• 제목/요약/키워드: chemical reduction process

검색결과 815건 처리시간 0.03초

생활폐기물 소각장 2차 연소로에서 요소용액을 이용한 선택적무촉매환원 공정에 대한 전산유체역학 모사 및 현장 검증 (Computational Fluid Dynamics(CFD) Simulation and in situ Experimental Validation for the Urea-Based Selective Non-Catalytic Reduction(SNCR) Process in a Municipal Incinerator)

  • 강태호;뉘엔 타인;임영일;김성준;엄원현;유경선
    • Korean Chemical Engineering Research
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    • 제47권5호
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    • pp.630-638
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    • 2009
  • 생활폐기물 소각장에서 발생되는 질소산화물($NO_x$)을 저감을 위한 요소용액 이용 선택적 무촉매 환원(SNCR: selective non-catalytic reduction) 상용화 공정에 대하여 전산유체역학(CFD: computational fluid dynamics) 모델을 개발하였고, 이 모델은 현장 실험결과로 검증되었다. 저 농도 일산화탄소와 12% 과잉공기 조건에서 요소와 질소산화물간의 7개 화학반응식과 액적의 증발과정을 포함하는 3차원 난류반응 흐름 CFD 모델은 소각로에 설치된 SNCR 공정의 유체역학 모사를 위하여 사용하였다. 본 SNCR 공정에서는 정면 노즐 1개와 측면 노즐 2개를 사용하여 2차 연소로 내에 요소용액을 공기와 함께 분사하였다. 3개의 노즐에 동일유량으로 NSR=1.8에서 요소용액과 공기를 분사할 경우, 출구온도는 현장 실험값과 모사값이 일치하며, 질소산화물 저감효율은 실험에서는 57%, CFD 모사에서는 59%를 보여주었다. 각 노즐 별 분사유량의 비율을 변화하면서 수행된 CFD 모사 결과에서는 3개의 노즐에 동일 유량을 분사하는 것보다 정면 1개 노즐에 측면노즐 유량의 2배를 분사하는 것이 약 8% 높은 질소산화물저감 효율을 보여주었다.

Oxidative Line Width Reduction of Imprinted Nanopatterns

  • Park, Dae Keun;Kang, Aeyeon;Jeong, Mira;Lee, Jaejong;Yun, Wan Soo
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.650-650
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    • 2013
  • Although imprinted nanopatterns of organic polymer can be modified by the heat treatment [1], it generally requires high process temperatures and is material-dependent since the heat-induced mass loss of the organic polymer is greatly affected by its chemical characteristics. When oxygen is added during the annealing process, one can reduce the process temperature as well as the dependence of the materials. With the oxygen, line width reduction of a polymer (SU-8) patterns could be accomplished at temperature of as low as $250^{\circ}C$ which was not possible in the heat only process. This oxidative line width reduction can be dramatically promoted with the introduction of oxygen plasma. The oxygen plasma, with its highly-reactive oxygen species, vigorously etches away the organic materials, proven to be extremely effective line with reduction method. It is, however, very hard to control the extent and homogeneity of the etching, particularly of very fine patterns. Here, we report an effective and reliable line width reduction method of imprinted nanopatterns by combined plasma and heat treatment. The merits of this process include the reduction of process temperature, time and material-dependence.

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황색종 Bulk건조과정의 송풍량과 건조엽의 화학성분 특성 (Effect of Air Flow on Chemical Properties of Cured Leaves in Bulk Curing Process)

  • 이철환;진정의
    • 한국연초학회지
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    • 제21권2호
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    • pp.182-187
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    • 1999
  • A bulk curing experiment was carried out to evaluate the effect of air flow reduction in the bulk barn from color fixing stage in the chemical properties of cured leaves, The air flow was controlled by reducing air velocity of a blower from 0.3m/sec to 0.2m/sec using a boltage regulator(Slidac). The bulk curing before color fixing stage was processed in the conventional curing method. Reduction of air circulation in bulk barn did not affected so much on change of the contents of the main chemical components in cured leaved, such as nicotine, total sugar, total nitrogen, petroleum ether extract, and organic acids. Only a slight increase in essential oil contents, such as solanone, damascenone, damascone, $\beta$-ionone, and megastigmatrienone isomer, could be observed in leaves cured in the reduced air flow.

