• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.198-198
• /
• 2013

Metal-Oxide-Semiconductor (MOS)에서 사용되는 다양한 channel materials로 high electron mobility을 가지는 III-V compound semiconductor가 대두되고 있다 [1,2]. 하지만 이러한 III-V compound semiconductor는 Si에 비해 안정적인 native oxide가 부족하기 때문에 Si, Ge, Al2O3과 BeO 등과 같은 다양한 물질들의 interface passivation layers (IPLs)에 대한 연구가 많이 되고 있다. 이러한 IPLs 물질은 0.5~1.0 nm의 매우 얇은 physical thickness를 가지고 있고 또한 chemical inert하기 때문에 플라즈마 식각에 대한 연구가 되고 있지만 IPLs 식각 후 기판인 III-V compound semiconductor에 physical damage과 substrate recess를 줄이기 위해서 높은 선택비가 필요하다. 이러한 식각의 대안으로 원자층 식각이 연구되고 있으며 이러한 원자층 식각은 반응성 있는 BCl3의 adsorption과 low energy의 Ar bombardment로 desorption으로 self-limited한 one monolayer 식각을 가능하게 한다. 그러므로 본 연구에서는, III-V compound semiconductor 위에 IPLs의 adsorption과 desorption의 cyclic process를 이용한 원자층식각으로 다양한 물질인 SiO2, Al2O3 (self-limited one monolayer etch rate=about 1 ${\AA}$/cycle), BeO (self-limited one monolayer etch rate=about 0.75 ${\AA}$/cycle)를 얻었으며 그 결과 precise한 etch depth control로 minimal substrate recess 식각을 할 수 있었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.11a
• /
• pp.258-259
• /
• 2005

[ $CuInSe_2$ ] thin films were fabricated at various fabrication conditions (substrate temperature, sputtering pressure, BC/RF power, vapor deposition, heat treatment). And structural and electrical properties were measured in order to certify optimum conditions for growth of the ternary compound semiconductor $CuInSe_2$ thin films with stoichiometric composition. $CuInSe_2$ thin film was well made at the heat treatment of 500[$^{\circ}C$] of SLG/Cu/In/Se stacked elemental layer which was prepared by sputter and thermal evaporator, and chemical composition of the thin film was analyzed nearly as the proportion of 1 : 1 : 2. At the same time, carrier concentration, hall mobility and resistivity of the thin films was $1.27\sim9.88\times10^{17}[cm^{-3}]$, $49.95\sim185[cm^2/V{\cdot}s]$ and $10^{-1}\sim10^{-2}[\Omega{\cdot}cm]$, respectively

• Korean Journal of Food Science and Technology
• /
• v.25 no.5
• /
• pp.526-529
• /
• 1993

The present study was conducted to investigate nitrite-scavenging ability of the components of Cassiae torae semen, Cassia tora L. The nitrite-scavenging effects of fractions obtained from methanol extract of Cassiae torae semen, Cassia tora L. were strong in ethyl acetate fraction, chloroform fraction, water soluble fraction and ethyl ether fraction in order. Compound D showed the strongest nitrite-scavenging effects among compound A, B, C, D separated from Cassiae torae semen. Compound D separated from Cassiae torae semen possessed ten-fold stronger the nitrite-scavenging effect than ascorbic acid.

• Journal of Applied Biological Chemistry
• /
• v.42 no.3
• /
• pp.146-150
• /
• 1999

As a part of the integrated disease system in greenhouse, an antifungal fungus(AF1) was isolated from greenhouse soil. It exhibited strong inhibitory activites against Pythium ultimum, Phytophtora capsici, Rhizoctonia solani, Botrytis cinerea, and Fusarium oxysporum based on dual culture on 1/5 strength of potato dextrose agar between antagonistic fungus and several plant pathogens. The antagonistic fungus was identified as Chaetomium cochliodes, based on morphological characteristics; the body of the perithecium bears straight or slightly wavy, unbranched hairs, whilst the apex bears a group of spirally coiled hairs. To investigate antagonistic principles, antifungal compound was extracted and fractionated by different solvent systems. An antifungal compound was isolated as pure crystal from is culture filtrate using organic solvent extraction and column chromatography, followed by preparative thin layer chromatography. The chemical structure of the purified antifungal compound was identified as chaetoglobosin A based on the data obtained form $^1H-NMR$, $^{13}C-NMR$, DEPT 90, 135, $^1H-^1H$ COSY, $^1H-^{13}C$ COSY and EI/MS. $ED_{50}$ values of the chaetoglobosin A against P. ultimum, P. capsici, R. solani, B. cinerea and F. oxysporum were 1.98, 4.01, 4.16, 2.67 and 35.14 ppm, respectively.

