• 제목/요약/키워드: cathodic electrodeposition

검색결과 34건 처리시간 0.02초

해수 중 펄스 전착 프로세스 의해 제작한 석회질 피막의 결정구조 제어 및 특성 평가 (Crystal Structure Control of Calcareous Deposit Films Formed by Pulse Electrodeposition Process in Seawater and Their Properties)

  • 박준무;이승효
    • 한국표면공학회지
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    • 제52권2호
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    • pp.103-110
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    • 2019
  • As an anti-corrosion method in seawater, cathodic protection is widely recognized as the most effective and technically appropriate corrosion prevention methodology for marine structures against harsh corrosive environment. When applying the cathodic protection in seawater, the surface of the metal facilities the formation of compounds of $CaCO_3$ and $Mg(OH)_2$. These mixed compounds are generally called 'calcareous deposits'. This layer functions as a barrier against the corrosive environment and functions to further inhibit the corrosion process and then leading to a decrease in current demand for cathodic protection. However, calcareous deposit films are partially formed on the surface of the cathode and there are some difficulties to maintain both a corrosion resistance for a long period of time and a strong adhesion between deposits and base metal. In this study, the pulse electrodeposition process was applied to improve adhesion and corrosion resistance of the calcareous deposit films, and to solve the problem of hydrogen embrittlement at high current density. The uniform and compact calcareous deposit films were prepared by pulse electrodeposition process, and their properties were characterized using various surface analytical techniques together with electrochemical methods.

염화인-아세트산-숙신산 염 용액에서 납의 전해석출 (Electrodeposition of lead from $PbCl_2$-Acetate-Succinate Solutions)

  • 강탁
    • 한국표면공학회지
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    • 제19권2호
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    • pp.44-50
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    • 1986
  • Effects of cathodic overvoltages on the electrodeposition of lead from electrolyte containing lead chloride, ammonium acetate and sodium succinate was investigated at 20$^{\circ}C$. The use of organic additives, phenol and gelatin was found effective to inhibit the growth of dendritic crystals. At the carthodic overvoltages higher than 0.2V, the lead deposit becames less compact even in the presence of organic additives. The applications of agitation and pulse current promoted compact and shiny deposits.

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황산크륨(III) 착화합물 스용액으로부터의 크롬전착반응의 전기화학적 거동 (Electrochemical Behaviors of Chromium Electrodeposition from Chromium(III) Sulfate complexes Aqueous Solutions)

  • 고석수;송진태
    • 한국표면공학회지
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    • 제21권4호
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    • pp.160-167
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    • 1988
  • Electrochemical behaviors od chromium electrodeposition from 0.05M chromium (III) sulface complexes in aqueous solutions using sodium formate-glycine mixtures as a complexing agent were studied. In the cathodic current-potential cures, it is found that the intial limiting current of Cr(III) is proportional to square root of scan rate and activiation energy from Arrhenius plot is s obtained 3.05Kcal/mol. From this results, the reaction is considered, Cr3++e longrightarrow Cr2+, which is controlled diffusion of Cr (III). It is also found that the chromium is deposited when the potential reaches to hydrogen evolution potential. Effects of NaSCN as a catalyser in the electrolyte were investigated NCS- anion seems to react strongly by specific absorption at the inner HelmholtZ layer, so that, it is considered to suppress the electrodeposition reaction reaction for chromjum, and also it is considered multipe-bridge such as Cr(III)-NCS---M(M;cathode).

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아연 전기도금의 전착성에 미치는 폴리에틸렌글리콜(polyethyleneglycol)의 영향 (The effect of polyethypeneglycol on the electrocrystallization of Zn electrodeposition)

  • 김현태;김태엽;이재륭;장삼규
    • 한국결정성장학회지
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    • 제9권6호
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    • pp.590-596
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    • 1999
  • 염화물욕 아연도금에서 순환셀 도금장치에 3전극계를 부착하여 첨가제 효과를 조사하였다. 도금액에 폴리에틸렌글리콜(이하 PEG)의 첨가는 도금 과전압을 증가시키고 수소발생을 억제하는데 이것은 첨가제에 의하여 아연 이온의 이동을 억제하거나 음극에 첨가제 흡착에 의한 것으로 생각된다. 그러나 PEG는 사용되는 도금액의 물성(전도도, 점도, 비중)에는 영향을 미치지 않는 것으로 나타났다. 도금층에 미치는 영향은 표면 조도가 개선되고, 광택도가 감소된다. 이러한 영향은 PEG 분자수가 클수록 증가되나 분자수가 다른 PEG의 혼합첨가제에서는 광택도 감소가 줄어든다. 이러한 것은 도금층 결정면의 방향성, 입자의 크기 및 형태가 PEG 분자 수에 따라 다르게 나타나는 것에 기인하는 것으로 판단된다.