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Electro-Chemical Reduction에 의한 $Hg_{1-x}Cd_{x}$Te재료의 특성 고찰 (A Research of the Characteristics of $Hg_{1-x}Cd_{x}$Te material by using Electro - Chemical Reduction)

  • 이상돈;김봉흡;강형부
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1994년도 춘계학술대회 논문집
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    • pp.38-41
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    • 1994
  • The method of passivation for protecting the $Hg_{1-x}Cd_{x}$Te surface is important device fabrication process. Because the surface components are highly reactive leading to its chemical and electrical instability. Especially. the material of detecting for infrared radiation, of which composition is x=0.2 or 0.3, is narrow bandgap semi- conductor. The narrow bandgap semi conductors are largely governed by the properties of the semiconductor surface. The narrow bandgap semi-conductors are largely governed by the properties of the semiconductor surface. The electro-chemical processing of $Hg_{1-x}Cd_{x}$Te allows rigorous control of the surface chemistry and provides an in-suit monitor of surface reaction. So electro-chemical reduction at specific potential can be selectively eliminated the undesirable species on the surface and mainpulated to reproducibly attain the desired stoichiometry. This method shows to assess the quality of chemically treated good $Hg_{1-x}Cd_{x}$Te surface.

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화학제염공정에서 환원공정조건에 따른 Inconel 600의 부식손상 특성 (Corrosion Damage Characteristics of Inconel 600 with Reduction Conditions in Chemical Decontamination Process)

  • 한민수;정광후;양예진;박일초;이정형;김성종
    • 한국표면공학회지
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    • 제50권5호
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    • pp.332-338
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    • 2017
  • In this study, we evaluated tendency and degree of corrosion damages of Inconel 600 after chemical decontamination treatments under three different conditions. In the decontamination processes, the oxidation and reduction were performed as one cycle. Each process was continued up to 5 cycles. Characteristics of corrosion under decontamination processes were evaluated by Tafel analysis and weight loss. Characteristics of surface damage were observed by scanning electron microscope(SEM) and three-dimensional(3D) microscope. As the cycle proceeded, weight loss and corrosion current density increased. Intergranular corrosion damage occurred on the surface of the materials. The result revealed that the surface of Inconel 600 was attacked by the strong acid solution under all chemical decontamination processes, but the degree of the corrosion damage was different depending on the processes.

Effect of Electrochemical Oxidation-Reduction Cycles on Surface Structures and Electrocatalytic Oxygen Reduction Activity of Au Electrodes

  • Lim, Taejung;Kim, Jongwon
    • 대한화학회지
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    • 제60권5호
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    • pp.310-316
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    • 2016
  • Oxidation-reduction cycling (ORC) procedures are widely used for cleaning nanoparticle surfaces when investigating their electrocatalytic activities. In this work, the effect of ORC on the surface structures and electrocatalytic oxygen reduction activity of Au electrodes is analyzed. Different structural changes and variations in electrocatalysis are observed depending on the initial structure of the Au electrodes, such as flat bulk, nanoporous, nanoplate, or dendritic Au. In particular, dendritic Au structures lost their sharp-edge morphology during the ORC process, resulting in a significant decrease in its electrocatalytic oxygen reduction activity. The results shown in this paper provide an insight into the pretreatment of nanoparticle-based electrodes during investigation of their electrocatalytic activities.

화학반응 공정에서의 공정조건 및 허용차설계 (Parameter and Tolerance Designs of the Chemical Reaction Process)

  • 안종석;윤원영
    • 품질경영학회지
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    • 제30권1호
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    • pp.97-117
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    • 2002
  • We apply Taguchi method to the process optimization problem of chemical reaction process, and some case studies are done to find out the way for cost reduction and quality improvement The parameter and tolerance designs of Taguchi mettled are done with operation data of a chemical process and we propose a procedure how to use and analyze the operation data to find the optimal process conditions and tolerance limits. In order to use the continuous values in experiment conditions, it is suggested how to determine the interval of each level by discrete values and to treat any missing values caused from discrete 4 levels.

