• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.431-432
• /
• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Korean Journal of Microbiology
• /
• v.37 no.2
• /
• pp.130-136
• /
• 2001

The killing effects of two types(one-phase reactor and two-phase reactor) of UV-TiO$_2$photocatalytic system on the microorganisms have been studied. The UV-lamp which emits maximum 39 watts at 254 nm was prepared in these system. Three types of $TiO_2$ coating method were adopted. One type is thin film coated form on the quartz tube in the reactor and another one is surface rough coated form on the glass bead. The other one is $TiO_2$-mixed alginate bead form. UV irradiation was carried out for 1 min. In case of one phase reactor, the bactericidal efficiencies of E. coli by $TiO_2$-coated quartz tube and $TiO_2$-coated glass bead were 63.2% and 89.9%, respectively. In the air-bubbling system, the bactericidal efficiency was 95%, however, the efficiency decreased to 90.6% in the non-bubbling system. In the $TiO_2$-mixed alginate bead system, bactericidal efficiency was 86%. When $H_2O$$_2$ was treated (10, 15, 20, and 25 mg/ι) to the $TiO_2$-coated glass bead reactor, bactericidal efficiency significantly increased according to the concentration of $H_2$$O_2$. Two phase reactor showed more elevated efficiency. E. coli was more sensitive to the reaction than S. cerevisiae.

• Applied Chemistry for Engineering
• /
• v.23 no.1
• /
• pp.1-7
• /
• 2012

In this article, I will introduce recent developments of environmental-friendly materials fabricated using atomic layer deposition (ALD). Advantages of ALD include fine control of the thin film thickness and formation of a homogeneous thin fim on complex-structured three-dimensional substrates. Such advantages of ALD can be exploited for fabricating environmental-friendly materials. Porous membranes such as anodic aluminum oxide (AAO) can be used as a substrate for $TiO_2$ coating with a thickness of about 10 nm, and the $TiO_2$-coated AAO can be used as filter of volatile organic compound such as toluene. The unique structural property of AAO in combination with a high adsorption capacity of amorphous $TiO_2$ can be exploited in this case. $TiO_2$ can be also deposited on nanodiamonds and Ni powder, which can be used as photocatalyst for degradation of toluene, and $CO_2$ reforming of methane catalyst, respectively. One can produce structures, in which the substrates are only partially covered by $TiO_2$ domains, and these structures turns out to be catalytically more active than bare substrates, or complete core-shell structures. We show that the ALD can be widely used not only in the semiconductor industry, but also environmental science.

• Applied Chemistry for Engineering
• /
• v.24 no.1
• /
• pp.31-37
• /
• 2013

Lowering surface reflectance of Si wafers by texturization is one of the most important processes for improving the efficiency of Si solar cells. This paper presents the results on the effect of texturing using acidic solution mixtures containing the catalytic agents to moderate etching rates on the surface morphology of mc-Si wafer as well as on the performance parameters of solar cell. It was found that the treatment of contaminated crystalline silicon wafer with $HNO_3-H_2O_2-H_2O$ solution before the texturing helps the removal of organic contaminants due to its oxidizing properties and thereby allows the formation of nucleation centers for texturing. This treatment combined with the use of a catalytic agent such as phosphoric acid improved the effects of the texturing effects. This reduced the reflectance of the surface, thereby increased the short circuit current and the conversion efficiency of the solar cell. Employing this technique, we were able to fabricate mc-Si solar cell of 16.4% conversion efficiency with anti-reflective (AR) coating of silicon nitride film using plasma-enhanced chemical vapor deposition (PECVD) and Si wafers can be texturized in a short time.

• Journal of Korea Foundry Society
• /
• v.22 no.1
• /
• pp.42-48
• /
• 2002

Effects of coating treatment of metallic Cu, Ni-P film on $SiC_p$, for $SiC_p$/iron aluminide composites were studied. Porous hybrid preforms were fabricated by reactive sintering after mixing the coated $SiC_p$, Fe and Al powders. Then the final composites were manufactured by squeeze casting after pouring AC4C Al alloy melts in preforms. The change of reactive temperature, density, microstructure of the preforms and microstructure of the composites were investigated. The exprimental results were summarized as follows. The thickness of Cu and Ni-P metallic layer formed on $SiC_p$ by electroless plating method were about $0.5{\mu}m$ and coated uniformly. There was no remakable change in the ignition temperature with variation of the mixing ratio of Fe and Al powder while in the case of coated $SiC_p$ it was lower about $20^{\circ}C$ than in the non-coated $SiC_p$. The maximum reaction temperature increased with increasing Al contents, but decreased with increasing $SiC_p$ contents. Expansion ratio of preform after reactive sintering increased with amount of Cu coated $SiC_p$. In the case of Fe-70at.%Al, the expansion ratio was about 7% up to 8wt.% of $SiC_p$, addition but further addition of $SiC_p$, increased the ratio significantly. And in the case of Fe-50 and 60at.%Al, it was about 20% up to 16wt.% of $SiC_p$ addition and about 28% in 24wt.% of $SiC_p$, addition. The microstructures of compounds showed that the grains became finer as amount of $SiC_p$, and mixing ratio of iron powder increased and the shape of compounds was changed gradually from irregular to spheroidal.