• Proceedings of the Korean Society of Near Infrared Spectroscopy Conference
• /
• 2001.06a
• /
• pp.3114-3114
• /
• 2001

During the last years phytochemistry and phytopharmaceutical applications have developed rapidly and so there exists a high demand for faster and more efficient analysis techniques. Therefore we have established a near infrared transflectance spectroscopy (NIRS) method that allows a qualitative and quantitative determination of new polyphenolic pharmacological active leading compounds within a few seconds. As the NIR spectrometer has to be calibrated the compound of interest has at first to be characterized by using one or other a combination of chromatographic or electrophoretic separation techniques such as thin layer chromatography (TLC), high performance liquid chromatography (HPLC), capillary electrophoresis (CE), gas chromatography (GC) and capillary electrochromatography (CEC). Both structural elucidation and quantitative analysis of the phenolic compound is possible by direct coupling of the mentioned separation methods with a mass spectrometer (GC-MS, LC-MS/MS, CE-MS, CEC-MS) and a NMR spectrometer (LC-NMR). Furthermore the compound has to be isolated (NPLC, MPLC, prep. TLC, prep. HPLC) and its structure elucidated by spectroscopic techniques (UV, IR, HR-MS, NMR) and chemical synthesis. After that HPLC can be used to provide the reference data for the calibration step of the near infrared spectrometer. The NIRS calibration step is time consuming, which is compensated by short analysis times. After validation of the established NIRS method it is possible to determine the polyphenolic compound within seconds which allows to raise the efficiency in quality control and to reduce costs especially in the phytopharmaceutical industry.

• Journal of Powder Materials
• /
• v.31 no.1
• /
• pp.37-42
• /
• 2024

Friction stir spot welding (FSSW) is a solid-state joining process and a rapidly growing dissimilar material welding technology for joining metallic alloys in the automotive industry. Welding tool shape and process conditions must be appropriately controlled to obtain high bonding characteristics. In this study, FSSW is performed on dissimilar materials AA5052-H32 aluminum alloy sheet and SPRC440 steel sheet, and the influence of the shape of joining tool and tool insertion depth during joining is investigated. A new intermetallic compound is produced at the aluminum and steel sheets joint. When the insertion depth of the tool is insufficient, the intermetallic compound between the two sheets did not form uniformly. As the insertion depth increased, the intermetallic compound layer become uniform and continuous. The joint specimen shows higher values of tensile shear load as the diameter and insertion depth of the tool increase. This shows that the uniform formation of the intermetallic compound strengthens the bonding force between the joining specimens and increases the tensile shear load.

• Tribology and Lubricants
• /
• v.25 no.1
• /
• pp.7-12
• /
• 2009

Coating brittle intermetallic compounds on metal can enlarge the range of their use. It is found that intermetallic compound coating layers made by only combustion synthesis in an electric furnace have porous multi-phase structures containing several intermediate phases, even though the coating layers show good wear resistance. In this study, dense $Ni_{3}Al$ single phase layer corresponding to the initial composition of the mixed powder is coated on two different ferrous materials by the diffusing treatment after combustion synthesis. After- ward, sliding wear behaviors of the coating layer are evaluated in comparison with that of the coating layer with porous multi-phase structure made by only combustion synthesis. As a result, the wear properties of the coating layer composed of dense $Ni_{3}Al$ single phase are considerably improved at the range of low sliding speed com- pared with that of the coating layer with porous multi-phase structure, particularly in the running-in wear region. This is attributed to the fact that wear of the coating layer is progressed by shearing as a sequence of adhesion, not by occurring of pitting on the worn surface due to having dense structure without pores.

• Korean Journal of Materials Research
• /
• v.12 no.7
• /
• pp.568-572
• /
• 2002

Plasma sulfnitriding technology was employed to harden the surface of SKD61 steel. The plasma sulfnitriding was performed with 3 torr gas pressure at $580^{\circ}C$ for 20 hours. Plasma sulfnitriding resulted in the formation of very thin $2-3\mu\textrm{m}$ FeS sulfide layer on top of $15-20\mu\textrm{m}$ compound layer, which consisted of predominantly $\varepsilon$- $Fe{2-3}$ N and a second phase of $\Upsilon'-Fe_4$N. In comparision with plasma nitriding treatment, plasma sulfnitriding treatment showed better surface roughness and corrosion resistance due to the presence of the thin FeS layer. which coated microvoids and microcracks on top of the nitrided layer. It was also found that plasma sulfnitrided sample showed better wear resistance due to the presence of the thin FeS layer which acted as a solid lubricant.

• Korean Journal of Metals and Materials
• /
• v.49 no.11
• /
• pp.910-915
• /
• 2011

The microstructures and mechanical properties of roll-bonded STS439/Al1050/STS304 clad materials were investigated after an annealing process at various temperatures. Interfacial layer was developed at the STS439/Al1050 and Al1050/STS304 interfaces at $550^{\circ}C$. STS439/Al1050/STS304 clad metals fractured suddenly in a single step and the fracture decreased with increasing annealing temperatures at $450^{\circ}C$. After annealing at $550^{\circ}C$, samples fractured in three steps with each layer fracturing independently. Interfacial layers formed at $550^{\circ}C$ with a high Vickers microhardness were found to be brittle. During tensile testing, periodic parallel cracks were observed at the interfacial reaction layer. Observed micro-void between Al1050 and the interfacial layer was found to weaken the Al1050/reaction layer interface, leading to the total separation between Al1050 and the reaction layer.

• Proceedings of the Korean Magnestics Society Conference
• /
• 2007.05a
• /
• pp.324.2-324.2
• /
• 2007