• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.147-147
• /
• 2011

High crystalline nonpolar a-plane (11-20) nitride light emitting diodes (LEDs) have been fabricated on r-plane (1-102) sapphire substrates by metalorganic chemical-vapor deposition (MOCVD). The multi-quantum wells (MQWs) active region is consists of 4 periods the nonpolar a-plane InGaN/GaN(a-InGaN/GaN) on a high quality a-plane GaN (a-GaN) template grown by using the multibuffer layer technique. The full widths at half maximum (FWHMs) of x-ray rocking curve (XRC) obtained from phiscan of the specimen that was grown up to nonpolar a-plane GaN LED layers with double crystal x-ray diffraction. The FWHM values were decreased down to 477 arc sec for $0^{\circ}$ and 505 arc sec for $-90^{\circ}$, respectively. After fabricating a conventional lateral LED chip which size was $300{\times}600{\mu}m^2$, we measured the optical output power by on-wafer measurements. N-electrode was made with Cr/Au contact, and ITO on p-GaN was formed with Ohmic contact using Ni/Au followed by inductively coupled plasma etching for mesa isolation. The optical output power of 1.08 mW was obtained at drive current of 20 mA with the peak emission wavelength of 502 nm.

• Journal of the Korean Ceramic Society
• /
• v.50 no.6
• /
• pp.454-459
• /
• 2013

Recently, remote phosphors have been reported for application to white LEDs to provide enhanced phosphor efficiency compared with conventional phosphor-based white LEDs. In this study, a remote phosphor was produced by coating via screen printing on a glass substrate with different numbers of phosphor coating. The paste consists of phosphor, lowest softening glass frits, and organic binders. The remote phosphor could be well controlled by varying the phosphor content rated paste. After mounting the remote phosphor on top of a blue LED chip, CCT, CRI, and luminance efficiency were measured and values of 5300 K, 62, and 117 lm/W were respectively obtained in the 80 wt% phosphor with 3 coating layers sintered at $800^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.25 no.10
• /
• pp.849-856
• /
• 2012

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.10 no.7
• /
• pp.1514-1519
• /
• 2009

We fabricated the GaNLED emitting 400 nm wavelength and improved the optical extraction efficiency by making surface patterns on n-GaN layer and ITO layer above p-GaN. In addition, the light reflection metal under the n and p pad is made and the light reflection metal is installed on the backside of the chip. The light extraction efficiency is increased by 20 % with texturing n-GaN layer and 18% with texturing ITO layer at 20 mA. Compared to planar-surface LED, the light extraction efficiency for surface texturing both n-GaN and ITO is increased by 32% at 20mA.

• Journal of the Korean Chemical Society
• /
• v.50 no.3
• /
• pp.237-242
• /
• 2006

Nowadays, LEDs has been applied to the luminescent devices of various fields because of the invention of high efficient blue chip. Recently, especially, the white LEDs composed of InGaN blue chips and a yellow phosphor (YAG:Ce3+) have been investigated extensively. With the exception of YAG:Ce3+ phosphor, however, there are no reports on yellow phosphor that has significant emission in the 450~470 nm excitation range and this LED system is the rather low color rendering index due to their using two wavelength. Hence, we have attempted to synthesize thiogallate phosphors that efficiently under the long wavelength excitation range in the present case. Among those phosphors, we have synthesized Sr2Ga2S5:Eu2+ phosphor by change the host material of SrGa2S4:Eu2+ which is well known phosphor and we investigated the luminescent properties. In order to obtain the harmlessness and simplification of the synthesis process, sulfide materials and mixture gas of 5 % H2/95 % N2 were used instead of the CS2 or H2S gas. The prepared phosphor shows the yellow color peaking at the 550 nm wavelength and it possible to emit efficiently under the broad excitation band in the range of 300~500 nm. And this phosphor shows high luminescent intensity more than 110 % in comparison with commercial YAG:Ce3+ phosphor and it can be applied for UV LED due to excitation property in UV region.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.22 no.5
• /
• pp.233-240
• /
• 2012

White LEDs (light-emitting diodes) are promising new-generation light sources which can replace conventional lamps due to their high reliability, low energy consumption and eco-friendly effects. This paper briefly reviews recent progress of oxy/nitride host phosphor and quantum dot materials with broad excitation band characteristics for phosphor-converted white LEDs. Among oxy/nitride host materials, $M_2Si_5N_8$ : $Eu^{2+}$, $MAlSiN_3$ : $Eu^{2+}$ M-SiON (M = Ca, Sr, Ba), ${\alpha}/{\beta}$-SiAlON : $Eu^{2+}$ are excellent phosphors for white LED using blue-emitting chip. They have very broad excitation bands in the range of 440~460 nm and exhibit emission from green to red. In this paper, In this review we focus on recent developments in the crystal structure, luminescence and applications of the oxy/nitride phosphors for white LEDs. In addition, the application prospects and current trends of research and development of quantum dot phosphors are also discussed.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.56 no.9
• /
• pp.1638-1642
• /
• 2007

This paper investigated the destruction effect of the semiconductors by impact of high power electromagnetic wave. The experiments is employed as an open-ended waveguide to study the destruction effects on semiconductor using a 2.45 GHz 600 W Magnetron as a high power electromagnetic wave. The semiconductors are located at a distance of $31cm\sim40cm$ from the open-ended waveguide and are composed of a LED drive circuit for visual discernment. Also the chip condition of semiconductor is observed by SEM(Scanning Electron Microscope) analysis. The semiconductor are damaged by high power electromagnetic wave at about 860 V/m. The SEM analysis of the destructed devices showed onchipwire and bondwire destructions. Based on the result, semiconductor devices should have plan to protect the semiconductor devices form high power electromagnetic wave. And the database from this experiment provides the basis for future investigation.

• Journal of the Korean Society for Precision Engineering
• /
• v.16 no.2 s.95
• /
• pp.74-81
• /
• 1999

The integrated chip of optical micro-encoder was fabricated and the feasibility as displacement measurement device was confirmed. The geometry of micro-encoder was designed to utilize the optical interference effect on the second order of diffracted beams. The hybrid-type micro-encoder consisted with light emitting diode, photodiode, polyimide wave-guide and micro-lens provides stable micro-encoding results for high speed displacements. The measurement shows the resolution of displacement of 1.00 +/- 0.02 ${\mu}m$ for the grating with scale pitch of 2.0${\mu}m$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11b
• /
• pp.328-331
• /
• 2001

Color simulation on a portable colorimeter was performed to distinguish quantitatively a chromaticity coordinates on a color guide of a urine strips by using the spectral power distribution of chip LED, the spectral reflectance of printed objects, and the spectral sensitivity of photodiode. The CIE tristimulus values and chromaticity coordinates realized by a colorimeter were modified to be conformable with real color reactions. Experimental results showed a real color in comparison with those obtained by Colorimeter CM2C(Color Savvy).

• Analytical Science and Technology
• /
• v.30 no.1
• /
• pp.49-56
• /
• 2017

Here, we demonstrate surface functionalization of Au chips with 4-(carboxymethyl)aniline (CMA) and amine-terminated polyamidoamine (PAMAM) dendrimers for immobilization of antibodies on the Au surfaces. Use of the functionalization strategy led to high surface density of the immobilized antibodies on the Au chips. Specifically, we found that the functionalization of Au chips with CMA and amine-terminated $6^{th}$ generation PAMAM dendrimers allowed immobilization of immunoglobulin (IgG) antibodies with high surface density, which is 5 times higher than that obtained with Au surfaces functionalized with CMA and ethylenediamine.