• The Journal of Korea Institute of Information, Electronics, and Communication Technology
• /
• v.12 no.2
• /
• pp.142-149
• /
• 2019

The coils to transmit the electric energy are necessary to charge an electric vehicle wirelessly. There are several types of coils, from basic circular coils to DD-type coils for enhancing the coupling effect between two coils. However, DD-type coils with a good coupling effect between coils have a disadvantage in use because of the structure complexity of the power conversion device of transmitting and receiving side. In this paper, we propose a method to calculate the inductance value and to design the size of the spiral inductor which is convenient to fabricate when the power is transmitted wirelessly by using two coils in free space. Since the bifurcation phenomenon occurs when the XLm value is similar to the load resistance value in the resonator the XLm value was selected to be equal to the minimum load resistance value to minimize this phenomenon, and the inductance value required for the resonator was calculated. In order to realize the calculated inductance value by the spiral inductor, the relationship between the inductance value and the size, the number of turns, the total coil length of a spiral inductor was investigated. In addition, the change of coupling coefficient k according to the horizontal separation of two coils was examined and an appropriate inductor was selected.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.56 no.8
• /
• pp.1471-1475
• /
• 2007

In this paper, a novel embedded ultra wideband (UWB) band-pass filter is presented on a FR-4 package substrate including high Dk resin coated copper (${\varepsilon}_r=30$) film. The proposed UWB filter is comprised of a parallel resonator with meander-type uniform impedance resonator (UIR) and two series resonators with high Q circular stacked spiral inductor and metal-insulator-metal (MIM) capacitor. In order to obtain excellent attenuation characteristics by generating attenuation poles in lower and upper stop bands, a single MIM capacitor is added to each resonator. The fabricated FR-4 embedded UWB filter has insertion loss of -1.0dB and return loss of -11dB, respectively. It has also extremely wide bandwidth (over 50%) and small size ($3.7{\times}4{\times}0.77\;mm^3$) which is compatible with LTCC devices.

• The Transactions of the Korean Institute of Electrical Engineers B
• /
• v.53 no.11
• /
• pp.680-686
• /
• 2004

An integrated inductor using the low temperature cofiring ceramics(LTCC) technology was fabricated. The inductor has Ag circular spiral coil with 16 turns (2-turn x 8-layer) and has a dimension of 11.52mm diameter and 0.71mm thick. For the fabricated inductor, calculation method of inductance was given and it is confirmed that the calculated value is very close to the measured one. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC buck DC/DC converter with 1.32W output power and 1MHz switching frequency using the inductor fabricated was developed. For the converter the maximum efficiency of about 81% was obtained.

• Proceedings of the KIEE Conference
• /
• 2004.04a
• /
• pp.129-132
• /
• 2004

An integrated inductor using low temperature cofiring ceramics(LTCC) technology has been fabricated. The inductor has Ag circular spiral coil with 16 turns (2-turn $\times$ 8-layer) and has a dimension of 11.52mm diameter and 0.71mm thick, For the fabricated inductor, calculation method of inductance was given and it is confirmed that the calculated value is very close to the measured value. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC buck DC/DC converter with 1W output power and 1MHz switching frequency using the inductor has been developed. For the converter the maximum efficiency of about 81% was obtained.

• Proceedings of the KIEE Conference
• /
• 2004.10a
• /
• pp.150-152
• /
• 2004

An integrated inductor using the low temperature cofiring ceramics(LTCC) technology was fabricated. The inductor has Ag circular spiral coil with 16 turns (2-turn x 8-layer) and has a dimension of 11.52mm diameter and 0.71mm thick. For the fabricated inductor, calculation method of inductance was given and it is confirmed that the calculated value is very close to the measured one. Finally as an application of the LTCC integrated inductor to low power electronic circuits, a LTCC buck DC/DC converter with 1.32W output power and 1MHz switching frequency using the inductor fabricated was developed. For the converter the maximum efficiency of about 81% was obtained.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.1
• /
• pp.39-44
• /
• 2008

In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.16 no.6
• /
• pp.201-204
• /
• 2007

In this paper, fully embedded and miniaturized diplexer device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23 dB at 824-894 MHz and -0.7 and -22 dB at 1850-1990 MHz, respectively. Its size is $3.9mm{\times}3.9mm{\times}0.77mm$. The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.

• ETRI Journal
• /
• v.25 no.2
• /
• pp.65-72
• /
• 2003

To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.