• Polymer(Korea)
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• v.39 no.3
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• pp.475-479
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• 2015

Droplet distribution of LCP(Vectra 950) and PET blend by repeated extrusion was examined through morphology analysis. Repeated extrusion was respectively proceeded twice and three times with blending condition and droplet distribution of only once extrusion sample showed uniform shape. However, droplet size of twice and three times extrusion samples increased and it was confirmed that droplets were concentrated on the center of specimens. It is thought that this phenomena were due to the compatibility and viscoelastic behavior of LCP/PET blend. Finally, it is thought that fiber manufacturing of different diameter is possible from spinning of repeated extrusion LCP/PET blended chip under same spinning condition.

• Journal of the Korean Wood Science and Technology
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• v.43 no.3
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• pp.381-389
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• 2015

In this study, the effects of moisture content and particles size of ground particles of torrefied larch chips on the pelletizing process were investigated depending on torrefaction conditions ($220^{\circ}C$-50 min, $250^{\circ}C$-50 min, $250^{\circ}C$-120 min). The moisture content in the torrefied chip decreased to 0.69~1.75%, while ash content and calorific value increased compared to untreated chip. In addition, weight loss significantly increased during torrefaction due to hemicellulose degradation. The carbon content in torrefied larch chip increased compare to untreated larch chip, while the hydrogen and oxygen contents decreased. The lignin and glucan contents in torrefied larch chip increased with increasing severity of the torrefaction condition, while hemicellulose decreased. In the particle size distribution of ground particles of torrefied larch chip, larch torrefied at severe conditions was found to produce smaller particles (~1 mm) than that of the larch torrefied at mild conditions. Macropore (over $500{\AA}$) in the torrefied particle was produced during torrefaction. During the pelletizing using ground particles of torrefied larch chip, the pressure needed in pelletizing decreased and pellet length increased with increasing moisture content, regardless of the particle size.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.9-14
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• 2012

Robust power delivery and distribution are considered one of the major challenges in electronic devices today. As a technology develops (i.e. frequency and complexity, increase and size decreases), both power density and power supply noise increase, and voltage supply margin decreases. In addition, thermal problem is induced due to high power and poor power distribution. Until now most of studies to improve power delivery and distribution have been focused on device circuit or system architecture designs. Interconnect process technologies to resolve power delivery issues have not greatly been explored so far, but recently it becomes of great interest as power increases and voltage specification decreases in a smaller chip size.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.3
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• Journal of the Korean Applied Science and Technology
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• v.16 no.1
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• pp.59-65
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• 1999

For a cosmetic plant wastewater containing surfactants of high concentration, adsorption treatment by granular activated carbon(GAC) having different pore size distribution was studied. Three sorts GACs were used and regenerated afterwards with methanol. Experiments were composed of batch process and column test for both virgin and regenerated GACs. Following conclusions were drawn from the study: Methylene blue activating substance(MBAS) adsorption data from the batch tests for three GACs are described well by BET isotherm and Freundich isotherm. Simulation with the BET isotherm shows that maximum adsorption appears to be affected not only by specific surface area but also by pore size distribution. Maximum adsorption from the BET isotherm for MBAS appears to diminish as the number of reactivation increases. The diminishing ratio of maximum adsorption appears to decrease as the pore size decreases. Recovery ratio of the methanol by vacuum evaporation from the spent methanol ranges from 95% to 97%.