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자동차용 에폭시계 양이온형 전착도료의 내식성에 대한 연구 (Corrosion Behavior of Cathodic Electrodeposited Epoxy Based Coating for Automotive Primer)

  • 이승엽;이종무;곽삼탁;문명준;서차수
    • 공업화학
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    • 제16권2호
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    • pp.250-256
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    • 2005
  • 자동차 산업에서의 도장 외관은 아주 중요하다. 이러한 도장외관의 향상을 위해서 기본적으로 도막의 내식성과 밀착성이 해결되어야 한다. 도막의 물성의 향상을 위해서 금속의 화성피막은 매우 중요한 요소가 되고 있다. 전착도장 중 음극에서의 pH는 12 정도까지 증가하고, 이 같은 강알카리 조건에서 금속과 화성피막의 용해가 일어난다. 이 같은 현상의 화성피막과 소재사이의 결합력을 감소시키게 된다. 일반적으로 인산염 피막구조는 hopeite 및 phosphphylife 구조를 갖지만 hopeite 피막 구조보다는 phosphophyllite 피막구조가 내식성이 보다 우수하고, 양이온 전착도료에 의한 전착도장에서 강알카리화된 계면에서 피막의 알카리 용해성이 적어 내수밀착성의 향상을 보인다. Ni, Mn 등의 보조금속의 첨가는 P-ratio (phosphophyllite/ hopeite + phosphophyllite)를 증가시키므로 내수 밀착성과 내식성을 향상시키게 됨을 알 수 있었다.

전해도금법을 이용한 SnO2 제조 및 후 열처리가 전지 특성에 미치는 영향 (Preparation of SnO2 Film via Electrodeposition and Influence of Post Heat Treatment on the Battery Performances)

  • 김령희;권혁상
    • 열처리공학회지
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    • 제30권2호
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    • pp.61-66
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    • 2017
  • $SnO_2$ was electrodeposited on nodule-type Cu foil at varing current density and electrodeposition time. Unlike the previous research results, when the anodic current is applied, the $SnO_2$ layer was not electrodeposited and the substrate is corroded. When the cathodic current was applied, the $SnO_2$ layer could be successfully deposited. At this time, the surface microstructure of the powdery type was observed, which showed similar crystallinity to amorphous and had a very large surface area. Crystallinity increased after low-temperature heat treatment at $250^{\circ}C$ or lower. As a result of evaluating the charge/discharge performances as an anode material for lithium ion battery, it was confirmed that the capacity of the heat treated $SnO_2$ was increased more than 2 times, but it still showed a limit point showing initial low coulombic efficiency and low cyclability. However, it was confirmed that the battery performances may be enhanced through optimizing the electrodeposition process and introducing post heat treatment.

Electrodeposition of Copper on AZ91 Mg Alloy in Cyanide Solution

  • Nguyen, Van Phuong;Park, Min-Sik;Yim, Chang Dong;You, Bong Sun;Moon, Sungmo
    • 한국표면공학회지
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    • 제49권3호
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    • pp.238-244
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    • 2016
  • Copper electrodeposition on AZ91 Mg alloy was studied in views of preferential deposition on ${\alpha}$- or ${\beta}$- phases and how to achieve uniform deposition over the entire surface on ${\alpha}$- and ${\beta}$-phases in a cyanide solution. The inhomogeneous microstructure of AZ91 Mg alloy, particularly ${\alpha}$- and ${\beta}$-phases, was found to result in non-uniform deposition of zincate layer, preferential deposition of zincate on ${\beta}$-phases, which leads to non-uniform growth of copper layer during the following electrodeposition process. The preferential depositions of zincate can be attributed to higher cathodic polarizations on the ${\beta}$-phases. Pin-hole defects in the copper electrodeposit were observed at the center of large size ${\beta}$-phase particles which is ascribed to gas bubbles formed at the ${\beta}$-phases. The activation of AZ91 Mg alloy in hydrofluoric acid solution was used to obtain uniform growth of zincate layer on both the ${\alpha}$- and ${\beta}$-phases. By choosing an optimum activation time, a uniform zincate layer was obtained on the AZ91 Mg alloy surface and thereby uniform growth of copper was obtained in a cyanide copper electroplating solution.