• 제목/요약/키워드: conductive materials

검색결과 961건 처리시간 0.031초

전도성 재료를 혼입한 모르타르의 발열특성에 관한 실험적 연구 (An Experimental Study on the Exothermic Properties of Cement Mortar Containing Conductive Materials)

  • 송동근;홍철호;이한승
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2014년도 추계 학술논문 발표대회
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    • pp.131-132
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    • 2014
  • In this study, an experiment was carried out using graphite, conductive nickel powder, copper bar, carbon fiber for evaluate the exothermic properties and heating reproducibility of the cement mortar containing conductive material. As a result, the conductive materials that interfere with heating reproducibility are present, and the optimal conductive materials exist in each input voltage.

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금속입자가 전도성 잉크의 전도도에 미치는 영향 (Effect of Metal Powders on the Conductivity of Conductive Inks)

  • 권두효;정태의;김남수;한국남
    • 한국공작기계학회논문집
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    • 제17권2호
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    • pp.97-103
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    • 2008
  • In this investigation, conductivity of conductive inks was measured. A particular attention has been given to the effect of metal powders with various conductivity on the overall conductivity of the bulk ink. The conductivity of various solutions simulating conductive inks consisting of copper and silver was measured and the results have been discussed in relation to various applications of conductive inks in practice. A conductivity model simulating systems consisting of various materials has been introduced and the results were discussed. Materials of good conductivity are adversely affected by mixing with materials of poor conductivity simply through serial connection. However, parallel connection has rather little effect on the overall conductivity. The practical implication of various mixtures of materials on conductive inks has been discussed.

A Review on Thermoelectric Technology: Conductive Polymer Based Thermoelectric Materials

  • Park, Dabin;Kim, Jooheon
    • 한국전기전자재료학회논문지
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    • 제35권3호
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    • pp.203-214
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    • 2022
  • Thermoelectric (TE) heating and cooling devices, which are able to directly convert thermal energy into electrical energy and vice versa, are effective and have exhibited a potential for energy harvesting. With the increasing consumer demands for various wearable electronics, organic-based TE composite materials offer a promise for the TE devices applications. Conductive polymers are widely used as flexible TE materials replacing inorganic materials due to their flexibility, low thermal conductivity, mechanical flexibility, ease of processing, and low cost. In this review, we briefly introduce the latest research trends in the flexible TE technology and provide a comprehensive summary of specific conductive polymer-based TE material fabrication technologies. We also summarize the manufacture for high-efficiency TE composites through the complexation of a conductive polymer matrix/inorganic TE filler. We believe that this review will inspire further research to improve the TE performance of conductive polymers.

Development of Transparent Conductive Patterned Film with Hybrid Ag Ink

  • 최주환;백수진;이범주;신진국
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2011년도 춘계학술발표대회
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    • pp.2.3-2.3
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    • 2011
  • With increased interest in printed devices, various metal nano inks have been investigated as candidates materials for printed electrodes and wiring as well as conductive film substituting photo-lithography process. Recent advances in organic conductive polymer allow us to fabricate high performance printed device. Meanwhile, there was several attempts to fabricate conductive films by mixing conductive polymer with metal nano-particle or nano-wires. The presence of Ag nanowires in conductive polymer mixture have shown good potential in organic photovoltaic devices.

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Fabrication of Conductive Patterns by Ink-Jet Prining of Copper Ink

  • Park, Bong-Kyun;Kim, Don-Jo;Jeong, Sun-Ho;Lee, Seul;Moon, Joo-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.1382-1385
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    • 2006
  • We have studied ink-jet printing method for patterning of conductive line on flexible plastic substrates. Synthesized copper nano-particles of ${\sim}40\;nm$ were used for the conductive ink and the printed patterns exhibit a smooth line whose line width is about $100\;{\mu}m$.

