• 비파괴검사학회지
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• 제31권6호
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• pp.609-615
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• 2011

Excitation and propagation of electromagnetic field of a cylindrical coil above an arbitrary number of conductive plates for pulsed eddy current testing(PECT) are very complex problems due to their complicated physical properties. In this paper, analytical modeling of PECT is established by Fourier series based on truncated region eigenfunction expansion(TREE) method for a single air-cored coil above stratified conductive structures(SCS) to investigate their integrity. From the presented expression of PECT, the coil impedance due to SCS is calculated based on analytical approach using the generalized reflection coefficient in series form. Then the multilayered structures manufactured by non-ferromagnetic (STS301L) and ferromagnetic materials (SS400) are investigated by the developed PECT model. Good prediction of analytical model of PECT not only contributes to the development of an efficient solver but also can be applied to optimize the conditions of experimental setup in PECT.

• Carbon letters
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• 제15권1호
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• pp.38-44
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• 2014

This paper reports the effect of adding reduced graphene oxide (RGO) as a conductive material to the composition of an electrode for capacitive deionization (CDI), a process to remove salt from water using ionic adsorption and desorption driven by external applied voltage. RGO can be synthesized in an inexpensive way by the reduction and exfoliation of GO, and removing the oxygen-containing groups and recovering a conjugated structure. GO powder can be obtained from the modification of Hummers method and reduced into RGO using a thermal method. The physical and electrochemical characteristics of RGO material were evaluated and its desalination performance was tested with a CDI unit cell with a potentiostat and conductivity meter, by varying the applied voltage and feed rate of the salt solution. The performance of RGO was compared to graphite as a conductive material in a CDI electrode. The result showed RGO can increase the capacitance, reduce the equivalent series resistance, and improve the electrosorption capacity of CDI electrode.

• 전기학회논문지
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• 제65권8호
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• pp.1430-1435
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• 2016

Electrical impedance tomography (EIT) has been applied to measure the location of external disturbance using a phantom and conductive yarns. According to the test results, the addition of carbon nanotube particles into the phantom does not show remarkable improvement in location errors. On the other hand combined fabric, conductive yarns with fabric, and non-woven fabric, were added to evaluate its performance as a fabric sensor. The combined fabric resulted in a decrease of 21.5% in the circumferential location error and a decrease of 50% in the radial location error, compared to those of the yarns. Additionally, it was revealed that the measurement error is almost linearly proportional to the conductivity of the phantom liquid and resistance of the conductive yarns. The combined fabric can be a promising material for fabric sensors in sports utilities and medical devices.

• 한국정밀공학회지
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• 제30권6호
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• pp.573-577
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• 2013

The one of the most important issue in roll-to-roll gravure printing is increase of ink transfer ratio or printability. As the result of high ink transfer ratio or printability, we can assess the quality of the printed patterns. The rheological properties are the important factors for the printability of electrodes patterning. In this study, the rheological properties of conductive ink are controlled by adding the solvent. The inks with different rheological properties are used for the patterning of the electrodes of $100{\mu}m$ by gravure printing equipment. The various printing speed, which also affect the rheological properties of conductive ink, is applied and the printed patterns are compared for their width and aspect ratio. Decreasing in the ink viscosity as well as increasing in the printing speed decreases the printability in gravure patterning, which shows that the rheological properties are important factors for the printability of gravure patterning.

• 한국전기전자재료학회논문지
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• 제28권8호
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• pp.544-549
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• 2015

Since LEDs (light emitting diodes) have many advantages as a light source in vehicle headlamp, such as good reliability, energy and space saving, and flexible headlamp design. On the other hand, the dependence of its performance and life on temperature have great influence on its practical use. In this study, design and fabrication of heat sink for vehicle LED headlamp were performed using thermally-conductive plastics. This study focused on the effective heat sink structure with limited space in the vehicle LED headlamp. We designed two different prototype of heat sink by thermal simulation using SolidWorks program, which had excellent temperature characteristics. The two different prototype of heat sink were fabricated by injection molding with thermally-conductive plastics. The results showed that LED $T_j$ (junction temperature) of sample B (model 1) and sample C (model 1, 2) was below then $165^{\circ}C$ when applying the thermally-conductive plastics in heat sink of vehicle LED headlamp.

