• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.04a
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• pp.22-22
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• 2006

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.1
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• pp.135-139
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• 2015

We present a fine patterning method of conductive lines on polyimide (PI) and glass substrates using silver (Ag) nanoparticles based on laser scanning. Controlled laser irradiation can realize selective sintering of conductive ink without damaging the substrate. Thus, this technique easily creates fine patterns on heat-sensitive substrates such as flexible plastics. The selective laser sintering of Ag nanoparticles was managed by optimizing the conditions for the laser scan velocity (1.0-20 mm/s) and power (10-150 mW) in order to achieve a small gap size, high electrical conductivity, and fine roughness. The fabricated electrodes had a minimum channel length of $5{\mu}m$ and conductivity of $4.2{\times}10^5S/cm$ (bulk Ag has a conductivity of $6.3{\times}10^5S/cm$) on the PI substrate. This method was used to successfully fabricate an organic field effect transistor with a poly(3-hexylthiophene) channel.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.43 no.1
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• pp.17-22
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• 2011

The conventional coated paper has many functional problems for printed RFID tag. This study was carried out in order to evaluate the effect of coating color components on conductivity of printed coated paper. It has been well known that the efficiency of printed RFID tag is influenced by surface properties of substrate. The required properties for suitable substrate of printed RFID tag are high smoothness and waterproof property. In this study high grammage base paper surface sized with PVA was used. Coated paper was manufactured with five different formulations. Types of coating pigments and dosage of latex were varied. It was obtained high smoothness and also less binder demand with clay than GCC. On the other hand, suitable surface resistance and smoothness of coated paper for RFID tag was obtained with 20% of latex. Besides it shows the possibility of using coated paper for printed RFID tag.

• Textile Coloration and Finishing
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• v.33 no.4
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• pp.202-209
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• 2021

Natural dyes are more expensive than synthetic dyes and the dyeing process, which is mainly immersion of dye, is complicated. For this reason, relatively small-scale production methods were predominant. However, awareness and interest in environmental sustainability is rising globally, and the use of synthetic dyes causes various environmental problems such as wastewater and CO₂ emission, so the consumption of natural dyes is increasing. In addition, interest in digital textile printing, an eco-friendly dyeing method that can produce products of various designs and uses less water, is growing. In this study, natural indigo dye (Indigofera tinctoria) was used as a raw material for Digital Textile Printing ink, and ¹⁴C (Biocarbon) present in it was measured to confirm whether it was derived from natural ingredients. The performance was confirmed by testing the pH, viscosity, electrical conductivity, surface tension, and particle size analysis of natural indigo ink. In addition, the performance of natural indigo DTP ink and printing fabric was evaluated by inspecting the change in color fastness and corresponding index substances before and after digital printing with natural indigo DTP ink on textiles. Through this, the possibility of commercialization of DTP ink and printing fabric using natural indigo was confirmed.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.654-656
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• 2008

We enhanced the conductivity of PEDOT-PSS by mixing with glycerol and fabricated the low contact resistance of source and drain[S/D] electrodes of OTFT with PEDOT-PSS by ink-jetting printing. The contact resistance was much smaller by seven times than Au with $200k{\Omega}$ at $V_G=-5V$. For the bottom contacted OTFTs, the performance was comparable to OTFTs with Au electrodes with the field effect mobility of $0.2\;cm^2/V s$.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.206.1-206.1
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• 2014

