• Journal of the Korean Society for Nondestructive Testing
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• v.31 no.2
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• pp.127-133
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• 2011

A LabVIEW program has been developed together with simple infrared thermography(IRT) system to control the lock-in conditions of the system efficiently. The IR imaging software was designed to operate both of infrared camera and halogen lamp by synchronizing them with periodic sine signal based on thyristor(SCR) circuits. LabVIEW software was programmed to provide users with screen-menu functions by which it can change the period and energy of heat source, operate the camera to acquire image, and monitor the state of the system on the computer screen. In experiment, lock-in IR image for a specimen with artificial hole defects was obtained by the developed IRT system and compared with optical image.

• Journal of the Korea Convergence Society
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• v.10 no.12
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• pp.287-292
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• 2019

This paper analyzes the thermal behaviors of genuine discs used in automobiles and discs coming out of tuning products through FEM analysis. Modeling with genuine disk modeling and tuning disks Model-1, Model-2, Model-3 and analyzing the disk rotation speed was set to 1000rpm. When the brake is operated, the thermal behavior of the disk surface, such as the operating temperature caused by the disk and pad contact, the friction surface temperature after the disk stop, and the thermal deformation, were analyzed. When the brake was activated (0-4.5 seconds), the tuning disk showed 34℃ higher than the original disk, and after the disk stopped (40.5 seconds), the tuning disk was analyzed 18℃ lowe, deformation due to the disk heat was deformed by 0.3mm for the tuning disk. Although there is an effect to reduce the fading phenomenon due to the thermal behavior of the pure disk and the tuning disk, it can be observed that there is no significant change in the thermal behavior due to the hole processing and the disk surface processing of the tuning disk.

• Journal of Ocean Engineering and Technology
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• v.16 no.6
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• pp.60-64
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• 2002

This paper describes the machining characteristics of the MoSi$_2$--based composites through the process of electric discharge drilling with various tubular electrodes. In addition to hardness characteristics, microstructures of Nb/MoSi$_2$laminate composites were evaluated from the variation of fabricating conditions, such as preparation temperature, applied pressure, and pressure holding time. MoSi$_2$-based composites have been developed in new materials for jet engines of supersonic-speed airplanes and gas turbines for high-temperature generators. These high performance engines may require new hard materials with high strength and high temperature-resistance. Also, with the exception of grinding, traditional machining methods are not applicable to these new materials. Electric discharge machining (EDM) is a thermal process that utilizes a spark discharge to melt a conductive material. The tool electrode is almost -unloaded, because there is n direct contact between the tool electrode and the work piece. By combining a non-conducting ceramic with more conducting ceramic, it was possible to raise the electrical conductivity. From experimental results, it was found that the lamination from Nb sheet and MoSi$_2$ powder was an excellent strategy to improve hardness characteristics of monolithic MoSi$_2$. However, interfacial reaction products, like (Nb, Mo)SiO$_2$and Nb$_2$Si$_3$formed at the interface of Nb/MoSi$_2$, and increased with fabricating temperature. MoSi$_2$composites, with which a hole drilling was not possible through the conventional machining process, enhanced the capacity of ED-drilling by adding MbSi$_2$, relative to that of SiC or ZrO$_2$reinforcements.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.7-11
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• 2013

As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during bonding. For advanced microchips the use of Cu based wire is risky because the ultrasonic stresses can cause chip damage. This risk needs to be managed by e.g. the use of ultrasound during the impact stage of the ball on the pad ("pre-bleed") as it can reduce the strain hardening effect, which leads to a softer deformed ball that can be bonded with less ultrasound. To find the best profiles of ultrasound during impact, a numerical model is reported for ultrasonic bonding with capillary dynamics combined with a geometrical model describing ball deformation based on volume conservation and stress balance. This leads to an efficient procedure of ball bond modelling bypassing plasticity and contact pairs. The ultrasonic force and average stress at the bond zone are extracted from the numerical experiments for a $50{\mu}m$ diameter free air ball deformed by a capillary with a hole diameter of $35{\mu}m$ at the tip, a chamfer diameter of $51{\mu}m$, a chamfer angle of $90^{\circ}$, and a face angle of $1^{\circ}$. An upper limit of the ultrasonic amplitude during impact is derived below which the ultrasonic shear stress at the interface is not higher than 120 MPa, which can be recommended for low stress bonding.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2006.11a
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• pp.226-229
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• 2006

The safety of on-going ships is one of important concerns in the view of environment and human life. The ship in bad condition is likely to be subjected to accidental loads such as collision. Once she has one or several minor collision damages in the form of circle or ellipse, her ultimate strength under compression or tension load will be reduced. Here, it is important to evaluate the reduction ratio of ultimate strength due to the damage from safety point of view. The problem of strength reduction of a plate with cutout such as opening hole has been treated by many researchers. As a result, a closed-form formula on the reduction of ultimate strength of a plate considering the effect of several forms of cutout was suggested. However, the structure of ships is composed of a plate and a stiffener so-called a stiffened plate, and it is likely to be damaged at a plate and stiffeners together in collision. This paper is to investigate the effect of minor collision damage on ultimate strength of a stiffened plate by using numerical analysis. For this study, the shape of minor collision damage of a stiffened plate was made by using contact algorithm. The deformed shape was used as an initial shape for ultimate stress analysis. Then, a series of nonlinear FE analysis was conducted to investigate the reduction effects of ultimate strength of the stiffened plate. The boundary condition was applied as simply supported at all boundaries, and the tripping of stiffener among failure mode under compression loading was neglected. These results were settled in the form of reduction ratio between ultimate of original intact stiffened plate and that of damaged stiffened plate.

