• Journal of the Korean Vacuum Society
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• v.17 no.6
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• pp.518-522
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• 2008

The miniaturization of device size and multilevel interlayers have been developed by ULSI circuit devices. These submicron processes cause serious problems in conventional metallization due to the solubility of silicon and metal at the interface, such as an increasing contact resistance in the contact hole and interdiffusion between metal and silicon. Therefore it is necessary to implement a barrier layer between Si and metal. Thus, the size of multilevel interconnection of ULSI devices is critical metallization schemes, and it is necessary reduce the RC time delay for device speed performance. So it is tendency to study the Cu metallization for interconnect of semiconductor processes. However, at the submicron process the interaction between Si and Cu is so strong and detrimental to the electrical performance of Si even at temperatures below $200^{\circ}C$. Thus, we suggest the tungsten-carbon-nitrogen (W-C-N) thin film for Cu diffusion barrier characterized by nano scale indentation system. Nano-indentation system was proposed as an in-situ and nanometer-order local stress analysis technique.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.40 no.2
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• pp.397-407
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• 2015

In this paper, we designed 1 chip IC for 3-axis gyroscope and 3-axis accelerometer used for various IoT/M2M mobile devices such as smartphone, wearable device and etc. We especially focused on analysis of gyroscope noise and proposed new architecture for removing various noise generated by gyroscope MEMS and IC. Gyroscope, accelerometer and geo-magnetic sensors are usually used to detect user motion or to estimate moving distance, direction and relative position. It is very important element to designing a low noise IC because very small amount of noise may be accumulated and affect the estimated position or direction. We made a mathematical model of a gyroscope sensor, analyzed the frequency characteristics of MEMS and circuit, designed a low noise, compact and low power 1 chip 6-axis inertial sensor IC including 3-axis gyroscope and 3-axis accelerometer. As a result, designed IC has 0.01dps/${\sqrt{Hz}}$ of gyroscope sensor noise density.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.7
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• pp.710-721
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• 2013

The noise prediction of motor driving system is one of the most important parts in EV/HEV, as the number of power electronic devices increases. This paper describes the mechanism of noise making process and proposes a simulation model of motor driving system for the prediction of the conducted noise. Theoretical calculations and model based simulations were carried out. DOD-dependent-battery parameters were extracted by AC analysis, and an inverter model including dynamic diode was used. Furthermore, 2-D EM tool was used for the motor modeling and was combined with the circuit models of battery and inverter. The simulated voltages, currents and spectrums in the motor driving system showed qualitatively meaningful results, suggesting the validness of the suggested modeling methods.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.37-43
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• 1999

Modules of the system that requires large capacity and high-speed information processing are implemented in the form of MCM that allows high-speed data processing, high density circuit integration and widely applied to such fields as ATM, GPS and PCS. Hence we developed the ATM switching module that is consisted of three chips and 2.48 Gbps data throughput, in the form of 10 multi-layer by Cu/Photo-BCB and 491pin PBGA which size is $48 \times 48 \textrm {mm}^2$. hnologies required for the development of the MCM includes extracting parameters for designing the substrate/package through the interconnect characterization to implement the high-speed characteristics, thermal management at the high-density MCM, and the generation of the testability that is one of the most difficult issues for developing the MCM. For the development of the ATM Switching MCM, we extracted signaling delay, via characteristics and crosstalk parameters through the interconnect characterization on the MCM-D. For the thermal management of 15.6 Watt under the high-density structure, we carried out the thermal analysis. formed 1.108 thermal vias through the substrate, and performed heat-proofing processing for the entire package so that it can keep the temperature less than $85^{\circ}C$. Lastly, in order to ensure the testability, we verified the substrate through fine pitch probing and applied the Boundary Scan Test (BST) for verifying the complex packaging/assembling processes, through which we developed an efficient and cost-effective product.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.5
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• pp.608-614
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• 2018

In addition to the diffusion of ICT technology, various protocols of short range wireless communication technology are being applied for efficient information operation. However, due to limitations of short-range wireless communication, communication is not smooth in places where frequency environment is poor, such as frequency confusion and warehouse type factory. When an alternative is needed. The development of LED technology and expansion of infrastructure through LED based visible light communication is attracting attention as an alternative and spreading the usage in wide range now a days. In addition, the infrastructure has been expanded with solar panels in response to the development of smarthome built-in with renewable energy. In this situation, visible light communication using PD has been limitedly applied in a near environment where the receiving angle of the PD and the ambient light ensure the LoS and the influence of the ambient light is small. In order to solve this problem, we have implemented visible light communication using LED lighting with large current infrastructure and solar panel with large receiving area, and proposed a circuit for restoring accurate data even in ambient light. Through this study results, it is expected that visible light communication can be more widely used and this result used as the base data for visible light communication research using the solar panel as the receiver.

• The Transactions of the Korean Institute of Power Electronics
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• v.15 no.2
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• pp.150-158
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• 2010

The operational characteristics of a resonant DC/DC converter, which can harvest thermoelectric energy, is analyzed, depending on the relative magnitudes of the input voltage and the load voltage. The resonant converter consists of LC resonant circuit connected to DC input source and a resonant pulse converter in which the input energy is transferred to the load as the resonant capacitor voltage is peak. The resonant capacitor doubles the input voltage by the resonance phenomenon. By the relative magnitude between the input voltage and the output voltage, the resonant DC/DC converter operates in three different modes. For boost mode, the peak voltage of the resonant capacitor is smaller than the load voltage. For hybrid mode, the peak voltage of the resonant capacitor is bigger than the load voltage and every switching period has both the boost mode and the direct mode. For the direct mode, the input voltage is bigger than the load voltage and the converter transfers directly the input energy to the load without the switching operation. Operation principles and the feasibility of the converter for the thermoelectric energy harvesting are verified with PSPICE simulation and experiment.