Electrochemical Reduction of SiO2 Granules to One-Dimensional Si Rods Using Ag-Si Eutectic Alloy

  • Lee, Han Ju;Seo, Won-Chul;Lim, Taeho
    • Journal of Electrochemical Science and Technology
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    • 제11권4호
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    • pp.392-398
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    • 2020
  • Producing solar grade silicon using an inexpensive method is a key factor in lowering silicon solar cell costs; the direct electrochemical reduction of SiO2 in molten salt is one of the more promising candidates for manufacturing this silicon. In this study, SiO2 granules were electrochemically reduced in molten CaCl2 (850℃) using Ag-Si eutectic droplets that catalyze electrochemical reduction and purify the Si product. When Ag is used as the working electrode, the Ag-Si eutectic mixture is formed naturally during SiO2 reduction. However, since the Ag-Si eutectic droplets are liquid at 850℃, they are easily lost during the reduction process. To minimize the loss of liquid Ag-Si eutectic droplets, a cylindrical graphite container working electrode was introduced and Ag was added separately to the working electrode along with the SiO2 granules. The graphite container working electrode successfully prevented the loss of the Ag-Si eutectic droplets during reduction. As a result, the Ag-Si eutectic droplets acted as stable catalysts for the electrochemical reduction of SiO2, thereby producing one-dimensional Si rods through a mechanism similar to that of vapor-liquid-solid growth.

중성 및 알카리성수용액에서 Cupferron 의 전극환원메카니즘 (Mechanism of the Electrode Reduction of Cupferron in Neutral and Alkaline Media)

  • 황금소;황정의
    • 수산해양기술연구
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    • 제11권1호
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    • pp.32-55
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    • 1975
  • The ammonium salt of N-Nitrosophenylhydroxiamine, namely Cupferron, is a well-known analytical reagent which precipitates a great number of metal ions in acid medium. Various structures of electrode reduction for N-Nitrosophenylhydroxiamine have been suggested in acid and alkaline media by many researchers, but not in neutral medium. So the mechanism of electrode reaction of Cupferron was investigated by both chronopotentiometric and polarographic methods. It was estimated that the reduction of Cupferron occurs in a three-step mechanism through which a chemical step is interposed between two charge transfer, the ECE (charge transfer-chemical reaction-charge transfer) mechanism, over a range of neutral and alkaline media. The chemical reaction of the process was assumed to be acid-base catalyzed from the fact that kapp (over all rate constant) of chemical reaction is pH dependent.

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아세토니트릴 용매 중에서 Copper-1-(2-Thiazolylazo)-2-naphthol 착물의 전기화학적 거동 (Electrochemical Behaviors of Copper-1-(2-Thiazolylazo)-2-naphthol Complex in Acetonitrile)

  • 배준웅;이흥락;박태명;서무룡
    • 대한화학회지
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    • 제35권4호
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    • pp.405-409
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    • 1991
  • 비양성자성용매인 아세토니트릴 중에서 Copper-1-(2-thiazolylazo)-2-naphthol(이하 Cu(II)-TAN으로 줄임) 착물의 전기화학적 성질을 조사하였다. 착물의 직류폴라로그램으로부터 환원전류의 유형과 가역성 및 양성자 주게인 물의 첨가에 따른 영향을 검토하였다. 그리고 환원반응에 관여한 전자수는 일정전위 전기분해법으로 구하였다. 또 일정전위 전기분해한 전해생성물의 UV-Vis Spectrum으로부터 전해생성물을 확인하였다. 이상의 실험 결과로부터 아세토니트릴 용매 중에서 Cu(II)-TAN 착물은 3단계의 환원과정을 거쳐 최종적으로 아민화합물이 됨을 알았다. 이 때 1단계 환원과정에서는 anion radical이 생성되는 과정이고, 2단계 환원과정에서는 dianion이 생성되는 과정이다. 또 1단계와 2단계의 환원과정은 모두 가역성이 좋은 편이었으나 3단계 환원과정은 가역성이 매우 나쁜 편이었다. 또한 각 단계의 환원전류는 확산지배적이었다.

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