• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 1999년도 봄 학술발표회 논문집
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• pp.245-251
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• 1999

As the crack grows in the residual stress fields, the distribution of the residual stress is changed. In this study, a finite element modeling technique is developed to simulate the redistribution of residual stress due to crack propagation. To certify the accuracy, the crack propagation tests were carried out and tile effective stress intensity factor range was evaluated considering the redistribution of residual stress from the FE analysis.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2003년도 가을 학술발표회 논문집
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• pp.227-234
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• 2003

This study presents the stress evaluation equations of circular column-box beam connection in steel frame piers. FEM analysis were carried out for circular column-box beam connection. Analysis models were made for design parameters such as joint angle, span length-width ratio(L/B), sectional-area ratio(S=A/sub w/A/sub f/), and circular column-box beam stiffness ratio(Ic/Ib). Analysis results were compared to the existing equation. Based on analysis results the stress evaluation equations of circular column-box beam connection are proposed by regression analysis.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2004년도 가을 학술발표회 논문집
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• pp.270-277
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• 2004

In this paper, path-independent values of the J-integral in the fininte element context for arbitrary two-dimensional and three-dimensional crack configurations in welds are presented. For the fracture mechanics analysis of cracks in welds, residual stress analysis and fracture analysis must be performed simultaneously. In the analysis of cracked bodies containing residual stress, the usual domain integral formulation results in path-dependent values of the J-integral. This paper discusses modifications of the conventional J-integral that yield path independence in the presence of residual stress generated by welding. The residual stress problem is treated as an initial strain problem and the J-integral modified for this class of problem is used. And a finite element program which can evaluate the J-integral for cracks in two-dimensional and three-dimensional residual stress bearing bodies is developed using the modified J-integral definition. The situation when residual stress only is present is examed as is the case when mechanical stresses are applied in conjunction with a residual stress field.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2002년도 가을 학술발표회 논문집
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• pp.139-145
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• 2002

In this study, the geometric modeling has been conducted for 2 models of lower end fitting of advanced LWR fuel using three-dimensional solid modeler, Solidworks. Then, the optimization and the three-dimensional stress analysis using the finite element method has been peformed. The evaluation for the mechanical integrity of 2 models has been peformed based on the stress distribution obtained from the finite element analysis.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2006년도 정기 학술대회 논문집
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• pp.496-499
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• 2006

In this study, a practical method of shrinkage stress analysis on concrete slab in multi-story building is proposed, which considers both internal restraint and external restraint variation resulting from construction sequence. The shrinkage stress due to external restraint is obtained by multiplying relaxation coefficient to elastic shrinkage stress. The additional shrinkage stress due to internal restraint is obtained by residual strain of the elastic analysis. A verification example was analyzed and compared by the proposed method and commercial analysis program that is capable of time-dependent analysis of concrete. The results of 10-story example building show that the internal restraint of reinforcement increases the shrinkage stress considerably at the slabs under loose external restraint.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2001년도 봄 학술발표회 논문집
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• pp.365-372
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• 2001

This study is concerned with the application of an analytical model of cyclic crack growth that includes the effects of crack closure. The crack closure model is based on the Dugdale model and the strip model, considering the plasticity-induced closure which is caused by residual plastic deformation remaining in the wake of an advancing crack. This study is performed to get the relation between crack growth and crack opening stress with the constant stress ratio, and the relation between stress ratio and crack opening stress with the constant maximum stress under constant-amplitude loading. Under constant-amplitude loading, the crack opening stress is conversed the constant value as a crack grows and is proportion to both the stress ratio and the maximum stress. The crack closure effect, however, is decreased in the positive stress ratio and disappeared at about 0.7. The crack growth analysis using the crack closure model shows that the influence of stress ratio is minimized in the relation between crack growth ratio and effective stress intensity range specially at the negative stress ratio.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2008년도 정기 학술대회
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• pp.60-64
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• 2008

According to previous research, welding-induced stress in steel structures can significantly affect the fatigue behaviour; it produces initial damage of weldiug part of structure locally and residual stresses reduce the fatigue strength after welding precess. In this study, through continuum damage mechanics, we can estimate the weldiug damage using the stress and strain history during welding process and the effect of welding residual stress for assessment of fatigue life. The variation of welding-induced stresses and strains need be traced precisely in advance for a reliable weldiug damage assessment. In this study, a damage and fatigue analysis techniques for steel structures with welding-induced residual stress are presented. First, We calculate the history of temperature according with welding process. And residual stress with a welding thermal history was evaluated by non-linear thermal stress analysis. Secondly, welding damage and fatigue life are estimated with kinetic damage law.

• 한국CDE학회논문집
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• 제9권4호
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

• 대한기계학회논문집A
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• 제27권5호
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• pp.713-723
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• 2003

In this study, a state of art review of existing residual stress analysis techniques and representative solutions is presented in order to develope the residual stress analysis procedure for fitness-for-service (FFS) assessment of welded structure. Critical issues associated with existing residual stress solutions and their treatments in performing FFS are discussed. It should be recognized that detailed residual stress evolution is an extremely complicated phenomenon that typically involves material-specific ther-momechanical/metallurgical response, welding process physics, and structural interactions within a component being welded. As a result, computational procedures can vary significantly from highly complicated numerical techniques intended only to elucidate a small part of the process physics to cost-effective procedures that are deemed adequate for capturing some of the important features in a final residual stress distribution. Residual stress analysis procedure for FFS purposes belongs to the latter category. With this in mind, both residual stress analysis techniques and their adequacy for FFS are assessed based on both literature data and analyses performed in this investigation.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 1995년도 가을 학술발표회 논문집
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• pp.43-49
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• 1995

Sasol Advanced Synthol Reactor was divided into two chambers by grid plate perforated with diffuser holes. The reactor has high stress level beacuse of membrane stress due to internal pressure, thermal stress due to temperature difference and local stress due to structural discontinuity at the juncture of grid plate and shell. Moreover, geometric nonlinear behaviors may appear in the grid plate because of pressure difference between two chambers. In order to survey the stress level and geometric nonlinear behaviors around grid plate, heat transfer analysis, linear static analysis and geometric nonlinear analysis were performed using NISA II developed by EMRC. This paper demonstrates the result of accessment for linear static and geometric nonlinear analysis under various load combinations.