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Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

  • Yim, Myung-Jin;Kim, Hyoung-Joon;Paik, Kyung-Wook
    • 마이크로전자및패키징학회지
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    • 제12권1호
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    • pp.9-16
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    • 2005
  • This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

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유기계 슈퍼커패시터에서 도전재의 양이 전기화학적 특성에 미치는 영향 (Effect of Conductive Additive Amount on Electrochemical Performances of Organic Supercapacitors)

  • 양인찬;이기훈;정지철
    • 한국재료학회지
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    • 제26권12호
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    • pp.696-703
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    • 2016
  • In this study, we intensively investigated the effect of conductive additive amount on electrochemical performance of organic supercapacitors. For this purpose, we assembled coin-type organic supercapacitor cells with a variation of conductive additive(carbon black) amount; carbon aerogel and polyvinylidene fluoride were employed as active material and binder, respectively. Carbon aerogel, which is a highly mesoporous and ultralight material, was prepared via pyrolysis of resorcinol-formaldehyde gels synthesized from polycondensation of two starting materials using sodium carbonate as the base catalyst. Successful formation of carbon aerogel was well confirmed by Fourier-transform infrared spectroscopy and $N_2$ adsorption-desorption analysis. Electrochemical performances of the assembled organic supercapacitor cells were evaluated by cyclic voltammetry, galvanostatic charge/discharge, and electrochemical impedance spectroscopy measurements. Amount of conductive additive was found to strongly affect the charge transfer resistance of the supercapacitor electrodes, leading to a different optimal amount of conductive additive in organic supercapacitor electrodes depending on the applied charge-discharge rate. A high-rate charge-discharge process required a relatively high amount of conductive additive. Through this work, we came to conclude that determining the optimal amount of conductive additive in developing an efficient organic supercapacitor should include a significant consideration of supercapacitor end use, especially the rate employed for the charge-discharge process.

Ink-Jet Printing of Conductive Silver Inks for Flexible Display Devices

  • Kim, Dong-Jo;Park, Jung-Ho;Jeong, Sun-Ho;Moon, Joo-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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    • pp.1491-1494
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    • 2005
  • We have studied ink-jet printing method for patterning conductive line on flexible plastic substrates. Synthesized silver nano-particles of ${\sim}$20nm were used for the conductive ink and the printed patterns exhibit a smooth line whose linewidth is below 100 ${\mu}m$. This ink-jet printing technique can be applied to flexible displays and electronics.

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리튬이온전지 음극의 고속 성능 향상을 위한 도전재 복합화 (Composited Conductive Materials for Enhancing the Ultrafast Performance for Anode in Lithium-Ion Battery)

  • 성기욱;안효진
    • 한국재료학회지
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    • 제32권11호
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    • pp.474-480
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    • 2022
  • Lithium-ion batteries (LIBs) are powerful energy storage devices with several advantages, including high energy density, large voltage window, high cycling stability, and eco-friendliness. However, demand for ultrafast charge/discharge performance is increasing, and many improvements are needed in the electrode which contains the carbon-based active material. Among LIB electrode components, the conductive additive plays an important role, connecting the active materials and enhancing charge transfer within the electrode. This impacts electrical and ionic conductivity, electrical resistance, and the density of the electrode. Therefore, to increase ultrafast cycling performance by enhancing the electrical conductivity and density of the electrode, we complexed Ketjen black and graphene and applied conductive agents. This electrode, with the composite conductive additives, exhibited high electrical conductivity (12.11 S/cm), excellent high-rate performance (28.6 mAh/g at current density of 3,000 mA/g), and great long-term cycling stability at high current density (88.7 % after 500 cycles at current density of 3,000 mA/g). This excellent high-rate performance with cycling stability is attributed to the increased electrical conductivity, due to the increased amount of graphene, which has high intrinsic electrical conductivity, and the high density of the electrode.

Effect of Thermal Treatment Temperature on Lifespan of Conductive Oxide Electrode

  • Yoo, Y.R.;Chang, H.Y.;Jang, S.G.;Nam, H.S.;Kim, Y.S.
    • Corrosion Science and Technology
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    • 제6권2호
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    • pp.44-49
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    • 2007
  • Dimensionally stable anodes have been widely used to cathodically protect the metallic materials in corrosive environments including concrete structure as the insoluble anode. Lifespan of the anode for concrete construction can be determined by NACE TM0294-94 method. Lifespan of conductive oxide electrode would be affected by thermal treatment condition in the process of sol-gel coatings. This work aims to evaluate the effect of thermal treatment temperature on the lifespan of the $RuO_{2}$ electrode. $450^{\circ}C$ treated conductive oxide electrode showed the excellent properties and its lifespan was evaluated to be over 88 years in 3% NaCl, 4% NaOH, and simulated pore water. This behavior was related to the formation of $RuO_{2}$.