• Membrane Journal
• /
• v.6 no.3
• /
• pp.173-181
• /
• 1996

Common volatile organic compounds(VOCs) such as toluene and methanol were removed successfully from N$_{2}$ using a novel silicone-coated hollow fiber membrane module. This novel membrane is a thin film composite(TFC) and was highly efficient in removing VOCs selectively from a N$_{2}$ stream. This membrane had some innate advantages over other silicone-based membrane in that the selective barrier was ultrathin(~1 $\mu$m) and the porosity of the polypropylene substrate was high which leads to a low permeation resistance. The substram was very strongly bonded to the coating layer by plasma polymerization and can withstand a very high pressure. A small hollow fiber module having a length of 25cm and 50 fibers could remove 96~99% of toluene as well as methanol vapors when the feed flow rate was up to 60cc/min. The percent removal of VOCs were even higher when the feed inlet concentration was higher. This process is especially suitable for treating streams having a low flow rate and high VOCs concentration. The permeances of VOCs through this membrane was in the range of $4~30 \times 10^{-9}gmol/sec \cdot cm^{2}\cdot cmHg$ for both toluene and methanol, and nitrogen permeance was between $3~9 \times 10^{-10}gmol/sec \cdot cm^{2} \cdot cmHg$. High separation factor between 10~55 for toluene/N$_{2}$ and 15~125 for methanol/N$_{2}$ were obtained depending on the feed flow rate ranges and feed VOCs concentration levels.

• Proceedings of the Korean Society of Postharvest Science and Technology of Agricultural Products Conference
• /
• 2000.04a
• /
• pp.12-13
• /
• 2000

최근 플라스틱제 식품 포장재에 대한 환경학적 문제가 제기됨으로 인하여 다양한 곡류 단백질의 필름 형성능력에 많은 관심이 모아지고 있다. 단백질 필름으로서 soy protein, wheat gluten, rice bran, corn zein, glatin 및 colloagen 등의 소재들이 많은 관심을 모으고 있으며, 비교적 필름 형성력이 뛰어나고, 저렴한 가격으로 구입할 수 있는 대두 단백질에 커다란 관심이 모아지고 있는 실정이다. 이들 물질로부터 제조된 가식성 필름 및 코팅제들은 식품의 보존기간을 연장시킬 뿐만 아니라 수분 및 용질의 이동을 방지하여 식품의 품질을 개선시킬 수 있다. 또한 이들 필름 및 코팅제들은 산소 및 이산화탄소의 이동, 이로 인한 지방 산화 그리고 휘발성 향기성분들의 감소 등을 조절할 수 있다. 대두 단백질 필름의 사과 코팅제로서의 이용은 개별적 포장이 용이하지 않는 제품들의 코팅제로서 활용하여 대두 단백질 필름 및 코팅제의 잠재적 시장성을 확인하는 하나의 응용분야이다. 본 실험의 목적은 대두 단백질 코팅제를 후지와 golden delicious 사과에 코팅하여 상온 (22$^{\circ}C$)과 냉장온도(2-4$^{\circ}C$)에서 60일동안 보관하여 색도, 경도 및 산도 변화 등을 측정하여 저장 중 사과의 품질에 미치는 영향을 조사하였다. 대두 단백질 코팅제는 대두 단백 용액들 (5g, 8g, 10g/100mL water)에 glycerin (50% w/w의 단백질)을 가소재로 첨가한 후 알칼리 용액으로 pH 9.0에 맞추었다. 그런후 85$^{\circ}C$에서 30분간 가열하여 코팅제를 준비하였다. 후지 사과(붉은색)와 golden delicious 사과 (초록색)를 dipping 방법으로 코팅하여 60일도안 실온과 냉장온도에 저자하여 보존기간의 연장을 확인하였다. 사과품질의 결정인자는 Hunter L, a, b 색도값과 사과의 조직의 강도 (외부 및 내부) 그리고 산도 등을 측정하였다. 코팅된 후지 및 golden delicious 사과의 표피 및 내부 경도는 control과 비교하여 높은 경도를 유지하였다. 또한 냉장온도에서 30일 동안 보관하였을 때, control 사과와 거의 비슷한 경도를 유지하였다. 식품의 색도를 소비자의 기호를 결정하는 중요한 인자이다. 대두 단백질로 코팅된 후지 사과는 상온에서 20일 동안은 control에 비하여 약간의 색도의 증가를 보였으나, 그 후 60일 동안은 색도의 증가를 보이지 않았다. 그러나 냉장 보관한 control 후지 사과에 비하여 색도의 증가가 관찰되었다. 대두 단백질 코팅제가 사과의 색도 변화를 방지하는 효과를 가졌으나, 저장 온도가 색도의 변화에 더욱 큰 영향을 미침을 알 수 있었다. 대두 단백질로 코팅된 golden delicious는 상온에서60일 동안 보관하였을 경우, 사과표피의 색도 변화를 현저히 지연시킴을 확인하였다. 또한 control과 비교하여 성공적으로 사과에 코팅하였으며, 상온에서 보관하여을 때 사과의 품질을 30일 이상 연장하는 효과를 관찰하였다. 이들 결과로부터 대두단백질 필름이 과일 등의 포장제로서 이용할 가능성을 확인하였다.

