Browse > Article
http://dx.doi.org/10.5695/JKISE.2010.43.2.111

Effects of Multi-Complex Agent Addition on Characteristics of Electroless Ni-P Solution  

Lee, Hong-Kee (Incheon Technology Service Division and Heat Treatment & Plating Technology Service Center, Korea Institute of Industrial Technology)
Lee, Ho-Nyun (Incheon Technology Service Division and Heat Treatment & Plating Technology Service Center, Korea Institute of Industrial Technology)
Jeon, Jun-Mi (Incheon Technology Service Division and Heat Treatment & Plating Technology Service Center, Korea Institute of Industrial Technology)
Hur, Jin-Young (Incheon Technology Service Division and Heat Treatment & Plating Technology Service Center, Korea Institute of Industrial Technology)
Publication Information
Journal of the Korean institute of surface engineering / v.43, no.2, 2010 , pp. 111-120 More about this Journal
Abstract
In this study, the effects of multi-complex agents addition on characteristics of electroless Ni plating solution are investigated. The species and the concentration of complexing agents are major factors to control the deposition rate, P concentration, and surface morphology of plating films. Adipic acid increases the deposition rate in regardless of single- or mutli-complex agent addition. However, lactic acid effectively increases the deposition rate in case of multi-addition as the complex agents with adipic or sodium succinate acid. In addition, sodium citric acid and malic acid show good stabilizing effects of plating solution and lowering the deposition rate, because they have high complexibility. Therefore, it is suggested that the development of Ni-P plating solution suitable for diverse usages can be carried out systematically using the database from this study.
Keywords
Electroless plating; Ni-P; Complexing agent;
Citations & Related Records
연도 인용수 순위
  • Reference
1 G. O. Malloy, J. B. Hajdu, Electroless Plating, Fundamentals and Applications, (1990) 57.
2 M. Yan, H. G. Ying, T. Y. Ma, Surf. Coat. Technol., 202 (2008) 5909.   DOI
3 R. Elansezhiana, B. Ramamoorthy, P. Kesavan Nair, J. Mater Process Technol., 209 (2009) 233.   DOI
4 M. Crobu, Andrea Scorciapino, Bernhard Elsener, Antonella Rossi, Electrochim. Acta, 53 (2008) 3364.   DOI
5 Y. S. Huang, F. Z. Cui, Surf. Coat. Technol., 201 (2007) 5416.   DOI
6 J. R. Henry, Met. Finish., 97 (1999) 431.   DOI
7 R. Tarozaite, O. Gyliene, G. Stalnionis, Surf. Coat. Technol., 200 (2005) 2208.   DOI
8 M. Palaniappa, S. K. Seshadri, Mater. Sci. Eng., A 460-461 (2007) 638.   DOI   ScienceOn
9 Y. S. Huang, F. Z. Cui, Surf. Coat. Technol., 201 (2007) 5416.   DOI
10 J. Li, Z. Shao, X. Zhang, Y. Tian, Surf. Coat. Technol., 200 (2006) 3010.   DOI
11 J. T. Winowlin Jappes, B. Ramamoorty, P. K. Nair, J. Mater Process Technol., 169 (2005) 308.   DOI
12 Y. Gao, L. Huang, Z. J. Zheng, H. Li, M. Zhu, Appl. Surf. Sci., 253 (2007) 9470.   DOI   ScienceOn
13 T. K. Tsai, C. Guang, Appl. Surf. Sci., 233 (2004) 180.   DOI
14 R. Elansezhian, B. Ramamoorthy, P. Kesavan Nair, Surf. Coat. Technol., 203 (2008) 709.   DOI