• Corrosion Science and Technology
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• v.13 no.3
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• pp.107-111
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• 2014

Electroless plated Ni-Co-P films have been used to suppress the electromagnetic waves from magnetic recording media, and the suppression is known to be achieved with films made with optimized plating composition and plating condition. Effects of complexing agents on the deposition rate and bath stability of Ni-Co-P film were studied using sodium citrate, sodium tartrate and multi-complex agents containing both of them. Deposition of electroless Ni-Co-P platings was dependent upon the complexing agents. Deposition rate was twice when using sodium tartrate compared to that using sodium citrate. And it was slightly slower with multi-complex agents than with sodium tartrate, bath stability being declined in the former. Deposition rate increased with increasing pH until pH 11. Excellent bath stability and good deposition rate were obtained using multi-complex agent as sodium citrate 0.10 mol/L and sodium tartrate 0.15 mol/L in the electroless Ni-Co-P plating films.

• Journal of the Korean institute of surface engineering
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• v.22 no.2
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• pp.101-108
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• 1989

Effects of Na+ ion on zeta potential of SiC and Al2O3 particles suspended in nikel sufate and nickel chloride solutions were investigated. various complexing agents for Ni2+ ion were added to electroless Ni composite bath and the effects of the complexing agents on zeta potential and codeposition of the particles from the baths were studied. It was confirmed that Na+ ion was absorbed on the particles bringing about the positive surface charge and thus they promoted the entrapment of the particles into the nickel deposit. On the basis of these results it was possible to deposit SiCc particle in nickel chloride electrolyte containing complex agent such as trisodium citrate+sodium succinate.

• Journal of the Korean institute of surface engineering
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• v.37 no.6
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• pp.326-334
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• 2004

Deposit charateristics of Electroless nickel(EN) were investigated with various complexing agents. As expected, the deposition rate of nickel is increased with pH and that of Phosphorous is decreased with pH. The result of SEM investigation shows that the rough surface crystallization is appeared with pH. It is show that the surface resistance of EN deposit is decreased with pH at 85$^{\circ}C$.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.156-157
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• 1998

• Proceedings of the SCSK Conference
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• 2003.09b
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• pp.460-461
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• 2003

Clear rinse-off ...gels can be prepared. allowing the introduction of novel product forms. Styling gels with improved viscosity, conditioning. clarity and product aesthetics are also possible with this concept. Beyond the creation of clear product.(omitted)

• Nuclear Engineering and Technology
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• v.21 no.4
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• pp.287-293
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• 1989

The purpose of this study was to develop a rapid and effective method of laser-induced fluorescence analysis for thrace amounts of Sm, Eu and Tb in nuclear fuels. The features of the method are the use of the distinct fluorescence wavelengths and the discriminative lifetimes of the respective elements when excited by a pulsed nitrogen laser. Fluorescence signals of the three elements were isolated by adequate selection of the filters or complexing agents (HFA, TTA) or discriminative delay and gate times in the signal processing circuit. It was found that S $m^{+3}$ and E $u^{+3}$ emitted strong fluorescence in the two complexing agent solutions or HFA and TTA. But in the case or T $b^{+3}$, the fluorescence signal was detected only in HFA solution. With respect to the concentrations of S $m^{+3}$, E $u^{+3}$ and T $b^{+3}$, the fluorescence signal intensities gave superior linearities in the range of 5 ppb-10 ppm for S $m^{+3}$, 0.5 ppb-1 ppm for E $u^{+3}$, and 0.1 ppb-300 ppb for T $b^{+3}$, The detection limits obtained were 5 ppb for S $m^{+3}$, 0.1 ppb for E $u^{+3}$, and 0.01 ppb for T $b^{+3}$, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.10
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• pp.889-893
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• 2006

Chemical mechanical polishing (CMP) achieves surface planrity through combined mechanical and chemical means. The role of slurry is very important in metal CMP. Slurry used in metal CMP normally consists of oxidizers, complexing agents, corrosion inhibitors and abrasives. This paper investigates the effects of citric acid as a complexing agent for Cu CMP with $H_2O_2$. In order to study chemical effects of citric acid, X-ray photoelectron spectroscopy (XPS) was peformed on Cu sample after etching test. XPS results reveal that CuO, $Cu(OH)_2$ layer decrease but $CU/CU_2O$ layer increase on Cu sample surface. To investigate nanomechanical properties of Cu sample surface, nanoindentation was performed on Cu sample. Results of nanoindentation indicate wear resistance of Cu surface decrease. According to decrease of wear resistance on Cu surface removal rate increases from $285\;{\AA}/min\;to\;8645\;{\AA}/min$ in Cu CMP.

• Journal of the Korean institute of surface engineering
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• v.43 no.2
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• pp.111-120
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• 2010

In this study, the effects of multi-complex agents addition on characteristics of electroless Ni plating solution are investigated. The species and the concentration of complexing agents are major factors to control the deposition rate, P concentration, and surface morphology of plating films. Adipic acid increases the deposition rate in regardless of single- or mutli-complex agent addition. However, lactic acid effectively increases the deposition rate in case of multi-addition as the complex agents with adipic or sodium succinate acid. In addition, sodium citric acid and malic acid show good stabilizing effects of plating solution and lowering the deposition rate, because they have high complexibility. Therefore, it is suggested that the development of Ni-P plating solution suitable for diverse usages can be carried out systematically using the database from this study.

• Journal of the Korean institute of surface engineering
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• v.30 no.2
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• pp.104-110
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• 1997

Conventional hexavlent chromium electroplating baths deposit the matal at low cathode efficiency and have poor covering and throwing power. The processs also generate hazardous wastes. To overcome many of the disadvantages of hexavalent chromium plating the use of trivalent chromium has advocted. After Yoshida, who first studied trivalent chromium plating, using ammonium sulfate and urea, there are numerous report describing the trivalent chromium electropating process using complexing agents. This study investigaten trivalent chromium plating electrolyte solutious containing formate as a complexing agent and ammouim chloride for conducting agent. The effects of composition and operating conditions on deposits and current efficiencies were investigated in trivalent chromium plating baths by analyzing the relationship pulse conditions and surface morphology The surface morphology of the deposits was observed by SEM. pulse electrolysis has been effective on obtaining a smooth with high current efficiency comparing with D.C. electrolysis in trivalent chromium solution.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.81-82
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• 2007

3가크롬 도금액은 크롬원 (황화물계 또는 염화물계), 착화제, 완충제, 전도보조제, 산화방지제, 유기첨가제등으로 구성되어 있으며, 특히 착화제와 유기첨가제가 용액의 안정성 및 균일전착성에 미치는 영향이 크다고 보고되고 있다. 본 연구에서는 카르복시기의 작용기를 갖는 유기산을 착화제로 사용하고, 다양한 유/무기 첨가제의 조합 및 첨가량을 조절하여 크롬의 전착특성을 고찰하였다.