최근 전자 장비의 금속 전도성 패턴 제작에 있어서 직접적인 프린트가 가능한 프린팅 기술이 기존의 복잡한 photolithography 를 대체할 기술로 주목 받고 있다. 이와 함께 금속 전도성 패턴 제작에 사용되는 고가의 전도성 물질인 Ag ink 및 paste 를 저가의 Cu ink 및 paste 로 대체하기 위한 연구가 진행되고 있다. 하지만 일반적으로 copper 는 대기 중 에서 쉽게 산화되어 높은 저항을 야기시킨다. 따라서 Cu ink 또는 paste 를 제작할 때 copper nanoparticles 을 유기 용매에 분산하여 inert atmosphere에서 합성하거나 [1] copper ink 또는 paste 를 substrate 에 프린트하여 reduction atmosphere 에서 소성시킨다 [2]. 이번 연구에서 Cu paste 를 유리 기판에 screen printing 하여 혼합가스(질소 95%, 수소 5%)와 질소 가스 분위기에서 소성하여 Cu 전극의 소성 거동과 전기적 특성을 분석하였다. 4-point probe를 통해 소성된 Cu 전극의 저항을 측정하여 전도도를 조사하였으며 Thermal Gravimetric Analysis (TGA), Fourier Transform Infrared(FTIR)를 통해 소성된 Cu 전극의 유기물 분해가 전도도에 미치는 영향을 분석하고 Field Emission Scanning Electron Microscopy (FESEM)과 High Resolution Transmission Electron Microscopy (HRTEM)을 통해 Cu nanoparticles 의 grain growth가 전도도에 미치는 영향을 조사하였다.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.48 no.1
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• pp.134-141
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• 2016

Dampening in printing is not only used with plain water but also used with various substances like dampening additive, in order to improve the wetting property by lowering the surface tension and to control material for modifing the ink transfer characteristic with proper emulsification. We have studied the printing quality according to these, looking into interrelationship among the dampening solution's pH, electrical conductivity and IPA content, prescribing the proper usage and minimum usage of fountain solution and dampening additive. In this study, it shows good result when mixing at the 7 wt% dampening with additive solution, which is result from the color density of printed sheets in accordance with the change of dampening solution condition. And the printed density value calculated 1 hour after printing, it shows relatively safe value at the etch liquid 4 wt% and IPA addition 2 wt%. The dry down at this test showed similar results regardless of various dampening conditions on coated paper, but in case of uncoated paper, the dry down showed a quite gap of different due to the fast penetration to the paper.

• Journal of the Korean Graphic Arts Communication Society
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• v.22 no.1
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• pp.39-52
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• 2004

A novel evaluation method is investigated for measuring the ability of acid amplification of acid amplifier. The method is based on the measurement of conductivity change by the acid generation according to UV radiation. It is found that the decrease of conductivity is caused by photopolymerization of epoxy monomer during UV curing process of ink film and the by the rate of UV curing. In this paper, the novel acid amplifiers were synthesized and measured thermal stability by means of DSC. It was found that mono-type acid amplifiers were more stable than di-type. It is possible to make the dynamical evaluation the curing rate of UV curable ink in curing process by this method.

• Korean Chemical Engineering Research
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• v.43 no.3
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• pp.393-400
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• 2005

A novel evaluation method was investigated for measuring the ability of acid amplification of acid amplifier. The method was based on the measurement of conductivity change by the acid generation according to UV radiation. It was found that the decrease of conductivity was caused by photopolymerization of epoxy monomer during UV curing process of ink film and by the rate of UV curing. In this paper, the novel acid amplifiers were synthesized and measured thermal stability by means of DSC. It was found that mono-type acid amplifiers were more stable than di-type. It was possible to make the dynamical evaluation of the curing rate of UV curable ink in curing process by this method.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.99-105
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• 2022

As the chip size gets smaller, the width of the electrode line is also fine, and the density of interconnections is increasing. As a result, RC delay is becoming a problem due to the difference in resistance between the capacitor layer and the electrical conductivity layer. To solve this problem, the development of electrodes with high electrical conductivity and dielectric materials with low dielectric constant is required. In this study, we developed low dielectric ink by mixing commercial PSR which protect PCB's circuits from external factors and PI with excellent thermal property and low-k characteristics. As a result, the ink mixture of PSR and PI 10:3 showed the best results, with a dielectric constant of about 2.6 and 2.37 at 20 GHz and 28 GHz, respectively, and dielectric dissipation was measured at about 0.022 and 0.016. In order to verify the applicability of future applications, various line-width transmission lines produced on Teflon were evaluated, and as a result, the loss of transmission lines using low dielectric ink mixed with PI was 0.12 dB less on average in S21 than when only PSR was used.