• 한국재료학회지
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• 제5권8호
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• pp.929-935
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• 1995

구동 IC를 유리기판 위의 Al패드 전극에 연결하는 LCD(Liquid Crystal Display) 모듈을 실장하는 Chip On Glass (COG) 기술을 개발하기 위하여 기존에 잘 알려진 기술 가운데 실제로 적용 가능성이 가장 유망한 이방성 도전 접착제 (ACA, Anisotropic Conductive Adhesives)를 사용한 공정에 대하여 조사하였다. ACA 공정은 본딩 부분에 ACA 수지를 균일하게 분포시키는 공정과 자외선을 조사하여 수지를 경화하여 칩을 실장하는 공정의 2단계로 진행하였다. 칩에 가해준 하중은 2-15kg이었고 칩의 예열 온도는 12$0^{\circ}C$이었다. 이방성 도전체는 Au 또는 Ni이 표면 피막 재료로 사용된 것을 사웅하였으며 전도성 입자의 갯수가 500, 1000, 2000, 4000개/$\textrm{mm}^2$이며 크기가 5, 7, 12$\mu\textrm{m}$이었다. ACA 처리의 결과 입자 크기가 5$\mu\textrm{m}$이고 입자 밀도는 4000개/$\textrm{mm}^2$일 경우가 대단히 낮은 접촉 저항 및 가장 안정된 본딩 특성을 나타냈었다.

• 한국전자파학회논문지
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• 제27권11호
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• pp.1012-1018
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• 2016

본 논문은 유한 차분 시간 영역(FDTD: Finite-Difference Time-Domain)법을 이용하여 낙뢰에 노출된 항공기와 같이 높은 도전성 물질로 구성된 구조체의 간접적 영향 분석을 위한 전자파 해석기법 연구를 수행하였다. 간접적 영향 분석을 위해 사용되는 낙뢰 파형은 매우 낮은 주파수 특성을 가지며, 알루미늄과 탄소섬유복합물질과 같이 높은 도전성 물질들로 구성된 구조체는 매우 짧은 표피 깊이를 가지고 있기 때문에 일반적인 3차원 FDTD법을 이용하여 해석을 수행할 경우, 매우 많은 메모리와 해석시간이 요구된다. 본 연구팀에서는 낙뢰 특성과 높은 도전율을 갖는 구조에 적합한 전자파 해석기법을 개발하였다. 개발된 해석 기법은 2차원 FDTD와 INBC(Impedance Network Boundary Condition) 알고리즘을 적용하였으며, 개발된 해석기법을 이용하여 낙뢰에 노출된 구조체의 간접적 영향을 분석하였다.

• 한국재료학회지
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• 제22권10호
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• pp.562-568
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• 2012

Metal nanowires can be coated on various substrates to create transparent conducting films that can potentially replace the dominant transparent conductor, indium tin oxide, in displays, solar cells, organic light-emitting diodes, and electrochromic windows. One issue with these metal nanowire based transparent conductive films is that the resistance between the nanowires is still high because of their low aspect ratio. Here, we demonstrate high-performance transparent conductive films with silver nanofiber networks synthesized by a low-cost and scalable electrospinning process followed by two-step sequential thermal treatments. First, the PVP/$AgNO_3$ precursor nanofibers, which have an average diameter of 208 nm and are several thousands of micrometers in length, were synthesized by the electrospinning process. The thermal behavior and the phase and morphology evolution in the thermal treatment processes were systematically investigated to determine the thermal treatment atmosphere and temperature. PVP/$AgNO_3$ nanofibers were transformed stepwise into PVP/Ag and Ag nanofibers by two-step sequential thermal treatments (i.e., $150^{\circ}C$ in $H_2$ for 0.5 h and $300^{\circ}C$ in Ar for 3 h); however, the fibrous shape was perfectly maintained. The silver nanofibers have ultrahigh aspect ratios of up to 10000 and a small average diameter of 142 nm; they also have fused crossing points with ultra-low junction resistances, which result in high transmittance at low sheet resistance.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.155-161
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• 2018

강성도가 서로 다른 polydimethylsiloxane (PDMS) 탄성고분자와 flexible printed circuit board (FPCB)로 이루어진 PDMS/FPCB 구조의 강성도 국부변환 신축기판에 $100{\mu}m$ 직경의 Cu/Au 범프를 갖는 Si 칩을 anisotropic conductive adhesive (ACA)를 사용하여 플립칩 본딩 후, ACA내 전도성 입자에 따른 플립칩 접속저항을 비교하였다. Au 코팅된 폴리머 볼을 함유한 ACA를 사용하여 플립칩 본딩한 시편은 $43.2m{\Omega}$의 접속저항을 나타내었으며, SnBi 솔더입자를 함유한 ACA로 플립칩 본딩한 시편은 $36.2m{\Omega}$의 접속저항을 나타내었다. 반면에 Ni 입자를 함유한 ACA를 사용하여 플립칩 본딩한 시편에서는 전기적 open이 발생하였는데, 이는 ACA내 Ni 입자의 함유량이 부족하여 entrap된 Ni 입자가 하나도 없는 플립칩 접속부가 발생하였기 때문이다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제37회 하계학술대회 초록집
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• pp.243-243
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• 2009