• 제목/요약/키워드: consumable

검색결과 139건 처리시간 0.029초

부품재활용이 허용될 때 목표운용가용도 조건을 갖는 소모성 동시조달부품의 구매량 결정 (Provisioning Quantity Determination of Consumable Concurrent Spare Part with Objective Availability Limitation under Cannibalization Allowed)

  • 오근태;김명수
    • 한국신뢰성학회지:신뢰성응용연구
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    • 제4권2호
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    • pp.91-104
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    • 2004
  • In this paper we consider the concurrent spare part(CSP) requirements problem of new equipment system. When a part fails, the part is replaced and the repair of failed part is impossible and cannibalization is allowed. We assume that the failure of a part knows a Poisson process. The operational availability concept in CSP is defined, and derive a formula to calculate the operational availability using expected machine operating time during CSP period. A mathematical model is derived for making an CSP requirement determination subject to the constraint of satisfying any given operational availability limitation and an heuristic solution search procedure is derived. An illustrative example is shown to explain the solution procedure.

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실리카 슬러리의 희석과 연마제의 첨가가 CMP 특성에 미치는 영향 (Effects of Diluted Silica Slurry and Abrasives on the CMP Characteristics)

  • 박창준;김상용;서용진
    • 한국전기전자재료학회논문지
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    • 제15권10호
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    • pp.851-857
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    • 2002
  • CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi~level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40%. So, we focused how to reduce the consumption of raw slurry In this paper, we presented the pH changes of diluted slurry and pH control as a function of KOH contents. Also, the removal rates of slurry with different dilution ratio were investigated. Finally, the CMP characteristics were discussed as a function of silica (SiO$_2$) abrasive contents.

Development of Multiple CMP Monitoring System for Consumable Designs

  • Park, Sun-Joon;Park, Boum-Young;Kim, Sung-Ryul;Jeong, Hae-Do;Kim, Hyoung-Jae
    • Transactions on Electrical and Electronic Materials
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    • 제8권1호
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    • pp.11-14
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    • 2007
  • Consumables used in Chemical Mechanical Polishing (CMP) have been played important role to improve quality and productivity. Since the properties of consumables constantly change with various reasons, such as shelf time, manufactured time, lot to lot variation from supplier and so on, CMP results are not constant during the process. Also, CMP process results are affected by multiple sources from wafer, conditioner, pad and slurry. Therefore, multiple sensing systems are required to monitor CMP process variation. In this paper, the authors focus on development of monitoring system for CMP process which consist of force, temperature and displacement sensor to measure the signal from CMP process. With monitoring systems mentioned above, complex CMP phenomena can be investigated more clearly.

Development of a User-Friendly Automatic Control System for Electro-Slag Remelting Process

  • Lim, Tae-Gyoon;Reeu, Chang-Woo;Boo, Kwang-Suk
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2001년도 ICCAS
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    • pp.97.5-97
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    • 2001
  • This paper presents development of a user-friendly automatic control system for ESR(Electro-Slag Remelting or Refining) process. It is a second-phase refining one, commonly applied to production of high-purity specialty steel. A primarily refined castingot acts as a consumable electrode and melts by the electric resistance heat generated when high current is induced through a slag bath. The quality of product is evaluated by its chemical composition, purity, micro-structure, uniformity, mechanical property, etc. To meet the standards, above all things, the process should be kept sound and the melt rate should track the optimum profile irrespective of environment variations. Current ESR system is manually operated ...

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수요율이 높은 제품의 다단계 분배정책에 관한 연구 (A Study on the Multi-Level Distribution Policy of High Demand Rate Goods.)

  • 유형근;김종수
    • 산업경영시스템학회지
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    • 제17권31호
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    • pp.59-72
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    • 1994
  • This paper deals with ordering policies of consumable goods which have large demand rates in a multi-level distribution system. The system we are concerned consists of one Central Distribution Center(CDC) and N non-identical Regional Distribution Centers(RDCs) which have different demand rates, minimum fillrates, leadtimes, etc. The customer demand on the RDC is stationary poisson and the RDCs demand on the CDC is superposition of Q-stage Erlang distributions. We approximate the RDCs and CDC demand distribution to nomal in order to enhance the efficiency of algorithm. The relevant costs include a fixed ordering cost and inventory holding cost, and backorder cost. The objective is to find a continuous-review ordering policy that minimizes the expected average costs under constraints of minimum fill rates of RDCs and maximum allowable mean delay of CDC. We developed an algorithm for determining the optimal ordering policies of the CDC and the RDCs. We verified and compared the performance of the algorithm through the simulation using the algorithm result as the input parameters.

