Cu Plating Thickness Optimization by Bottom-up Gap-fill Mechanism in Dual Damascene Process (Dual Damascene 공정에서 Bottom-up Gap-fill 메커니즘을 이용한 Cu Plating 두께 최적화)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2005.07a
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- pp.93-94
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- 2005