fabrication processes of high-efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/Ag contact, however, this contact formation processed by expensive materials. Ni/Cu contact formation is good alternative. in this paper, according to temperature Ni silicide makes, produced Ni/Cu contact solar cell and measured conversion efficiency.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 춘계학술대회 논문집
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• pp.338-341
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• 1997

According to reports, it is impossible to make Ohmic Contact with high resistivity p type CdTe or CdZnTe semiconductor theoretically. But it is in need of making Ohmic Contact to fabricate semiconductor radiation detector By electroless deposition method using gold chloride solution, we made Ohmic Contact of Au and p-Cd$_{80}$Zn$_{20}$Te which grown by High Presure Bridgman Method in Aurora Technologies Corporation. We investigated the interface with Rutherford Backscattering Spectrometry and Auger electron spectroscopy. And we evaluated the degree of Ohmic Contact for the Au/CdZnTe interface by the I/V characteristic curve. As a result, we concluded that it showed excellent Ohmic Contact property by tunneling mechanism through the interface.e.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 추계학술대회 논문집
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• pp.63-66
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• 1995

The ohmic characterization of Au/Te/Au/n-GaAs structure is investigated by the application of x-ray diffraction, scanning electron microscopy, Auger electron spectroscopy, the specific contact resistance and I-V measurement. Increasing the annealing temperature, the results of XRD measurement show the sharpening of the Au-Ga peak and the increasing of the intensity of Au peak due to the crystallization. At 400$^{\circ}C$, which is the ohmic onset point, Ga$_2$Te$_3$peak gets evident and GaAs regrowth peak appears for the samples annealed at 500$^{\circ}C$. The variation of shottky contact to ohmic contact is confirmed by the I-V curve transition. The specific contact resistance of 3.8x10$\^$-5/$\Omega$-$\textrm{cm}^2$ is obtained for the sample annealed at 500$^{\circ}C$ and above 600$^{\circ}C$ the specific contact resistance increased due to the decomposition of GaAs substrate.

• 한국생산제조학회지
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• 제25권5호
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• pp.380-385
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• 2016

Railway tracks are repeatedly overstressed and damaged owing to increase in passing tonnage and numerous contact cycles between wheels of train and rails. In order to ensure safe train operation, heat-treated rails are used in addition to regular inspection and maintenance of these rails. Normal rails were treated using ultrasonic nanocrystal surface modification (UNSM) to strengthen the surface of rails. A few changes in surface properties were detected with respect to hardness and compressive residual stress after UNSM treatment. Wear and rolling contact fatigue tests were performed using rails whose surfaces were hardened by UNSM and heat-treated rails. The amount of wear and fatigue life cycles were measured to estimate the effect of UNSM on the rail material. The material of the surfacehardened rail showed improved wear and rolling contact fatigue properties.

• Structural Engineering and Mechanics
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• 제44권1호
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• pp.61-72
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• 2012

The paper is on contact analysis of a spherical ball with a deformable flat, considering the effect of tangent modulus on the contact parameters of a non-adhesive frictionless elastic-plastic contact. The contact analysis of this model has been carried out using analysis software Ansys and Abaqus. The contact parameters such as area of contact between two consecutive steps, volume of bulged material are evaluated from the formulated equations. The effect of the tangent modulus is considered for determining these parameters. The tangent modulus are accounted between 0.1E and 0.5E of materials E/Y value greater than 500 and less than 1750. Result shows that upto an optimal tangent modulus values the elastic core push up to the free surface in the flat. The simulation is also carried out in Abaqus and result provide evidence for the volume of bulged material in the contact region move up and flow into the free surface of the flat from the contact edge between the ball and flat. The strain energy of the whole model is varied between 20 to 40 percentage of the stipulated time for analysis.