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3wt% Si 첨가강의 레이저용접부 성형성에 미치는 용접변수의 영향 (Effect of Laser Welding Variables on the Formability of Si Added Steel Welds)

  • 박준식;우인수;이종봉
    • Journal of Welding and Joining
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    • 제24권4호
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    • pp.15-21
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    • 2006
  • The aim of present study is to investigate the effect of welding parameters and heat treatment conditions on the formability of the $CO_2$ laser welded silicon steel sheet. It was found that there is optimum range of the heat input ($0.6{\sim}0.7kJ/cm$) and gap distance ($0.125{\sim}0.150mm$) for the high tensile strength and the avoidance of the fracture in weld metal. Also, it was essential fur the improvement of formability to perform pre- and post-welding heat treatment which cause the uniform mixture of base metal and welding consumable.

Si 첨가강의 레이저용접부 성형성에 미치는 용접변수의 영향 (Effect of laser welding variables on the formability of Si added steel welds)

  • 박준식;우인수;이종봉
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2006년도 춘계 학술대회 개요집
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    • pp.121-123
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    • 2006
  • The aim of present study is to investigate the effect of welding parameters and heat treatment conditions on the formability of the laser welded silicon steel sheet. It was found that there is optimum range of the heat input ($0.6{\sim}0.7kJ/cm$) and gap distance ($0.125{\sim}0.150mm$) for the high tensile strength and the avoidance of the fracture in weld metal, Also, it was essential for the improvement of formability to perform pre- and post-welding heat treatment which cause the uniform mixture of base metal and welding consumable.

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심랭식공기분리공정에서 질소증류탑의 엑서지 해석 (Exergy Analysis of Nitrogen Distillation Column in the Cryogenic Air Separation Process)

  • 용평순;이성철
    • 한국초전도ㆍ저온공학회논문지
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    • 제4권1호
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    • pp.145-150
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    • 2002
  • The distillation column is one of large energy consumable units in the cryogenic air separation process and the accurate energy analysis of this unit is necessary for choice of energy saving process. In this work, the energy method was adopted for energy analysis of a cryogenic nitrogen distillation column. In order to designing the energy saving distillation column, the exergy distribution of feed air, exergy efficiency and exergy loss for process condition was investigated and the optimal process condition to minimize the exergy loss was found. The result from this work can be used as a guideline for the choice of the process design conditions and efficiency improvement of cryogenic distillation column.

희석된 슬러리가 CMP 특성에 미치는 영향 (The Effects of Diluted Slurry on the CMP Characteristics)

  • 박창준;박성우;이경진;김기욱;정소영;김철복;최운식;김상용;서용진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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    • pp.18-22
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    • 2002
  • CMP(chemical mechanical polishing) process has attracted as an essential technology of multilevel interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40%. So, we focused that it has how to reduce the consumption of raw slurry. In this paper, we presented the pH changes of diluted slurry and pH control as a function of KOH contents. Also, the removal rates of slurry with different dilution ratio was investigated. Finally, CMP the characteristics as a function of silica($SiO_2$) abrasive contents were discussed.

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탈이온수로 희석된 실리카 슬러리에 알루미나 연마제가 첨가된 혼합 연마제 슬러리의 CMP 특성 (Chemical Mechanical Polishing Characteristics of Mixed Abrasive Slurry by Adding of Alumina Abrasive in Diluted Silica Slurry)

  • 서용진;박창준;최운식;김상용;박진성;이우선
    • 한국전기전자재료학회논문지
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    • 제16권6호
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    • pp.465-470
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    • 2003
  • The chemical mechanical polishing (CMP) process has been widely used for the global planarization of multi-layer structures in semiconductor manufacturing. The CMP process can be optimized by several parameters such as equipment, consumables (pad, backing film and slurry), process variables and post-CMP cleaning. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, the slurry dominates more than 40 %. In this paper, we have studied the CMP characteristics of diluted silica slurry by adding of raw alumina abrasives and annealed alumina abrasives. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.