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.2
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• pp.155-161
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• 2010

Recently, the electromagnetic techniques of the eddy current testing(ECT), alternating current field testing, magnetic flux leakage testing and remote field testing have been used as a nondestructive evaluation method based on the electromagnetic induction. The eddy current testing is now widely accepted as a NDE method for the heat exchanger tube in the electric power industry, chemical, shipbuilding, and military. The ECT system mainly consists of the synthesizer module, analog module, analog-to-digital converter, power supplier, and data acquisition and analysis program. In this study, the synthesizer module and the analog module which are essential to the ECT system were primarily developed. The developed ECT system is basically a multifrequency type which is able to inject the maximum four frequencies based on the frequency and time domain multiplexing method. Conclusively, we confirmed that the EC signal was processed appropriately in each circuit modules, and the Lissajous EC signal was displayed in the impedance plane.

• Composites Research
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• v.34 no.5
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• pp.317-322
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• 2021

When a complex load such as torsion, low-speed impact, or fatigue load is applied, the properties in the thickness direction are weakened through microcracks inside the material due to the nature of the laminated composite material, and delamination occurs. To prevent the interlaminar delamination, various three-dimensional reinforcement methods such as Z-pinning and stitching, and structural health monitoring techniques that detect the microcrack of structures in real time have been continuously studied. In this paper, the single-lap joints with I-fiber stitching process were manufactured by a co-curing method and their strengths and failure detection capability were evaluated. AE and electric resistance method were used for detection of crack and failure signal and electric circuit for signal analysis was manufactured, and failure signal was analyzed during the tensile test of a single-lap joint. From the experiment, the strength of the single lap joint reinforced by I-fiber stitching process was improved by about 44.6% compared to the co-cured single lap joint without reinforcement. In addition, as the single-lap joint reinforced by I-fiber stitching process can detect failure in both the electrical resistance method and the AE method, it has been proven to be an effective structure for failure monitoring as well as strength improvement.

• Asian-Australasian Journal of Animal Sciences
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• v.32 no.9
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• pp.1397-1406
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• 2019

Objective: Feed energy required for pigs is first prioritized to meet maintenance costs. Additional energy intake in excess of the energy requirement for maintenance is retained as protein and fat in the body, leading to weight gain. The objective of this study was to estimate the metabolizable energy requirements for maintenance ($ME_m$) by regressing body weight (BW) gain against metabolizable energy intake (MEI) in growing pigs. Methods: Thirty-six growing pigs ($26.3{\pm}1.7kg$) were allotted to 1 of 6 treatments with 6 replicates per treatment in a randomized complete block design. Treatments were 6 feeding levels which were calculated as 50%, 60%, 70%, 80%, 90%, or 100% of the estimated ad libitum MEI ($2,400kJ/kg\;BW^{0.60}\;d$). All pigs were individually housed in metabolism crates for 30 d and weighed every 5 d. Moreover, each pig from each treatment was placed in the open-circuit respiration chambers to measure heat production (HP) and energy retained as protein ($RE_p$) and fat ($RE_f$) every 5 d. Serum biochemical parameters of pigs were analyzed at the end of the experiment. Results: The average daily gain (ADG) and HP as well as the $RE_p$ and $RE_f$ linearly increased with increasing feed intake (p<0.010). ${\beta}$-hydroxybutyrate concentration of serum tended to increase with increasing feed intake (p = 0.080). The regression equations of MEI on ADG were MEI, $kJ/kg\;BW^{0.60}\;d=1.88{\times}ADG$, g/d+782 ($R^2=0.86$) and $ME_m$ was estimated at $782kJ/kg\;BW^{0.60}\;d$. Protein retention of growing pigs would be positive while REf would be negative at this feeding level via regression equations of $RE_p$ and $RE_f$ on MEI. Conclusion: The $ME_m$ was estimated at $782kJ/kg\;BW^{0.60}\;d$ in current experiment. Furthermore, growing pigs will deposit protein and oxidize fat if provided feed at the estimated maintenance level.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.598-603
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• 2019

Three-dimensional shape measurement technology is used in various industries. Among them, optical three-dimensional shape measurement techniques based on the optical trigonometry are mainly used in the field of semiconductor product inspection, where large quantities of three-dimensional shape measurements are made daily in factories and fine measurements are also required. The light source and the drive circuit, which are components of three-dimensional measurement equipment based on this optical trigonometry, produce heat generated by prolonged operation, and may be exposed to conditions where the ambient temperature is not constant, resulting in temperature-induced measurement errors. In this study, the compensation method of the Thermal Errors for Phase Measuring Profilometry is proposed. Three-Dimensional Shape Measurement Equipment based on Phase Measuring Profilometry is implemented to measure the height of an object and ambient temperature for 10 Hours, and a regression line was obtained line by making simple linear regression using measured temperature and height values. This regression line was used to correct the error of the height measurement according to the temperature, and thermal error was from 139.88 um(Micrometer) to 13.12 um.