• Title/Summary/Keyword: conductivity ink

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Porosity Control in LSM Electrode Formation in Layered Plannar SOFC Module (적층 평판형 SOFC에서 LSM 전극의 기공 제어)

  • Lee, Won-Jun;Yeo, Dong-Hun;Shin, Hyo-Soon;Jeong, Dea-Yong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.27 no.12
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    • pp.866-870
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    • 2014
  • In solid oxide fuel cell system, yttria-stabilized zirconia is generally adopted as the electrolyte, which has high strength and superior oxygen ion conductivity, and the air electrode and the fuel electrode are attached to this. Recently, new structure of 'layered planar SOFC module' was suggested to solve the reliability problem due to the high temperature stability of a sealing agent and a binding material. In this study to materialize the air electrode in a layered planar SOFC module, the LSM ink was coated to form homogeneous electrode in the channel after the ink preparation. As the porosity control agent, PMMA or active carbon powder was adopted with use of a commercial dispersant in ethanol. The optimal amounts of both the porosity control agents and the dispersant were determined. Four (4) vol% of the dispersant for the LSM-PMMA case and 15 vol% for LSM-carbon powder showed the lowest viscosities respectively to indicate the best dispersed states of the slurries. With PMMA and carbon powder, sintered LSM ink shows the relatively homogeneous distributions of pores and with increases of the agents, the porosities increased in both cases. From this, it can be thought that the amount of the PMMA or carbon powder could be used to control the porosity of the LSM ink.

Laser Sintering of Inkjet-Printed Silver Lines on Glass and PET Substrates (유리와 PET 기판에 잉크젯 인쇄된 실버 도선의 레이저 소결)

  • Kim, Myong-Ki;Kang, Heui-Seok;Kang, Kyung-Tae;Lee, Sang-Ho;Hwang, Jun-Young;Moon, Seung-Jae
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.34 no.11
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    • pp.975-982
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    • 2010
  • In this study, the laser sintering of inkjet-printed silver lines was evaluated. Silver-nanoparticle ink and a drop-ondemand (DOD) inkjet printer were used for printing on glass and polyethylene terephthalate (PET) substrates with various thicknesses. To sinter the printed silver nanoparticles, the silver layer printed on the transparent substrates was irradiated by focused CW laser beams that were incident normal to the substrates; the irradiation was carried out for various beam intensities and for various irradiation times. The electrical conductivity of the laser-sintered silver patterns was measured and compared with the conductivity of silver patterns sintered by using an oven. The increase in the temperature caused by laser irradiation was also calculated on the basis of the laser beam intensity, irradiation time, surface reflectivity, and thermophysical property of the substrate in order to estimate the increase in the electrical conductivity caused by laser sintering.

Preliminary Works of Contact via Formation of LCD Backplanes Using Silver Printing

  • Yang, Yong Suk;You, In-Kyu;Han, Hyun;Koo, Jae Bon;Lim, Sang Chul;Jung, Soon-Won;Na, Bock Soon;Kim, Hye-Min;Kim, Minseok;Moon, Seok-Hwan
    • ETRI Journal
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    • v.35 no.4
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    • pp.571-577
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    • 2013
  • The fabrication of a thin-film transistor backplane and a liquid-crystal display using printing processes can eliminate the need for photolithography and offers the potential to reduce the manufacturing costs. In this study, we prepare contact via structures through a poly(methyl methacrylate) polymer insulator layer using inkjet printing. When droplets of silver ink composed of a polymer solvent are placed onto the polymer insulator and annealed at high temperatures, the silver ink penetrates the interior of the polymer and generates conducting paths between the top and bottom metal lines through the partial dissolution and swelling of the polymer. The electrical property of various contact via-hole interconnections is investigated using a semiconductor characterization system.

A new evaluation method of UV curing process by using electrical properties (I) (전기적 특성을 이용한 UV 경화 프로세스에 대한 새로운 평가방법(I))

  • Lee, Mun-Hag;Kim, Sung-Bin;Lee, Tae-Hoon;Park, Seong-Soo;Son, Se-Mo
    • Journal of the Korean Graphic Arts Communication Society
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    • v.21 no.2
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    • pp.55-65
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    • 2003
  • A novel evaluation method is investigated for UV curing process in printing system. The method is based on the measurement of conducivity change by the photopolymerization of UV curable inks and paints. It is found that the decrease of conductivity is caused by photopolymerization of epoxy monomer during UV curing process of ink film and the by the rate of UV curing. It is possible to make the dynamical evaluation the curing rate of UV curable ink in curing process by this method.

