• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.78-79
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• 2003

• Polymer Science and Technology
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• v.26 no.3
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• pp.232-237
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• 2015

• Journal of Electrochemical Science and Technology
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• v.13 no.4
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• pp.504-504
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• 2022

• Journal of Sensor Science and Technology
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• v.33 no.1
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• pp.40-47
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• 2024

The creation of vertically aligned one-dimensional (1D) nanostructures through the decoration of n-type tin oxide (SnO₂) on p-type chromium oxide (Cr₂O₃) constitutes an effective strategy for enhancing gas sensing performance. These heterostructures are deposited in multiple stages using a glancing angle deposition technique with an electron beam evaporator, resulting in a reduction in the surface porosity of the nanorods as SnO₂ is incorporated. In comparison to Cr₂O₃ films, the bare Cr₂O₃ nanorods exhibits a response 3.3 times greater to 50 ppm H₂S at 300℃, while the SnO₂-decorated Cr₂O₃ nanorods demonstrate an eleven-fold increase in response. Furthermore, when subjected to various gases (CH₄, H₂S, CO₂, H₂), a notable selectivity toward H₂S is observed. This study paves the way for the development of p-type semiconductor sensors with heightened selectivity and sensitivity towards H₂S, thus advancing the prospects of gas sensor technology.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.242-242
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• 2012

Transparent oxide semiconductors are increasingly becoming one of good candidates for high efficient channel materials of thin film transistors (TFTs) in large-area display industries. Compare to the conventional hydrogenated amorphous silicon channel layers, solution processed ZnO-TFTs can be simply fabricated at low temperature by just using a spin coating method without vacuum deposition, thus providing low manufacturing cost. Furthermore, solution based oxide TFT exhibits excellent transparency and enables to apply flexible devices. For this reason, this process has been attracting much attention as one fabrication method for oxide channel layer in thin-film transistors (TFTs). But, poor electrical characteristic of these solution based oxide materials still remains one of issuable problems due to oxygen vacancy formed by breaking weak chemical bonds during fabrication. These electrical properties are expected due to the generation of a large number of conducting carriers, resulting in huge electron scattering effect. Therefore, we study a novel technique to effectively improve the electron mobility by applying environmental annealing treatments with various gases to the solution based Li-doped ZnO TFTs. This technique was systematically designed to vary a different lithium ratio in order to confirm the electrical tendency of Li-doped ZnO TFTs. The observations of Scanning Electron Microscopy, Atomic Force Microscopy, and X-ray Photoelectron Spectroscopy were performed to investigate structural properties and elemental composition of our samples. In addition, I-V characteristics were carried out by using Keithley 4,200-Semiconductor Characterization System (4,200-SCS) with 4-probe system.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.4
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• pp.179-184
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• 2003

The pulsed power system is widely used for many industries and environments. Generally, we call the "RUST", the reddish brown surface, that was made on iron surface or some other metals, when they are contacted by water and air the main substance of rust is oxide-ionization. In other words, the chemical symbol of rust on iron surface is iron oxide(III) hydrate Fe203.nH2O. In this study, we have designed and fabricated our system which has a compact pulse generator with switching MOSFET. Also we have studied the metal-oxide removing characteristics using in the atmospheric arc discharge. It has been investigated their removing characteristics by the change of charging voltage and pulse repetition rates. From this result, we can find out that the removal area Is increased from 3.80 to 8.04[$\textrm{cm}^2$], when pulse duration is increased from 100[pps] to 400[pps]. 400[pps].