• Journal of Sensor Science and Technology
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• v.10 no.2
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• pp.91-100
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• 2001

A $8{\times}8$ foveated (log-polar) retina chip for edge detection has been designed and fabricated using CMOS technology. Retina chip performs photo-input sensing, edge extraction and motion detection and we focused edge extraction. The pixel distribution follows the log-polar transform having more resolution in the center than in the periphery and can reduce image information selectively. This kind of structure has been already employed in simple image sensors for normal cameras, but never in edge detection retina chip. A scaling mechanism is needed due to the different pixel size from circumference to circumference. A mechanism for current scaling in this research is channel width scaling of MOS transistor. The designed chip has been fabricated using standard $1.5{\mu}m$ single-poly double-metal CMOS technology.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.7
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• pp.1541-1547
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• 2005

In this paper, Dualband internal antenna for GSM/DSC handset is proposed. The antenna has a size of about $38mm{\times}90mm{\times}1mm$, giving a total mobile phone PCB for support and fold type patch of about $30mm{\times}8mm{\times}3.2mm$. This antenna characteriatic facilitates the fine-tuning of the two operating frequencies of 909MHz and 1762MHz in the dualband design. The measured radiation pattern in the E-plane and H-plane for operating frequencies of 909MHz and 1762MHz is compared and analyzed. The designed and fabricated two band internal antenna for GSM/DSC handset have a gain between 0dBi and 2.0dBi at all bands. Also, the electric firld distribution and directivity on human head caused by portable phone is analyzed. An analysis model is composed of a human head model and the antenna mounted on the same ground plane as portable telephone size.

• Journal of the Korean Magnetics Society
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• v.18 no.1
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• pp.43-47
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• 2008

[ $ZnO-Bi_2O_3-Al_2O_3-B_2O_3-SiO_2$ ] nano-glass has been prepared by sol-gel method. The mean particle size was 60.3 nm with narrow size distribution. The nano-galss has been used as a sintering aid for the densification of the NiZnCu ferrites. The ferrite was sintered with nano-glass sintering aids at $840{\sim}900^{\circ}C$, 2 h and the initial permeability, quality factor, density, and saturation magnetization were also measured. The initial permeability of 0.5 wt% nano-glass added toroidal sample for NiZnCu ferrites sintered at $900^{\circ}C$ was 193.3 at 1 MHz. The initial permeability and saturation magnetization were increased with increasing annealing temperature. As a result, $ZnO-Bi_2O_3-Al_2O_3-B_2O_3-SiO_2$ nano-glass systems were found to be useful as sintering aids for multilayer chip inductors.

• Journal of Distribution Science
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• v.22 no.7
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• pp.43-51
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• 2024

Purpose: The primary purpose of this study is to examine the influence of the Technology Acceptance Model (TAM) on the use of mobile money in Indonesia. The acceptance of technology has brought changes to society where the application of technology is aimed at identifying the best solution among the various existing alternatives. There are two types of electronic money: chip-based and server-based electronic money. Server-based electronic money is found on mobile phones. The Indonesian government has encouraged the use of electronic money and launched Less Cash Society to create a secure, efficient, and smooth payment system. Research design, data, and methodology: This study collected quantitative data from users of server-based electronic money through surveys conducted based on the sample size. The data were processed using SEM LISREL 8.70. Results: the results show that each of the TAM's fundamental elements has a significant impact. Perceived ease of use and perceived usefulness are able to encourage attitude toward using and behavioral intention to use towards actual use. Conclusions: The distribution of mobile money has a positive impact on society. Hence, mobile money providers must simplify access-recommendations made to strengthen the acceptance of mobile money via Perceived Ease of Use and Perceived Usefulness.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.243-251
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• 2005

The distribution of temperature of flip chipped device with peripheral solder bump array was measured with variables, such as the locations and geometries of heater, the size of device, the size of passivation opening. The highest temperature was measured with the larger device, $3.0(mm)\times3.0(mm)$, which has the smallest heater at the center of device and the circular passivation opening. For 2 (watts) power input, the device shows the highest temperature of about $110(^{\circ}C)$. In contrast, the smaller device, $1.5(mm)\times1.8(mm)$, shows that of $90(^{\circ}C)$. In addition to the size effect, the increase of passivation opening size decreased the maximum temperature by about $10(^{\circ}C)$. From the measurement, the temperature of device could be controlled with the size and geometry of heater, the size of device and the size and geometry of passivation opening.