• Journal of the Korea institute for structural maintenance and inspection
• /
• v.20 no.1
• /
• pp.25-32
• /
• 2016

The purpose of this study is to evaluate the performance on the compressive bonding shear strength of ultra-high strength steel fiber reinforced cementitous composites(UHSCC). As a result of compressive bonding shear strength through Direct shear test, It was found that the specimen($150{\times}150{\times}150mm$) of NC(Normal concrete) + NC showed similar compressive bonding shear strength at whole experimental level. On the other hand, the specimen of UHSCC + UHSCC showed decrease of compressive bonding shear strength from after 30 minutes of the retarded placement than 0 minute. As a result of analyzing failure mode of bonding interface, It was found that the specimen of NC + NC showed mixed failure at whole experimental level. In case of the specimen of UHSCC + UHSCC, it showed interface failure from the specimen that are 30 minutes, 60 minutes and 90 minutes of delay of concrete placing. As a result of analyzing XRD test in terms of the placement interface on the specimen of NC and UHSCC, relatively much amount of $SiO_2$ was detected from the specimen of UHSCC than that of NC. It is judged that the most of main components of coating film shown in the specimen of UHSCC is $SiO_2$. In conclusion, it is judged that UHSCC which is made from after 30 minutes of delay of concrete placing is unable to be used as structural member because of deterioration of bonding performance. From later study, it is judged that the improvement of bonding performance from the part of cold joint occurrence is necessary through the interface preparation method.

• Journal of the Korean Ceramic Society
• /
• v.38 no.11
• /
• pp.1067-1074
• /
• 2001

Four different composition of autoxidation drying type waterborne coatings (WBC-1, WBC-2, WBC-3, WBC-4) were prepared by the compounding of bentonite (BEN) as a water swellable clay and organometallic soaps as a drier with acrylic binder and coating additives. The solution viscosity, solid content, rheological properties and drying rate of WBCs were investigated. Also the thermal stability, the transmittance and the water-resistance of the films casted by WBCs were measured, and the surface topology of WBC films were investigated by the scanning probe microscopy. As WBC-2, WBC-3 and WBC-4 containing BEN showed the thixotropy with the shear rate, the storage stability of WBC was a excellent. When the driers was mixed in the ratio of Mn/Zn/Ba=1/2/3, the dry ability of WBCs showed maximum as 5.0 sec at 60$\^{C}$. The initial decomposition temperature and the transmittance of WBC films containing BEN increased in range of 32.2∼54.7$\^{C}$ and 5.1∼8.6% than the commercial WBC (MC-21W), respectively. The water resistance of WBC films increased in order of MC-21W

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.25 no.10
• /
• pp.805-810
• /
• 2012

Transparent conducting oxides (TCOs) have wide range of application areas in transparent electrode for display devices, Transparent coating for solar energy heat mirrors, and electromagnetic wave shield. $SnO_2$ is intrinsically an n-type semiconductor due to oxygen deficiencies and has a high energy-band gap more than 3.5 eV. It is known as a transparent conducting oxide because of its low resistivity of $10^{-3}{\Omega}{\cdot}cm$ and high transmittance over 90% in visible region. In this study, co-doping effects of Al and Y on the properties of $SnO_2$ were investigated. The addition of Y in $SnO_2$ was tried to create oxygen vacancies that increase the diffusivity of oxygen ions for the densification of $SnO_2$. The addition of Al was expected to increase the electron concentration. Once, we observed solubility limit of $SnO_2$ single-doped with Al and Y. $\{(x/2)Al_2O_3+(x/2)Y_2O_3\}-SnO_2$ was used for the source of Al and Y to prevent the evaporation of $Al_2O_3$ and for the charge compensation. And we observed the valence changes of aluminium oxide because generally reported of valence changes of aluminium oxide in Tin - Aluminium binary system. The electrical properties, solubility limit, densification and microstructure of $SnO_2$ co-doped with Al and Y will be discussed.