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.12
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• pp.1003-1010
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• 2000

Thin films of vanadium oxide(VOx) have been deposited by r.f. magnetron sputtering from V$_2$O$\_$5/ target in gas mixture of argon and oxygen. Crystal structure, surface morphology, chemical composition, molecular structure and optical properites of films in-situ annealed in O$_2$ambient with various heat-treatment conditions are characterized through XRD, SEM, AES, RBS, RTIR and optical absorption measurements. The films annealed below 200$\^{C}$ are amorphous, and those annealed above 300$\^{C}$ are polycrystalline. The growth of grains and the transition of vanadium oxide into the higher oxide have been observed with increasing the annealing temperature and time. The increase of O/V ratio with increasing the annealing temperature and time is attributed to the diffusion of oxygen and the partial filling of oxygen vacancies. It is observed that the oxygen atoms located on the V-O plane of V$_2$O$\_$5/ layer participate more readily in the oxidation process. Also indirect and direct optical band gaps were increased with increasing the annealing temperature and time.

• Korean Journal of Materials Research
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• v.9 no.5
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• pp.491-495
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• 1999

In this study, we focus on Ca contaminant which affects on the roughness Si substrate after thermal process. The initial Si substrates were contaminated intentionally by using a standard Ca solution. The contamination levels of Ca impurity were measured by TXRF and the chemical composition of that was analyzed by AES. Then we gre the thermal oxide to investigate the effect of Ca contaminants. The microroughness of the Si surface, the thermal oxide surface, and the surface after removing the thermal oxide were measured to examine the electrical characteristics. The initial substrates that were contaminated with the standard solution of Ca exhibited the contamination levels of 10\ulcorner~10\ulcorneratoms/$\textrm{cm}^2$ which was measured by TXRF. The Ca contaminants were detected by AES and exhibited the peaks of Ca, SI, C and O.After intentional contamination, the surface microroughness of this initial substrate was increased from $1.5\AA$ to 4$\AA$ as contamination levels became higher. The microroughness of the thermal oxide surfaces of both contaminated and bare Si substrates exhibits similar values. But the microroughness of the contaminated$ Si/SiO_2$ interface was increased as contamination increased. The thermal oxide of contaminated substrate exhibited the small minority carrier diffusion length, low breakdown voltage, and slightly high leakage current.

• Journal of the Korean Electrochemical Society
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• v.5 no.2
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• pp.43-46
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• 2002

Commercial titanium rod was anodized in three types of electrolytes such as 0.06 mol/L $\beta-glycerophosphate+0.3mol/L$ calcium acetate, 0.06mol/L $\beta-glycerophosphate+0.3mol/L$ sodium acetate and 0.06 mol/L $\beta-glycerophosphate+5mol/L$ calcium phosphate. The titanium oxide layer $(TiO_2)$ was characterized by scanning electron microscope (SEM), X-ray diffraction (XRD) and electron spectroscopy chemical analysis (ESCA). Numerous micropores were observed on the titanium oxide layer by SEM. The diameter of micropores increased with the increase of electrolytic voltage. The titanium oxide layer was composed of anatase structure. The phosphorous element was detected at 130 eV binding energy, but calcium was not found in the oxide layer because of lower contents. After anodizing the oxide layer was etched in the 30g/L NaOH solution at $80^{\circ}C$ for 1hr. The surroundings of micropores were much more smoothed and rounded than before alkaline etching.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.331-334
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• 1997

The electrical and physical charateristics of aluminum oxide and Pt thin films on it, deposited by reactive sputtering and DC magnetron sputtering, respectively, were analysed with increasing annealing temperature(400~80$0^{\circ}C$) by four point probe, SEM and XRD. Under $600^{\circ}C$ of annealing temperature, aluminum oxide had the properties of improving Pt adhesion to SiO$_2$and insulation without chemical reaction to Pt thin films and the resistivity of Pt thin finns was improved. But these properties of aluminum oxide and Pt thin finns on it were degraded over $700^{\circ}C$ of annealing temperature because aluminum oxide was changed into metal aluminum and then reacted to Pt thin films deposited on it. The thermal characteristics of Pt micro heater were analysed with Pt-RTD integrated on the same substrate. In the analysis of properties of Pt micro heater. active area was smaller size, Pt micro heater had better thermal characteristics. Temperature of Pt micro heater fabricated on membrane was up to 34$0^{\circ}C$ with 1.2watts of the heating power due to reduction of the external thermal loss.