• Journal of the Korean Arthroscopy Society
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• v.6 no.1
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• pp.60-63
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• 2002

Purpose : The purpose of this study was to introduce new femoral fixation technique using a cross-pin and a bioabsorbable interference screw in hamstring ACL reconstruction. Method : Semitendinosus and gracilis were harvested for quadrapled graft. After tibial tunnel had been made, femoral tunnel was made 35 mm in depth. Then the graft passed through the tunnels. Cross-pin was fixed through the drill hole which had been made through upper sleeve of the Rigidfix system. While pulling the graft, bioabsorbable interference screw was fixed through the anteromedial portal. Conclusion : We introduced the new femoral fixation technique using a cross-pin and a bioabsorbable interference screw as a good method with high fixation strength and tight graft-bone contact.

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.4
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• pp.373-379
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• 2010

EMAT has been applied in various fields for flaw detection and material characterization because it has noncontact property in wave generation and a good mode selectivity. Unfortunately, however, EMAT shows low signal to noise ratio relative to commercial contact transducer because of low energy conversion efficiency. If the phase matching through the control of time delay between each coil consisting of the array EMAT is accomplished, it is expected that it will be a solution for the improvement of low signal to noise ratio. In this experiment, the phased array EMATs which consists of 3 or 4 meander coils and one big magnet were fabricated for surface and vertical shear wave generation. Effect of phased delay control on signal directivity and amplitude enhancement was verified. A slit with the depth of 0.5 mm and a side-drill hole of 0.5 mm diameter were clearly detected by fabricated phased array EMATs, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.314-314
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• 2012

The dilute magnetic semiconductors (DMS) have been developed to multi-functional electro-magnetic devices. Specially, the Si based DMS formed by ion implantation have strong advantages to improve magnetic properties because of the controllable effects of carrier concentration on ferromagnetism. In this study, we investigated the deep level states of Fe- and Co-ions implanted Si wafer during rapid thermal annealing (RTA) process. The p-type Si (100) wafers with hole concentration of $1{\times}10^{16}cm^{-3}$ were uniformly implanted by Fe and Co ions at a dose of $1{\times}10^{16}cm^{-2}$ with an energy of 60 keV. After RTA process at temperature ranges of $500{\sim}900^{\circ}C$ for 5 min in nitrogen ambient, the Au electrodes with thickness of 100 nm were deposited to fabricate a Schottky contact by thermal evaporator. The surface morphology, the crystal structure, and the defect state for Fe- and Co- ion implanted p-type Si wafers were investigated by an atomic force microscopy, a x-ray diffraction, and a deep level transient spectroscopy, respectively. Finally, we will discuss the physical relationship between the electrical properties and the variation of defect states for Fe- and Co-ions implanted Si wafer after RTA.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.10
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• pp.5974-5979
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• 2014

Lightweight parts with very uniform precision are manufactured by an indent method and the press technique has been improved. Upon assembly with an indent method, a deformation force due to the compressive force occurs between the pin and hole and the contact surface is affected by damage. Therefore, a 3 dimensional model was made using the CATIA program and the damage on the surface contacted with indent was estimated through the ANSYS program in this study. In the analysis result, the maximum load applied at the PCB plate was 21.3 N when the pin goes through the PCB plate. When PCB plate came out of the pin, the maximum load was 19.24 N. As the structural analysis result, the maximum equivalent stress of Pin 1 was 192.96MPa because the maximum stress occurs at Pin 1 among all parts of this study model. By examining the damage property of the contacted indent and applying this study result to the design of real indentation, the damage can be prevented and the durability can be estimated.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.12
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• pp.152-158
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• 2001

In this paper, we have developed an electro discharge machine for micro drilling driven by a voice coil actuator. Because the voltage signal of the electro-discharging circuit shows a lot of peaks and valleys, the active type low-pass filtering technique is adopted to get the average of the signal. Since the motion of the voice coil is precisely controlled by the error value between the object voltage value and the measured one, it is possible to prevent the mechanical contact between the rotating electrode and the workpiece and to maintain the appropriate machining conditions during the process. The electro-chemical machining technology was also adopted to make small diameter electrodes. Pure water is used as a dielectric. The machining procedure is performed to verify the feasibility of the developed system. It takes about 10 seconds to drill the ${\phi}m$100${\mu}m$ hole to the 100${\mu}m$ thickness stainless steel plate. The machining time depends on the values of the resister and the capacitor. There may exist the optimal values of time constant and the tendency is displayed In the appendix.