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High performance OTFT using PEDOT:PSS on plastic substrate by inkjet printing

  • Lee, Myung-Won;Choi, Jae-Chul;Park, Jong-Seung;Song, Chung-Kun
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.874-876
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    • 2009
  • This is a report on fabrication and electrical characteristics of pentacene OTFT that uses conducting PEDOT/PSS as source drain electrodes. We demonstrate enhanced conductivity of PEDOT/PSS film with glycerol and optimize properties for ink jet printing. We also present the application of oxygen plasma technique in order to favor selective spreading for subsequent inkjet printing.

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A Study of Substrate Surface Treatment and Metal Pattern Formation using Inkjet Printing Technology (잉크젯 프린팅 기술을 이용한 기판 표면처리와 금속 패턴 형성에 관한 연구)

  • Jo, Yong-Min;Park, Sung-Jun
    • Journal of ILASS-Korea
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    • v.17 no.1
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    • pp.20-26
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    • 2012
  • Inkjet printing is one of the direct writing technologies and is able to form a pattern onto substrate by dispensing droplets in desired position. Also, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. To form a metal pattern, it must be harmonized with conductive nano ink, printing process, sintering, and surface treatment. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense $20-40{\mu}m$ diameter droplets and silver nano ink which consists of 50 nm silver particles. In addition, hydrophobic treatment of surface, overlap printing techniques, and sintering conditions with changing temperature and times to achieve higher conductivity.

Influence of Micro Pattern Geometry and Printing and Curing Conditions in Gravure Printing on Printing Performance When Using Conductive Ink (패턴 형상, 인쇄 및 건조 조건이 전도성 잉크를 이용한 그라비아 인쇄 결과물의 성능에 미치는 영향)

  • Ahn, Byoung-Joon;Han, Kyung-Joon;Ko, Sung-Lim
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.3
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    • pp.263-271
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    • 2010
  • e-Printing is a new manufacturing technology for electronic products and is based on traditional printing technology. The electronic products require a large area to facilitate printing and to be economical. A gravure printing system that supports a roll to roll (R2R) manufacturing process can be used to reduce the cost and to achieve the required accuracy. Many factors such as drying method, drying temperature, tension,-printing velocity, ink viscosity, ink conductivity, pattern accuracy, and dot geometry influence the performance of printed electronics. These factors are closely interrelated. The optimum condition for printing must be determined to enhance the performance of the printed electronics. In this study, lines and areas are printed using a gravure printer with conductive ink under different conditions of the above mentioned factors. The results are analyzed to investigate the influence of various factors on the performance of the printed electronics.

Fabrication of All-Solution Processed Transparent Silver Nanowire Electrode Using a Direct Printing Process

  • Baek, Jang-Mi;Lee, Rin;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.641-641
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    • 2013
  • We report the transparentsilver nanowire electrode fabricated by a direct printing process, liquid-bridge-mediated nanotransfer molding. We fabricated silver nanowire arrays by liquidbridge- mediated nanotransfer molding using the silver nanoparticle ink and PEDOT:PSS polymer. Weinvestigated the formation of silver nanowire arrays by SEM and transmittance of the transparent silver nanowire electrode. We also measured the conductivity to confirm the potential of our approach.

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The ink jet printing of high conductivity circuits on various substrates using polymer capped nano-particle silver

  • Edwards, Charles O.;Howarth, James;James, Anthony
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.814-816
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    • 2005
  • In this paper, we describe how specially developed polymer capped, nano-particle silver inks can be used to print circuitry for applications like displays, RFID antennas and "disposable electronics". The requirements of printing on temperature sensitive flexible substrates (such as polymer films and papers) that require low temperature curing is also discussed.

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Enhancement of Electrical Conductivity for Ag Grid using Electrical Sintering Method (정전류 전기 소결법을 이용한 Ag 전극 배선의 전도성 향상)

  • Hwang, Jun Y.;Moon, Y.J.;Lee, S.H.;Kang, K.;Kang, H.;Cho, Y.J.;Moon, S.J.
    • 한국신재생에너지학회:학술대회논문집
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    • 2011.05a
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    • pp.114.1-114.1
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    • 2011
  • Electrical sintering of the front electrode for crystalline silicon solar cells was performed applying a constant DC current to the printed lines. Conducting lines were printed on glass substrate by a drop-on-demand (DOD) inkjet printer and silver nanoparticle ink. Specific resistance and microstructure of sintered silver lines and were measured with varying DC current. To find the relation between temperature increase with changing applied current and specific resistance, temperature elevation was also calculated. Sintering process finished within a few milliseconds. Increasing applied DC current, specific resistance decreased and grain size increased after sintering. Achieved minimum specific resistance is approximately 1.7 times higher than specific resistance of the bulk silver.

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